[1] C. G. Shirley and S. W. Wilkins, "Many-site Correlations and Interactions in Disordered Binary Alloys," Physical Review, Vol. B6, pp. 1252-1263, 1972
[2] L. E. Thomas, C. G. Shirley, J. S. Lally, and R. M. Fisher, "The Critical Voltage Effect and Its Applications," in High Voltage Electron Microscopy, edited by P. R. Swan et al., Academic, pp. 38-47, 1974.
[3] C. G. Shirley "Correlations and Interactions in Disordered Binary Alloys with Atomic Radius Disparity," Physical Review, Vol. B10, pp. 1149-1159, 1974. (PhD thesis work.)
[4] C. G. Shirley, J. S. Lally, L. E. Thomas and R. M. Fisher, "High Voltage Electron Diffraction Measurement of the Debye Temperatures of Cr, alpha-Fe and their Disordered Alloys," Acta Crystallographica, Vol. A31, pp. 174-177, 1975.
[5] C. G. Shirley, "A Simple Interpolation Formula for the Debye Temperatures of Disordered Alloys," Acta Crystallographica, Vol. A31, pp. 853-854, 1975.
[6] S. W. Wilkins and C. G. Shirley, "A General Approach to the Statistical Mechanics of Disordered Binary Alloys – Theory and Applications," Journal of Applied Crystallography, Vol. 8 Part 2, pp. 107-111, 1975.
[7] C. G. Shirley and S. W. Wilkins "Disordered Binary Alloys II - Decoupling Schemes for Many-Site Correlation Functions," Physical Review, Vol. B16, pp. 3484-3488, 1977.
[8] C. G. Shirley, "Alloy Grain Boundary Drag," Acta Metallurgica Vol. 26, pp. 391-404, 1978.
[9] C. G. Shirley and R. M. Fisher, "Atomic Mean-Square Displacements and the Critical Voltage Effect in Cubic Solid Solutions," Philosophical Magazine, Vol. A39, pp. 91-117, 1979.
[10] C. G. Shirley and W. M. Paulson, "The Pulse-Degradation Characteristic of ZnO Varistors," J. Appl. Phys., Vol. 50, pp. 5782-5789, 1979.
[11] C. G. Shirley and R. M. Fisher, "Application of the Critical Voltage Effect to Alloy Studies," in Proceedings of 6th International Conference on High-Voltage Electron Microscopy, , Antwerp, Belgium. September 1-3 1980.
[12] R. M. Fisher and C. G. Shirley, "The Critical Voltage Effect in High-Voltage Electron Microscopy," Journal of Metals, pp. 26-30, March 1981
[13] C. G. Shirley, "A Computer-Controlled CV Characterization System," Semiconductor International, pp. 81-92, July 1982.
[14] A. Fox and C. G. Shirley, "Structure Factors and the Critical Voltage Effect in Ordered B2 Alloys: I," J. Phys. F: Metal Physics, Vol. 13, pp. 1581-1592, 1983.
[15] C. G. Shirley, "High-Field Phenomena in Thermal SiO2," J. Electrochem. Soc., Vol. 132, pp. 488-500, 1985.
[16] C. G. Shirley, "Steady-State Temperature Profiles in Narrow Thin-Film Conductors," J. Appl. Phys., Vol. 57, pp. 777-784, 1985.
[17] C. G. Shirley and R. C. Blish II, "Thin-Film Cracking and Wire-Ball Shear in Plastic DIPs due to Temperature Cycle and Thermal Shock," in Proceedings of 25th Annual International Reliability Physics Symposium, pp. 238-249 April, 1987
[18] T. Corbett and C. G. Shirley, "Contact Resistivity of Silver-Filled Glass Adhesive," Proceedings International Electronic Packaging Society, Boston, MA, pp. 733-749, November 1987.
[19] C. G. Shirley and S. Gupta, "A Technique for Electrical Measurement of Ball Bond Location," Proc. 38th Ann. Electronic Components Conference, May 1988.
[20] C. G. Shirley and S. M. Maston, "Electrical Measurements of Moisture Penetration through Passivation," in Proceedings of 28th Annual Reliability Physics Symposium, pp. 72-80, 1990
[21] C. G. Shirley, "Optimal Acceleration of Cyclical THB Tests for Plastic-Packaged Devices," in Proceedings of 29th Annual Reliability Physics Symposium, pp. 12-21, 1991.
[22] C. Glenn. Shirley, "Building in Reliability for Packaging and Assembly," in Wafer Level Reliability Workshop, Final Report pp. 57-68 1992.
[23] C. G. Shirley and M. Shell-DeGuzman, "Moisture-Induced Gold Bond Degradation of Polyimide-Passivated Devices in Plastic Packages," in Proceedings of 31st Annual Reliability Physics Symposium, pp. 217-226, 1993.
[24] C. G. Shirley, "THB Reliability Models and Life Prediction for Intermittently-Powered Non-Hermetic Components," in Proceedings of 32nd Annual Reliability Physics Symposium, pp. 72-78, 1994.
[25] Chen Gu, Robert F. Kwasnick, Neal R. Mielke, Eric M. Monroe, C. Glenn Shirley, “Ambient Use-Condition Models for Reliability Assessment” in Proceedings of 44th Annual Reliability Physics Symposium, pp. 299-306, 2006.
[26] W. Robert Daasch, C. Glenn Shirley, Amit Nahar, “Statistics in Semiconductor Test: Going Beyond Yield,” in IEEE Design and Test of Computers, pp. 64-73 September/October 2009.
[27] C. Glenn Shirley, “Popcorn Cavity Pressure,” in IEEE Transactions on Device and Materials Reliability, Vol. 14 No. 1 pp. 426-431, March 2014.
[28] C. Glenn Shirley, W. Robert Daasch “Copula Models of Correlation: A DRAM Case Study,” in IEEE Transactions on Computers, Vol. 63 No. 10 pp. 2389-2401, October 2014.
[29] C. Glenn Shirley, W. Robert Daasch, Phil Nigh, Zoe Conroy, “Board Manufacturing Test Correlation to IC Manufacturing Test,” in International Test Conference, Paper 21.3 20-23 October 2014. (Presentation slides.)
[30] Bryan D. Boatright, Ben J. Eapen, Glenn Shirley, Carl Scafidi, “Methods and Apparatuses for Reducing Infant Mortality in Semiconductor Devices using Static Random Access Memory,” U.S. Patent No. 7,197,670 B2 March 27, 2007.
[31] C. Glenn Shirley, W. Robert Daasch, "Copula-Based System and Method for Management of Manufacturing Test and Product Specification Throughout the Product Lifecycle for Electronic Systems or Integrated Circuits," U.S. patent No. 9,052,358 B2 June 9, 2015.
[32] A. Szirmae, C. G. Shirley and R. M. Fisher, "Electron Optical Studies of Catalyzed Gasification of Graphite," in 35th Ann. Proc. Electron Microscopy Society of America, Boston, Mass. 1977.
[33] C. G. Shirley and S. Bose, invited to contribute the packaging section of the course "Microelectronic Test Structures for VLSI Development and Manufacturing," Course sponsored by the University of California, Berkeley Extension, March 27-28, 1986.
[34] C. G. Shirley, Package Reliability section of IEEE Teleconference, "High-Performance VLSI Packaging", September, 1987.
[35] C. G. Shirley, invited to co-organize and contribute to "Advanced VLSI Packaging". a 3-day Course sponsored by the University of California, Berkeley Extension, January 26-28, 1987. Repeated in January, 1988.
[36] C. Glenn Shirley “A Defect Model of Reliability,” invited Tutorial at 33rd Annual International Reliability Physics Symposium, including supplemental paper. Las Vegas, Nevada, pp. 3.1 - 3.56, 1995.
[37] C. G. Shirley, J. T. Mc Cullen, S. J. Huber, invited courses at Electronic Components and Technology Conference (ECTC): "Component Reliability," 1994, 1995, and 1996.
[38] C. Glenn Shirley, “Infant Mortality Control,” invited Tutorial at 40th Annual Reliability Physics Symposium, including supplementary material: C. Glenn Shirley, “Defect Reliability Statistics with Redundancy,” 2002.
[39] C. Glenn Shirley, “Infant Mortality Control by Burn-In and by Design,” invited presentation at International Solid-State Circuits Conference (ISSCC), February 2003.
[40] C. Glenn Shirley, "Plastic Package Reliability," invited webinar for ASQ Reliability Division, August 2-4 2011. Slides. Video Part 1. Video Part 2. Video Part 3.
[41] R. M. Fisher, C. G. Shirley, A. Szirmae, J. V. Mahoney, F. C. Schwerer, “Studies of Fundamental Factors Controlling Catalyzation of Reactions of Gases with Carbonaceous Solids,” Progress Report by U. S. Steel Corporation submitted to Division of Physical Research, ERDA Washington D. C. Research Contract No. E (11-1)-2933, April 1977.
[42] C. Glenn Shirley, “New Generation HAST System,” Non-proprietary Report to Intel, Despatch Industries, and Micro-Instrument Corp. describing learnings during development of NG HAST. December, 1994.
[43] JEDEC Standard No. 22-A101 Test Method A101. “Steady-State Temperature Humidity Bias Life Test (85/85),” 1996.
[44] JEDEC Standard No. 22-A110 Test Method A110. “Highly-Accelerated Temperature and Humidity Stress Test (HAST),” 1996.