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Sung YiMailing AddressMechanical and Materials Engineering DepartmentPortland State University Post Box 751 Portland, Oregon 97207-0751 Fax: (503) 725-8255 Phone: (503) 725-5470 Email: syi@pdx.edu OfficeEngineering BuildingPortland State University 1930 SW 4th Avenue Portland, OR 97201-5304 USA (View in Google Maps) |
EDUCATIONPh.D. 1992 University of Illinois at Urbana-Champaign, IL, USAM.S. 1987 University of Washington, Seattle, WA, USA B.S. 1982 Hanyang University, Seoul, Korea. At a GlanceCurrently Sung Yi is Professor of Mechanical and Materials Engineering Department at the Portland State University, OR. Previously, he was a faculty member and Head of Engineering Mechanics Division, School of Mechanical Engineering, Nanyang Technological University (NTU), Singapore. He was also a Singapore-MIT Alliance Fellow from 1998 to 2002. From 2006 to 2009, he served as Vice President at Manufacturing Engineering, R&D Institute, Samsung Electro-Mechanics, Korea.At Samsung, he has been privileged to build a brand new Microelectronic Packaging Team. The mission of the Packaging Team is generating creative microelectronics packaging technology and providing total packaging solutions for all products. The team is focusing on core future technology and it's incubation. This approach makes the company have more aggressive R&D culture. He and his team developed several advanced electronic and MEMS packaging technologies including embedding active devices and passives into organic substrates, the world's smallest saw filter using wafer level packaging, ALOX high thermal dissipation substrate technology for power devices and LED devices, 3-D advanced packaging technology, etc. The embedding IC into substrate technology received the Samsung Technology award in 2008. He has published more than 250 papers in various journals and conference proceedings and his work has been well accepted by the industry and academic community. In addition, he holds 22 US patents. He has received over 10 million US dollars research funding as a Principal Investigator from notable sponsors, including National Science Foundation (NSF), National Science and Technology Board (NSTB) Singapore, Korea Institute of Industrial Technology (KITECH), Ministry of Knowledge Economy, Republic of Korea, Samsung, Dow-Corning, Intel, AMOCO Electronics, and Philips. He also has been providing technical consulting services to many companies including Intel, ESI, TriQuint, Cascade Micro-Tech, Maxim Integrated, Samsung, and TESSERA. He has been a member of the Editorial Advisory Board for the Journals of Soldering and Surface Mount Technology since 1998. Additionally, he holds positions as an Editorial Advisory Board member for the Journal of Materials (MDPI) and an Associate Editor for Frontier Materials in Semiconducting Materials and Devices, starting in 2020 and 2024, respectively. His editorial contributions extend to his past roles as an Editorial Board member for the Journal of Finite Elements in Analysis and Design from 2000 to 2004, and as an Associate Editor for ASME: Journal of Electronic Packaging from 2001 to 2004. He is recognized for his significant contributions, having received the 2023 Best Paper Award in IEEE Transactions on Components, Packaging and Manufacturing Technology. Further acknowledgment of his excellence includes the Jefferson Goblet Paper Award at the 32nd AIAA SDM Conference in 1991 and the Roger A. Strehlow Memorial Award from UIUC in 1992. Additionally, he has been honored with the Intel Learning Star Award in 2009 and the Hedong Technology Award in 2007. His dedication and expertise are further demonstrated through his involvement as a conference chair and international advisory committee member for numerous international conferences and symposiums. | |