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The 17th Electronic Materials and Packaging Conference will be held in on September 1-4, 2015, in Portland, Oregon. The former sixteen conferences in Singapore (1999), Hong Kong (2000), and Korea (2001), Taiwan (2002), Singapore (2003), Malaysia(2004), Japan (2005), Hongkong (2006), Korea (2007), Taiwan (2008), Malaysia (2009), Singapore (2010), Japan (2011), Hong Kong (2012), Korea (2013) and Taiwan (2014) were very successful. The committee would like to continue to make this meeting successful. The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. This will also provide an excellent opportunity for researchers and engineers to gather to discuss generic and practical applications and new directions. The Organizing Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. Contributions are very welcome from industry participants and researchers from academic institutions. |