Research Grants

[17] Principal Investigator, Ecosystem for Learning and Team Design, NSF SBIR Phase II, 2016-2018.

[16] Principal Investigator, Ecosystem for Learning and Team Design, NSF SBIR Phase I, FY-2015.

[15] Principal Investigator, Study of Fatigue Life of Aluminum & Titanium Alloys, Korea Institute of Industrial Technology (KITECH), 2016-2019.

[14] Principal Investigator, Study of Microwave Curing of Polymers, Korea Institute of Industrial Technology (KITECH), 2013-2014.

[13] Principal Investigator, Study of Fatigue Life of Lead-free Solder Joints of Ball Grid Array Packages, Intel Cooperation & Oregon Metallurgy Institute, 2013-2014.

[12] Principal Investigator, Development of an Integrated Single Chip Module with Multi Functional Sensors using 3-D Wafer Level Package Process, OKINS ELECTRONICS CO., LTD, 2009-2012.

[11] Principal Investigator, Development of Advanced Packaging Technology for Telecommunications and Broadcasting Conversion Services, Sponsored by Ministry of Knowledge Economy, Republic of Korea, 2008-2011.

[10] Principal Investigator, Analysis of Thermo-mechanical Behavior of PCBs, Intel Cooperation & OMI, 2005-2006.

[9] Principal Investigator, Modeling of BGA Packages, Dow-Corning, 2003-2004.

[8] Principal Investigator, Reliability Testing and Failure Analysis of Microelectronic Devices and Systems, Intel-OUS Engineering & Computer Science Curriculum Fellowships and Student Labs Grant Program, 2002-2003.

[7] Principal Investigator, Study of Mechanical Behaviour of 63Sn37Pb Eutectic Solders under High Strain Rates, Intel Cooperation & Oregon Metallurgy Institute, 2002-2003.

[6] Principal Investigator, 3-D Interferometry Measurement of Deformation of BGAs, Philips, Netherlands, 2002.

[5] Principal Investigator, Development of SMART Laboratories for Micro-mechanical Testing of Semiconductor Materials, Sponsored by Institute of Materials Research and Engineering & NTU, 11/1998-10/2001.

[4] Co-Principal Investigator, Development of A Novel Rubber Toughened Epoxy Molding Compounds, Sponsored by AMOCO Electronics Materials, USA, 4/1998-3/2000.

[3] Principal Investigator, Development of Advanced Manufacturing Process of Plastic IC Packages, Sponsored by Ministry of Education (MOE), 11/1997-10/2000.

[2] Principal Investigator, Studies on Smart Materials and Material Systems for Mechanical Applications, NSTB Strategic Research Project, 1/1997-1/2002.

[1] Principal Investigator, Research and Development of Advanced Engineering Mechanics Technology for Design and Manufacturing of Plastic Encapsulated Integrated Circuits (JT ACR 1/96), Sponsored by Ministry of Education (MOE), 7/1996-7/1999.