Publications (Journals, Conference Proceedings, Chapters in Books)
1. Books, Technical Reports, Journal Special Issue & Conference Proceedings1-1. Edited Journal Special Issues:[3] Special Issue on Recent Studies on the Reliability of Microelectronic Materials and Devices, Sung Yi and Jeong H. Kim, International Journal of Materials and Structural Integrity, Vol.8, 2014. [2] Special Issue on Electronic Materials and Packaging, with D. C. Whalley, P. P. Conway and Sung Yi, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No.3, 2003. [1] Special Issue on Application of Finite Element Analysis in Electronic Packaging, with M. Petch and Sung Yi, Finite Elements in Analysis and Design, Vol. 30, No 1/2, 1998. 1-2. Edited Conference Proceedings:[4] Proceeding of UKC2014 Conference, Sung Yi, (Eds.), 2014. [3] Proceeding of 12th International Conference on Electronics Materials and Packaging, Sung Yi and Paul P. Conway, (Eds.), ISBN-13: 978-1456597832, ISBN-10: 1456597833, 2010. [2] Proceeding of 5th International Conference on Electronics Materials and Packaging, Sung Yi, D. Whalley and K. C. Teo, (Eds.), ISBN: 981-05-0078-5, 2003. [1] Proceeding of 1st International Conference on Electronics Materials and Packaging, Sung Yi and Kerm Sin Chian, (Eds.), 1999. 1-3. Book & Technical Reports:[4] Introduction to Mechanical Engineering Design, Sung Yi, S. H. Cho, K. S. Byun, S. C. Lee, B. S. Yoon, Bomoondang Press, Seoul, ISBN : 978-89-8413-221-4 (93530), 2018. [3] Wearable Electronics Packaging and MEMS Devices Technology and Trends, Sung Yi, Choong-Un Kim, Hyejin Moon, Phil Geng, Liwei Lin, KSEA & KOFST, December 2014. [2] North American Electronic Packaging Technology Research and Trends, Sung Yi, KITECH, 2011. [1] Flexible Electronics and its Packaging, Sung Yi, Chunnam Techno-Park, December 2011. 2. Book Chapters[2] Yi, Sung, Hygro-Thermally Induced Residual Stresses and Failures in Plastic IC Packages During Reflow Process, Encyclopedia of Thermal Stresses, Edited by R. Hetnarski, Springer, May 2014. [1] Yi, Sung, Hilton, H. H., and Ahmad, M. F., Thermo-viscoelastic Finite Element Analysis Performance on Coarse Grained and Massively Parallel Supercomputers, High Performance Computing in Engineering, Edited by H. Power and C. A. Brebbia, Computational Mechanics Publications, UK, 2: 167-198, January 1995. 3. Refereed Journal Articles | |
| [133] | Min, K.E., Jang J.W., Kim, C.H. and Yi, Sung, Identification of Solder Joint Failure Modes Using Machine Learning, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 12, pp. 2032-2039, Dec. 2023, doi: 10.1109/TCPMT.2023.3340292. |
| [132] | Yi, Sung, Oh, N.K., Min, K.E., Kim, C.H., Shin, J.S., and Kim, C.H., Thermo- Viscoelastic Characterization of 3D Printing Polymers, Applied Sciences 13(5), 2876, 2023; https://doi.org/10.3390/app13052876. |
| [131] | Min, K.E., Jang, J.W., Shin, J.S., L Kim, C.H., and Yi, Sung, Development of Prediction Method for Dimensional Stability of 3D-Printed Objects, Applied Sciences, 13(19), 11027, 2023; https://doi.org/10.3390/app131911027. |
| [130] | Min, K.E., Jang, J.W., Yi, S., Kim, C.H., Role of binder Thermo-Viscoelastic Characterization of 3D Printing Polymers, Journal of Materials Research and Technology, 2023; https://doi.org/10.1016/j.jmrt.2023.09.238. |
| [129] | Jang, J.W., Min, K.E., Kim, C.H., Wern, C., Yi, S., PCL and DMSO2 Composites for Bio-Scaffold Materials, Materials, 16(6), 2481, 2023; https://doi.org/10.3390/ma16062481. |
| [128] | Jang, J.W., Min, K.E., Kim, C.H., Shin, J.S., Lee, J.W. and Yi, Sung, Review: Scaffold Characteristics, Fabrication Methods, and Biomaterials for the Bone Tissue Engineering, International Journal of Precision Engineering and Manufacturing, pp. 1-19, 2023; https://doi.org/10.1007/s12541-022-00755-7. |
| [127] | Ji, S.Y., Jeong, D.Y., Kim, C.H., and Yi, Sung, High Dielectric Design of Polymer Composites by Using Artificial Neural Network, Applied Sciences, Volume 12 (24), 12592, 2022; https://doi.org/10.3390/app122412592. |
| [126] | Min, K. E., Jang, J.W., Kim, J.K., Wern, C. and Yi, Sung, Thermophysical Properties of Inorganic Phase-Change Materials Based on MnCl2·4H2O, Applied Sciences, Volume 12, 6338, 2022; https://doi.org/10.3390/app12136338.. |
| [125] | Lee, Suhyun, Wern, C. and Yi, Sung, Novel Fabrication of Silver Coated Copper Nanowires with Organic Compound Solution, Materials, 2022, 15(3), 1135; https://doi.org/10.3390/ma15031135. |
| [124] | Vu, C., Wern, C., Kim, B. H., Kim, S. K., Choi, H. J., and Yi, Sung, Fatigue Characteristic Analysis of New ECO7175-v3 Extruded Aluminum Alloy, Aerospace Engineering, 34(2): 04021001, 2021 |
| [123] | Choi, S., Yi, S., Kim, J., Shin, B., Hyun, S., High-Entropy Alloys Properties Prediction Model by Using Artificial Neural Network Algorithm, Metals, 11 (10), 1559, 2021 |
| [122] | Lee, K., Kang, S., Kang, M., Yi, S., Kim, C., Estimation of Al/Cu laser weld penetration in photodiode signals using deep neural network classification, Journal of Laser Applications, 33 (4), 042009, 2021. |
| [121] | Yu, H.J., Ahn, Y.N., Yi, S., Hyun, S.K., Review and Feasibility Study on Micro Friction Stir Welding of Al/Fe Butt Joints, Journal of Welding and Joining, DOI: https://doi.org/10.5781/JWJ.2021.39.3.3, 39 (3), 246-253, 2021. |
| [120] | You, H.J., Kang, M., Yi, S., Hyun S., and Kim, C., Comprehensive Analysis of the Microstructure and Mechanical Properties of Friction-Stir-Welded Low-Carbon High-Strength Steels with Tensile Strengths Ranging from 590 MPa to 1.5 GPa, Applied Sciences, 11 (12), 5728, 2021. |
| [119] | Lee, S., Wang, S., Wern, C. and Yi, Sung, The Green Synthesis of 2D Copper Nanosheets and Their Light Absorption, Materials, 14(8), 1926. https://doi.org/10.3390/ma14081926, 2021. |
| [118] | Shin, B., Kim, K., Yi, S., Choi, S., Hyun, S., Microstructure and Mechanical Properties of Cast and Hot-Rolled Medium-Carbon Steels under Isothermal Heat-Treatment Conditions, Metals, 11 (10), 1559, 2021. |
| [117] | You, Hyeonjeong, Kang, Minjung, Yi, Sung, Hyun, Soongkeun, and Kim, Cheolhee, Modeling of Laser Welds Using Machine Learning Algorithm, Part II: Geometry and Mechanical Behaviors of Laser Overlap Welded High Strength Steel Sheets, Journal of Welding and Joining, DOI: https://doi.org/10.5781/ JWJ.2021.39.1.4, 39(1): 36-44, 2021. |
| [116] | Lee, Kidong, Kang, Sanghoon, Kang, Minjung, Yi, Sung, Hyun, Soongkeun, and Kim, Cheolhee, Modeling of Laser Welds Using Machine Learning Algorithm Part I: Penetration Depth for Laser Overlap Al/Cu Dissimilar Metal Welds, Journal of Welding and Joining, Publication Date (Web): February 8, 2021, DOI: https://doi.org/10.5781/ JWJ.2021.39.1.3. |
| [115] | Lee, Kidong, Yi, Sung, Hyun, Soongkeun, and Kim, Cheolhee, Review on the Recent Welding Research with Application of CNN-Based Deep Learning Part II: Models and Applications, Journal of Welding and Joining, Publication Date (Web): February 8, 2021, DOI: https://doi.org/10.5781/JWJ.2021.39.1.2. |
| [114] | Lee, Y., Resiga, A., Yi, Sung, and Wern, C., The Optimization of Machining Parameters for Milling Operations by Using the Nelder–Mead Simplex Method, Journal of Manufacturing and Materials Processing, Vol. 4, Issue 3, pp. 66, 2020. |
| [113] | Vu, C., Wern, C., Kim, B. H., Kim, S. K., Choi, H. J., and Yi, Sung, Fatigue Characteristic Analysis of New ECO7175-v3 Extruded Aluminum Alloy, Aerospace Engineering, 2020 (Accepted). |
| [112] | Yi, Sung and Jones, Robert, Machine Learning Framework for Predicting Reliability of Solder Joints, Soldering and Surface Mounting Technology, Vol. 31, Issue 4, 2019. https://doi.org/10.1108/SSMT-04-2019-0013. |
| [111] | Steingrimsson, B., Phan, B., Nelson, C., Frederick, T., and Yi, Sung, Evaluation of Ecosystem for Design Assessment and Verification by BAJA Dynamometer Capstone Team at the University of Nebraska, SAE Technical Paper 2019-01-0812, 2019, doi:10.4271/2019-01-0812. |
| [110] | Lee, Jiwoon, Walker, Jesse, Natarajan, Sanjay, and Yi, Sung, Prediction of Geometric Characteristics in Polycaprolactone (PCL) Scaffolds Produced by Extrusion-based Additive Manufacturing Technique for Tissue Engineering, Rapid Prototyping Journal, https://doi.org/10.1108/RPJ-08-2018-0219. |
| [109] | Suhir, E., Yi, Sung, Hwang, Jennie S., and Ghaffarian, Reza, Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief. Journal of Microelectronics and Electronic Packaging, Vol. 16, No. 1, pp. 13-20, 2019. https://doi.org/10.4071/imaps.735566 |
| [108] | Shin, Jesik, Kim, Taehyeong, Lim, Kyoungmook, Cho, Hoon, Yang, Daeho Yang, Jeong, Changyeol, Yi, Sung, Effects of Steel Type and Sandblasting Pretreatment on the Solid Liquid Compound Casting Characteristics of Zinc-coated Steel/Aluminum Bimetals, Journal of Alloys and Compounds, Vol. 778, pp. 170-185, 2019. |
| [107] | Vu, C., Wern, C., Kim, B. H., Kim, S. K., Choi, H. J., and Yi, Sung, Fatigue Characteristic Analysis of New ECO7175v1 Extruded Aluminum Alloy, Aerospace Engineering, Vol. 32, No. 1, 2018, DOI: 10.1061/(ASCE)AS.1943- 5525.0000958. |
| [106] | Steingrimsson, B., Yi, Sung, Jones, R., Kisialiou, M., Yi, Kwan, Rose, Zachary, “Big Data Analytics for Improving Fidelity of Engineering Design Decisions,” SAE Technical Paper 2018-01-1200, 2018, doi:10.4271/2018-01-1200. |
| [105] | Jones, R., Steingrimsson, B, Etesami, F., and Yi, S., The Ecosystem for Engineering Design Applied to Formula SAE, SAE International, SAE Technical Paper 2017-01-1324, 2017, https://doi.org/10.4271/2017-01-1324. |
| [104] | Steingrimsson, B., Jones, R., Etesami, F., and Yi, Sung, The Ecosystem for Engineering Design Applied to Formula SAE, Design Learning-A Comparative Analysis, International Journal of Engineering Education, Vol. 33, No. 5, pp. 1-14, 2017. |
| [103] | Suhir, E., Ghaffarian, R., and Yi, Sung, Reliability Physics behind the QFN State of Stress, Journal of Materials Science: Materials in Electronics, (DOI 10.1007/s10854-016-5781-x), Volume 28, Issue 2, pp. 2160-2171, 2017. |
| [102] | Suhir, E., Ghaffarian, R., and Yi, Sung, Probabilistic Palmgren-Miner rule with application to solder materials experiencing elastic deformations, Journal of Materials Science: Materials in Electronics. (DOI: 10.1007/s10854-016-5845-y), Volume 28, Issue 3, pp 2680-2685, 2017. |
| [101] | Suhir, E., Yi, Sung and Ghaffarian, R., Assessed Interfacial Strength and Elastic Moduli of the Bonding Material from Shear-off Test Data, Journal of Materials Science: Materials in Electronics, DOI 10.1007/s10854-017-6376-x, Volume 28, Issue 9, pp. 6794-6799, 2017. |
| [100] | Suhir, E., Yi, Sung and Ghaffarian, R., How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?, Journal of Electronic Materials. (DOI 10.1007/s11664-016-5224-8), Volume 46, Issue 3, pp 1747-1753, 2017. |
| [99] | Suhir, E., Ghaffarian, R., and Yi, Sung, QFN Assembly: Effect of Inhomogeneous Bond and Thermal Stress Minimization, Journal of Materials Science: Materials in Electronics, Volume 28, Issue 2, pp. 2160-2171, 2017. |
| [98] | Suhir, E., Yi, S., Nicolics, J., Khatibi, G. and Lederer, M., Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice Misfit Stresses, Journal of Materials Science: Materials in Electronics, DOI 10.1007/s10854-016-4976-5, Volume 27, Issue 9, pp 9356-9362, 2016. |
| [97] | Suhir, E., Morris, J. E., Wang, L., Yi, Sung, Could dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data- Journal of Materials Science: Materials in Electronics, DOI 10.1007/s10854-016-4617-z, Volume 27, Issue 7, pp 6697-6702, 2016. |
| [96] | Min, Kyung-Eun, Lee, Jun-Sik Lee, Lee, So-Jeong, Yi, Sung and Kim, Jun-Ki, Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding, Journal of Welding and Joining, Vol.33 No.5, pp, 24-29, 2015. |
| [95] | Yi, Sung, Shear Strengths of CBGA/PBGA Solder Ball Joints with Lead-Free Solder Pastes, International Journal of Materials and Structural Integrity, Vol.8, No.1/2/3, pp.62-75, 2014. |
| [94] | Chu, Y. F., Yi, Sung, and Geng, Phil, Thermal Fatigue Life Prediction of Solder Joints of Plastic Ball Grid Array Packages, International Journal of Materials and Structural Integrity, Vol.8, No.1/2/3, pp.3 - 20, 2014. |
| [93] | Yi, Sung, Kim, KyungO, Lee, Dongwan, Kim, Hongwon and Jung, Taesung, Embedded Passive Device Technology for Wireless Mobile Devices, Microelectronics International, Vol. 30, Iss: 1, pp.33 - 39, 2013. |
| [92] | Lee, H., Kim, D. and Yi, S., Horizontally Progressive Mirror for Blind Spot Detection in Automobiles, Optics Letters, Vol. 38, No. 3, pp. 317-319, 2013. |
| [91] | Yi, Sung and Lam, Tatiana M., Analysis of Warpage and Residual Stress in Plastic Ball Grid Array Package after Post Mold Cure, Microelectronics International, Vol. 29, No. 3, pp. 163-171, 2012. |
| [90] | Na, H. C., Sung, T. J., Yoon, S. H., Hyun, S. K., Kim, M. S., Lee, Y. G., Shin, S. H., Choi, S. M. and Yi, Sung, Formation of Unidirectional Nanoporous Structures in Thickly Anodized Aluminum Oxide Layer, Transactions of Nonferrous Metals Society of China, Elsevier Publisher, Vol. 19, Issue 4, |
| [89] | Yuan, Jingli, Jeung, Won-Kyu , Lim, Chang-Hyun, Park, Seung-Wook, Kweon, Young-Do and Yi, Sung, A Low-cost Through Via Interconnection for ISM WLP, Microsystem Technologies, Vol. 15, No. 8, pp. 1273-1277, 2009. |
| [88] | Kweon, Y. D., Park, S., Kim, T., Hong, J., Yang, S., J. Ha, J., Kim, T. and Yi, Sung, Wafer Level SAW RF Filter Packaging With Through Wafer Via Interconnection, ECS Transactions, Vol. 18, No.1, pp. 768-763, 2009. |
| [87] | Kim, H. H., Choi, S. H., Shin, S. H., Lee, Y. K., Choi, S. M. and Yi, Sung, Thermal Transient Characteristics of Die Attach in High Power LED PKG, Microelectronics Reliability, Vol. 48, Issue 3, pp. 445-454, 2008. |
| [86] | Gao, S., Hong, J.P., Kim, J.S., Yoo, D.J., Jeong, T.S., Choi, S.M. and Yi, Sung, Development of an Ultra-Slim System in Package (SiP), Journal of the Microelectronics and Packaging Society, Vol. 15, No. 1, pp. 7-18, 2008. |
| [85] | Kim, Kyungo, Kim, Taeeui, Lee, Donghwan and Yi, Sung, Highly Compact Embedded Duplexer Implementation for WiMAX Dual-band Front-end Module with Organic Package Substrate, PIERS ONLINE, VOL. 4, NO. 7, pp. 731-735, 2008 |
| [84] | Sung, T. J., Jung, Taek Kyun, Kim, Mok Soon and Yi, Sung, Processing and Properties of Al Based Amorphous/Crystalline Alloy Composites, Materials Science Forum, Vol. 544-545, pp. 431-434, 2007. |
| [83] | Jung, T. K., Kim, M. S., Kim, W. Y., Kwon, H. C., Yi, Sung, Processing and Tensile Property of Nano Dispersed Al-Fe-(Mo, V, Zr) Bulk Alloy, Advanced Materials Research, Vol. 26, pp.87-90, 2007. |
| [82] | Noh, S.J., Jung, T.K., Lee, D.S., Kim, M.S., Yi, Sung, Manufacturing Using a More Environmentally Friendly Process-Synthesis and Properties of Bulk Amorphous/Nanocrystalline Aluminium Alloy Composites, Materials Science Forum, Vol. 510-511, pp. 830-833, 2006. |
| [81] | Yi, Sung, Park, Sang Kyoo and Teo, Kiat Choon, A Study of Aluminum Wire Failure in Automotive under-hood Applications, Microelectronics International, Vol. 23, Issue: 2, pp.11 - 20, 2006. |
| [80] | Ling, S. F., Zhang, D., Yi, Sung and Foo, S. W., Real-Time Quality Evaluation of Wire Bonding Using Input Impedance, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29, Issue 4, pp. 280 - 284, Oct. 2006. |
| [79] | Su, Fei, Chian, K. S. and Yi, Sung, An Optical Characterization Technique for Hygroscopic Expansion of Polymers and Plastic Packages, Microelectronics Reliability, Vol. 46, No. 2-4, pp. 600-609, 2006. |
| [78] | Beldica, Cristina E., Hilton, Harry H. and Yi, Sung, Viscoelastic Damping and Piezo-electric Control of Structures Subjected to Aerodynamic Noise, Technical Acoustics, ISSN 1819-2408, 2006. |
| [77] | Liu, L., Yi, Sung, Ong, L. S., Chain, K. S., Osiyemi, S., Lim, S. H., Su, F., Chemo-thermal Modeling and Finite Element Analysis for Microwave Cure Process of Underfill in Flip-Chip Packaging, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 4, pp. 355-362, October 2005. |
| [76] | Su, Fei, Chian, Kerm Sin, Yi, Sung, and Dai, Fulong, Development and Instrumentation of an Integrated Three-dimensional Optical Testing System for Application in Integrated Circuit Packaging, Review of Scientific Instruments, Vol. 76, Issue 9, On page(s): 093109 - 093109-5, 2005. |
| [75] | Zhang, J., Li, M., Xiong, C. Y., Fang, J., and Yi, Sung, Thermal Deformation Analysis of BGA Package by Digital Image Correlation Technique, Microelectronics International, Vol. 21, No. 2, pp. 45-51, 2004. |
| [74] | Hilton, H. H. and Yi, Sung, Generalized Viscoelastic 1-DOF Deterministic Nonlinear Oscillators, Nonlinear Dynamics, Vol. 36, pp. 281-298, 2004. |
| [73] | Su, Fei, Dai, Fulong, Chian, Kerm Sin, Yi, Sung, Simultaneous Recording of Fringe Patterns with One Camera, Acta Mechanica Sinica, Vol. 20, No. 6, pp. 642-648, 2004. |
| [72] | Yi, Sung and Gao, Shan, Thermo-mechanical Behavior of Cracked Ti-55.4%Ni Shape Memory Alloys under Mechanical Loading, Key Engineering Materials, Vols, 261-263, pp. 903-912, 2004. |
| [71] | Liu, Lie, Yi, Sung, Ong, Lin Seng and Chian, Kerm Sin, Finite Element Analysis for Microwave Cure of Underfill in Flip Chip Packaging, Thin Solid Films, Vols. 462-463, pp. 436-445, September 2004. |
| [70] | Tee, T. T., Yi. Sung, Shen, X, Su, F., and Zhong, Z., Comprehensive Numerical and Experimental Analysis of Matrix TFBGA Warpage, Journal of Surface Mount Technology, Vol. 17, Issue 2, pp. 11-17, 2004. |
| [69] | Su, F., Yi, Sung and Chian, K. S., A Simple Method to Unwrap the Geometrically Discontinuous Phase Map and its Application in the Measurement of IC Package, Optics and Lasers in Engineering, Vol. 41, pp. 463-473, 2004. |
| [68] | Su, F., Sun, Y., Chian, K. S. and Yi, Sung, Use of Wollaston Prism to Simplify the Polarization Method for Simultaneous Recording of Moire Interferometry Fringe Patterns, Optics Engineering, Vol. 43, No 12, pp. 3003-3007, December 2004. |
| [67] | Xiong, C. Y., Zhang, J., Li, M., Fang, J., and Yi, Sung, Fourier and wavelet transform analysis of Moire Fringe Patterns in Electronic Packaging, Microelectronics International, Vol. 21, No.2, pp. 45-51, 2004. |
| [66] | Chia, Y. C., Yam, H. S., Lim, S. H., Chian, K. S., Yi, Sung and Chen, W. T., An Optimization Study of Underfill Dispensing Volume, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 3, pp. 205-210, July 2003. |
| [65] | Gao, S. and Yi, Sung, Experimental Study on the Anisotropic Behavior of Textured NiTi Pseudoelastic Shape Memory Alloys, Materials Science and Engineering A, Vol. 362, Issues 1-25, pp. 107-111, December 2003. |
| [64] | van Driel, W.D., Zhang, G. Q., Janssen, J.H.J., Ernst, L.J., Su, F., Chian, K. S. and Yi, Sung, Prediction and Verification of Process Induced Warpage of Electronic Packages, Microelectronics Reliability Vol. 43 pp. 765-774, 2003. |
| [63] | Fu, Y., Du, H., Gao, S. and Yi, Sung, Mechanical Properties of Sputtered TiNiCu Shape Memory Alloy Thin Films, Material Science Forums Vol. 437-438, pp.37-40, 2003. |
| [62] | Donthu, S. K., Vora, M. M., Lahiri, S. K., Thompson, C. V. and Yi, Sung, Activation Energy Determination for Recrystallization in Electroplated-Copper Films Using Differential Scanning Calorimetry, Journal of Electronic Materials, Vol. 32, No. 6, pp. 531 - 534, 2003. |
| [61] | Yi, S, Luo G. X. and Chian, K. S., Viscoplastic Micro-Deformation Mechanism of Eutectic Solders, Transaction of ASME: Journal of Electronic Packaging, Vol. 124, pp. 92-96, 2002. |
| [60] | Yi, Sung, Chian, K. S. and Hilton, H. H., Nonlinear Viscoelastic Finite Element Analyses in Thermosetting Polymeric Composites During Cool-Down After Curing, Journal of Composite Materials, Vol. 36, No. 01, pp. 3-17, 2002. |
| [59] | Gao, Shan and Yi, Sung, Fracture Toughening Analysis of Shape Memory Alloys, Key Engineering Materials, Vol. 227, pp. 49-54, 2002. |
| [58] | Wang, B. and Yi, Sung, Dynamic Plastic Behavior of 63 wt% Sn 37 wt% Pb Eutectic Solder under High Strain Rates, Journal of Materials Science Letters, Vol. 21, pp. 697- 698, 2002. |
| [57] | Chian , K. S., Du, X. Y., Goy, H. A., Feng, J. L., Yi, Sung and Yue, C. Y., Mechanical Properties and Morphology of Poly(ethylene glycol)-side-chain-modified Bismaleimide Polymer Journal of Applied Polymer Science, Vol. 86, Issue 3, pp. 715-724, October 2002. |
| [56] | Chian, K. S., Du, X. Y., Goy, H. A., Feng, J. L., Yi, Sung and Yue, C. Y., Synthesis of Bismaleimide Resin Containing the Poly(ethylene glycol) side Chain: Curing Behavior and Thermal Properties, Journal of Applied Polymer Science, Vol. 85, Issue 14, pp. 2935-2945, 2002. |
| [55] | Zhong, C. H., Yi, Sung and Whalley, D. C., Solder Ball Failure Mechanisms in Plastic Ball Grid Array Packages, Soldering & Surface Mount Technology, Vol. 14, No. 2, pp. 40-50, 2002. |
| [54] | Chian, K. S. and Yi, Sung, Synthesis and Characterization of an Isocyanurate-oxazolidone Polymer: Effect of Stoichiometry, Journal of Applied Polymer Science, Vol. 82, Issue 4, pp. 879-888, 2001. |
| [53] | Yi, Sung, Ling S. F. and Ying, M., Time Domain Analysis of Acoustic-Structures Interaction Problems, The Journal of Acoustics Society of American, Vol. 109, No. 6, pp. 2762- 2770, 2001. |
| [52] | Shen, L. and Yi, Sung, An Effective Inclusion Model of Effective Elastic Moduli of Microcracked Solids, International Journal for Solids and Structures, Vol. 38, pp. 5789-5805, 2001. |
| [51] | Yi, Sung, Gao, S. and Shen, L., Fracture Analysis of Shape Memory Alloys under Mixed Mode Loading, International Journal for Solids and Structures, Vol. 38, pp. 4463-4476, 2001. |
| [50] | Yi, Sung, Kim, J. K., Yue, C. Y. and Hsieh, J. H., Adhesion Strengths of Epoxy Molding Compounds to Gold Plated Copper, The Journal of Adhesion, Vol. 73, pp. 1-17, 2000. |
| [49] | Shen, L and Yi, Sung, Approximate Evaluation for Effective Elastic Moduli for Cracked Solids, International Journal of Fracture, Vol. 106, No. 2, pp. 15-20(6), Nov. 2000. |
| [48] | Yi, Sung, Kim, J. K., Yue, C. Y. and Hsieh, J. H., Bonding Strengths at Plastic Encapsulated-Gold Plated Copper Leadframe Interface, Microelectronics Reliability, Vol. 40, pp.1207-1214, 2000. |
| [47] | Yi, Sung and Sze, K. Y., A Finite Element Formulation for Composite Laminates with Smart Constrained Layer Damping, Advances in Engineering Software, Vol. 31 (8-9), pp. 529-537, Aug. 2000. |
| [46] | Sze, K. Y., Yao, L. and Yi, Sung, A Hybrid-Stress ANS Solid-Shell Element and Its Generalization for Smart Structure Modeling - Part II: Smart Structure Modeling, International Journal for Numerical Methods in Engineering, Vol. 48, pp. 565-582, 2000. |
| [45] | Yi, Sung and Gao, S., Fracture Toughness of Shape Memory Alloys due to Martensite Transformation, International Journal for Solids and Structures, Vol. 37, pp.5315-5327, 2000. |
| [44] | Shen, L. and Yi, Sung, New Solutions for Effective Elastic Moduli of Microcracked Solids, International Journal for Solids and Structures, Vol. 37, pp. 3525-3534, 2000. |
| [43] | Yi, Sung, Shen, Lianxi, Kim, Jang Kyo and Yue, Chee Yoon, A Failure Criterion for Debonding between Encapsulants and Leadframes, Journal of Adhesion Science and Technology, Vol. 14, No. 1, pp. 93-105, 2000. |
| [42] | Chia, Y.C., Lim, S.H., Chian, K. S., Yi, Sung and Chen, W.T., An Optimization Study of Underfill Dispensing Process, International Journal of Microcircuits & Electronic Packaging, Vol. 22, No. 4, pp. 345-352, 1999. |
| [41] | Yi, Sung, Ling, S. F. and Ying, M., Large Deformation Finite Element Analyses of Composite Structures Integrated with Piezoelectric Sensors and Actuators, Finite Element Analyses and Design, UK, Vol. 35, pp. 1-15, 1999. |
| [40] | Yuan, W. Q. and Yi, Sung, Pseudo-elastic Strain Estimation of Textured TiNi-based Shape Memory Alloys, Materials Science and Engineering Part. A, Vol. 271, Issues 1-2, pp. 439-448, 1999. |
| [39] | Yuan, W. Q. and Yi, Sung Determination of Orientation Distribution Function in the TiNi-based SMA Parent and Martensite Phases, Scripta Materialia, Vol. 41, No. 12, pp. 1319-1325, 1999. |
| [38] | Xiao, Z. M., Guo, J. Y., Yi, Sung, Stress Intensity Factors for Ring-Shaped Crack Surrounded by Spherical Inclusions, Theoretical and Applied Fracture Mechanics, Vol. 32, pp. 147-155, 1999. |
| [37] | Yi, Sung, Yue, Chee Yoon, Hsieh, Jang-Hsing, Fong, Liwha, Lahiri, Syamal K., Effects of Oxidation and Plasma Cleaning on Adhesion Strength between Copper Leadframes and Molding Compounds, Journal of Adhesion Science and Technology, Vol. 17, No. 7, pp.789-804, 1999. |
| [36] | Yi, Sung, Ling, S. F., Ying, M., Hilton, H. H. & Vinson, J. R., Finite Element Formulation of Anisotropic Coupled Piezo-hygro-thermo-viscoelastic-dynamic Problems, International Journal for Numerical Methods in Engineering, Vol. 45, pp.1531-1546, 1999. |
| [35] | Zhong, C. H. and Yi, Sung, Solder Joint Reliability of Plastic Ball Grid Array Packages, Soldering and Surface Mount Technology, UK, Vol. 11, No. 1, pp. 44-48, 1999. |
| [34] | Hsieh, J.H., Fong, L.H., Yi, Sung, Metha, G., Plasma cleaning of copper leadframe with Ar and Ar/H2 gases, Surface and Coatings Technology, Vol. 112, No. 1-3, pp. 245-249, 1999. |
| [33] | Hilton, H. H. and Yi, Sung, Stochastic Delamination Simulations of Non-linear Viscoelastic Composites During Cure, Journal of Sandwich Structures & Materials, Vol. 1, pp. 111-127, April 1999. |
| [32] | Yi, Sung and Sze, K. Y., Cooling Rate Effect on Post Cure in Plastic Encapsulated IC Packages, Transaction of ASME: Journal of Electronic Packaging, Vol. 120, pp. 385-390, 1998. |
| [31] | Yi, Sung, Ling, Shih-Fu, and Ying, Ming, Finite Element Analysis of Composite Structures with Smart Constrained Layer Damping, Advances in Engineering Software, UK, Vol. 29, No. 3-6, pp. 265-271, 1998. |
| [30] | Ying, M., Zou, Q., and Yi, Sung, Finite Element Analysis of Silicon Condenser Microphones with Corrugated Diaphragms, Finite Elements in Analysis and Design, Vol. 30, pp. 163-173, 1998. |
| [29] | Yi, Sung and Sze, Kam Yim, Finite Element Analysis of Moisture Distribution and Hygrothermally Induced Stresses in TSOP Packages, Finite Elements in Analysis and Design, Vol. 30, pp. 65-79, 1998. |
| [28] | Yi, Sung and Hilton, H. H., Effects of Thermo-mechanical Properties of Composites on Viscosity, Temperature and Degree of Cure in Thick Thermosetting Composite Laminates during Curing Process, Journal of Composite Materials, Vol. 32, No. 7, pp. 600- 622, 1998. |
| [27] | Yi, Sung, Ahmad, M.F. and Hilton, H.H., Nonlinear Viscoelastic Stress Singularities near Free Edges of Unsymmetrically Laminated Composites, International Journal for Solids and Structures, Vol. 35, pp.3221-327, 1998. |
| [26] | Yi, Sung, Hilton, H. H. and Ahmad, M. F., Cure Cycle Simulations of Composites with Temperature and Cure Dependent Anisotropic Viscoelastic Properties and Stochastic Delaminations, Mechanics of Composite Materials & Structures, Vol. 5, pp.81-101, 1998. |
| [25] | Hilton, H. H. and Yi, Sung, The Significance of Anisotropic Viscoelastic Poisson's Ratio Stress and Time Dependencies, International Journal for Solids and Structures, Vol. 35, pp. 3081-3095, 1998. |
| [24] | Zou, Q., Tan, Z., Wang, Z., Lin, R., Yi, Sung, Gong, H., Lim, M., Liu Litian and Li Zhijian, A Novel Integrated Silicon Capacitive Microphone, IEEE/ASME Journal of Microelectromechanical Systems, Vol. 7, No. 2, pp. 224-233, 1998. |
| [23] | Zou, Q., Tan, Z., Wang, Z., Lin, R., Yi, Sung, Gong, H., Lim, M., Li, Zhijian and Liu, Litian, A Study on Corrugated Diaphragms for High-sensitivity Structures, Journal of Micromech. Microeng. Vol. 7, pp. 310-315, 1997. |
| [22] | Yi, Sung, Goh, J. S. and Yang, J. C., Residual Stresses in Plastic IC Packages During Surface Mounting Process Preceded by Moisture Soaking Test, IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, USA, Vol. 20, No. 3, pp. 247-255, March 1997. |
| [21] | Yi, Sung and Hilton, Harry H., Free Edge Stresses in Elastic and Viscoelastic Composite Laminates under Uniaxial Extension, Bending and Twisting, Transaction of ASME: Journal of Engineering Materials and Technology, Vol. 119, pp. 266-272, 1997. |
| [20] | Yi, Sung, Finite Element Analysis of Free Edge Stresses in Nonlinear Viscoelasitc Composites Under Uniaxial Extension, Bending and Twisting, International Journal for Numerical Methods in Engineering, UK, Vol. 40, pp. 4225-4238, 1997. |
| [19] | Sze, K. Y., Yi, Sung, and Tay, M. H., An Explicit Hybrid Stabilized Eighteen-Node Solid Element for Thin Shell Analysis, International Journal for Numerical Methods in Engineering, UK, Vol. 40, pp. 1839-1856, 1997. |
| [18] | Yi, Sung, Effects of a Time-dependent Interfacial Layer on the Thermo-mechanical Response of Polymer Matrix Composites, Journal of Materials Processing Technology, V67, N1-3, P183-188, May 1997. |
| [17] | Yi, Sung, Ahmad, M. F., and Hilton, H. H., Finite Element Algorithms for Dynamic Simulation of Viscoelastic Composite Shell Structures Using Conjugated Gradient Method on Coarse Grained and Massively Parallel Machines , International Journal for Numerical Methods in Engineering, UK, Vol. 40, p |
| [16] | Yi, Sung, Hilton, H. H. and Ahmad, M. F., Finite Element Approach for Cure Simulation of Thermosetting Matrix Composites, Computers and Structures, UK, Vol. 64, No. 1-4, pp. 383-388, 1997. |
| [15] | Hilton, H. H., Yi, Sung and Danyluk, M. J., Probabilistic Analysis of Delamination Onset in Linear Anisotropic Elastic and Viscoelastic Composite Columns, International Journal of Reliability Engineering and System Safety, Vol. 56, pp. 237-248, 1997. |
| [14] | Yi, Sung, Ahmad, M. F. and A. Ramesh, Data Parallel Finite Element Computation for Thermo-Viscoelastic Composite Structures, Advances in Engineering Software, UK, OCT-NOV, Vol. 27, N1-2, pp.97-102. ISSN 0965-9978, 1996. |
| [13] | Swellam, M., Yi, Sung, Ahmad, M. F. and Huber, L., Mechanical Properties of Cellular Materials I, Linear Analysis of Hexagonal Honeycombs, Journal of Applied Polymer Science, Vol. 63, pp. 383-393, 1997. |
| [12] | Yi, Sung, Hilton, H. H. and Ahmad, M. F., Nonlinear Thermo-viscoelastic Analysis of Interlaminar Stresses in Laminated Composites, ASME: Journal of Applied Mechanics, USA, pp. 218-224, Vol. 63, March 1996. |
| [11] | Yi, Sung, Ahmad, M. F., and Hilton, H. H., Dynamic Responses of Plates with Free Layer Viscoelastic Damping Treatment, ASME: Journal of Vibration and Acoustics, USA, Vol. 118, pp. 362-367, 1996. |
| [10] | Yi, Sung and Hilton, H. H., Hygrothermal Effects on Viscoelastic Responses of Laminated Composites , Composites Engineering, UK, Vol. 5, No. 2, pp. 183-193, 1995. |
| [9] | Yi, Sung, Pollock, G., Ahmad, M. F., and Hilton, H. H., Effective Transverse Young's Modulus of Composites with Viscoelastic Interphase, AIAA Journal, USA, Vol. 33, No. 8, pp. 1548-1550, 1995. |
| [8] | Yi, Sung, Pierson, K. H., and Ahmad, M. F., Parallel Implementation of Dynamic Simulation to Filamentary Composite Structures with General Rate Dependent Damping, Computing Systems in Engineering, UK, Vol. 5, pp. 469-477, 1994. |
| [7] | Yi, Sung and Hilton, H. H., Dynamic Finite Element Analysis of Viscoelastic Composite Plates , International Journal for Numerical Methods in Engineering, USA, Vol. 37, pp. 4081-4096, 1994. |
| [6] | Yi, Sung, Thermoviscoelastic Analysis of Delamination Onset and Free Edge Response in Epoxy Matrix Composite Laminates, AIAA Journal, USA, Vol. 31, No. 12, pp. 2320-2328, 1993. |
| [5] | Hilton, H. H. and Yi, Sung, Stochastic Thermo-Viscoelastic Delamination Failure Analysis of Laminated Composites, Journal of Composite Materials, USA, Vol. 27, No. 11, pp.1097-1113, 1993. |
| [4] | Hilton, H. H. and Yi, Sung, Anisotropic Viscoelastic Finite Element Analysis of Mechanically and Hygrothermally Loaded Composites, Composites Engineering, UK, Vol. 3, No. 2, pp. 123-135, 1993. |
| [3] | Yi, Sung, Pollock, G., Ahmad, M. F., and Hilton, H. H., Time Dependent Analysis of Viscoelastic Composite Shell Structures, Computing Systems in Engineering, UK, Vol. 3, pp. 457-467, 1992. |
| [2] | Hilton, H. H. and Yi, Sung, Analytic Formulation of Optimum Material Properties for Viscoelastic Damping, Smart Materials and Structures, UK, Vol. 1, pp. 113-122, 1992. |
| [1] | Lin, K. Y. and Yi, Sung, Analysis of Interlaminar Stresses in Viscoelastic Composites, International Journal of Solids and Structures, UK, Vol. 27, No. 7, pp. 929-945, 1991. |