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Sung Yi

Mailing Address

Mechanical and Materials Engineering Department
Portland State University
Post Box 751
Portland, Oregon 97207-0751
Fax: (503) 725-8255
Phone: (503) 725-5470
Email: syi@pdx.edu

Office

Engineering Building
Portland State University
1930 SW 4th Avenue
Portland, OR 97201-5304
USA
(View in Google Maps)

EDUCATION

   Ph.D.   1992    University of Illinois at Urbana-Champaign, IL, USA
   M.S.     1987    University of Washington, Seattle, WA, USA
   B.S.     1982    Hanyang University, Seoul, Korea.

At a Glance

Currently Sung Yi is a Professor and Chair of Mechanical and Materials Engineering Department at the Portland State University, OR. He received Ph.D. from University of Illinois at Urbana-Champaign in 1992. He is a faculty member at the Portland State University since 2002. Previously, he was a faculty member and Head of Engineering Mechanics Division, School of Mechanical Engineering, Nanyang Technological University (NTU), Singapore. He was also a Singapore-MIT Alliance Fellow from 1998 to 2002. From 2006 to 2009, he served as a Vice President at Manufacturing Engineering, R&D Institute, Samsung Electro-Mechanics, Korea.

In Samsung, he has been privileged to build a brand new Microelectronic Packaging Team. The mission of the Packaging Team is generating creative microelectronics packaging technology and providing total packaging solutions for all products. The team is focusing on core future technology and it's incubation. This approach makes the company have more aggressive R&D culture. He and his team developed several advanced electronic and MEMS packaging technologies including embedding active devices and passives into organic substrates, the world's smallest saw filter using wafer level packaging, ALOX high thermal dissipation substrate technology for power devices and LED devices, 3-D advanced packaging technology, etc. The embedding IC into substrate technology received the Samsung Technology award in 2008.

He has published more than 220 papers in various journals and conference proceedings and his work has been well accepted by the industry and academic community. In addition, he holds 14 US patents. He has received over 8.5 million US dollars research funding as a Principal Investigator from notable sponsors, including National Science Foundation (NSF), National Science and Technology Board (NSTB) Singapore, Korea Institute of Industrial Technology (KITECH), Ministry of Knowledge Economy, Republic of Korea, Samsung, Dow-Corning, Intel, AMOCO Electronics, and Philips. He also has been providing technical consulting services to many companies including Intel, ESI, TriQuint, Cascade Micro-Tech, Maxim Integrated, Samsung, and TESSERA.

He is an editorial advisory board member for the Journals of Soldering and Surface Mount Technology since 1998. He served as an editorial board member for the Journal of Finite Elements in Analysis and Design from 2000 to 2004. He also served as an associate editor for ASME: Journal of Electronic Packaging from 2001 to 2004. He has been served as a conference chair or an international advisory committee member for many international conferences and symposiums. He also received the Jefferson Goblet Paper Award at the 32nd SDM Conference in 1991 and the Roger A. Strehlow Memorial Award from UIUC in 1992, respectively. He also received Intel Learning Star Award in 2009 and Hedong Technology Award in 2007, respectively.