Gerald Recktenwald's Publications

Books

G.W. Recktenwald, Numerical Methods with MATLAB: Implementations and Applications, 2000, Prentice-Hall, Upper-Saddle River, NJ.

Reviewed Conference Proceedings

B. Bhatnagar and G. W. Recktenwald "Design of the Inlet for an Open Circuit Wind Tunnel for Testing Full Scale Class Eight Trucks", Paper number FEDS 2004-56354, 2004 ASME Heat Transfer/Fluids Engineering Summer Conference Charlotte, North Carolina, July 11-15, 2004
[Abstract]   [Presentation slides (PDF, 9.7 MByte)]

S. L. Kernazhitskiy and G. W. Recktenwald "Numerical Modelling of a Large Quench Tank", Paper number FEDS 2004-56419, 2004 ASME Heat Transfer/Fluids Engineering Summer Conference Charlotte, North Carolina, July 11-15, 2004
[Abstract]

J.M. Leland, and G.W. Recktenwald, "Optimization of Phase Change Heat Sink for Extreme Environments", Proceedings of Semitherm XIX, Santa Clara, CA, March 2003.
[Abstract]   [PDF version of complete paper].

G.W. Recktenwald, "Prediction of Device Temperatures with Depth-Averaged Models of the Flow Field Over Printed Circuit Boards", in Cooling and Thermal Design of Electronic Systems, pp. 129-136, C. Amon, ed., HTD-Vol. 319, 1995, ASME, New York.
[Abstract]   [PDF version of complete paper].

G.W. Recktenwald, "Using the PCBCAT to Model Convective Heat Transfer from Electronic Devices on Printed Circuit Boards", in Cooling and Thermal Design of Electronic Systems, pp. 137-144, C. Amon, ed., HTD-Vol. 319, 1995, ASME, New York.
[Abstract]   [PDF version of complete paper].

G.W. Recktenwald and P. Gotseff, "A Visualization Tool for CFD Models of Convectively Cooled Printed Circuit Boards", Proceedings of 1995 ASME National Heat Transfer Conference, vol. 9, G. Vradis, and K.A. Woodbury, eds., 1995, ASME, New York.
[Abstract]   [PDF version of complete paper].

Ma, Y. and G.W. Recktenwald "Simplified simulation of convective heat transfer from an array of heated blocks in a rectangular channel", in Advances in Electronic Packaging 1993, Proceedings of the 1993 ASME International Electronics Packaging Conference, P.A. Engel, and W.T. Chen, eds., 1993, ASME, New York.
[Abstract].

G.W. Recktenwald, and P. Butler, "Depth-averaged modeling of convective heat transfer from printed circuit boards", ASME paper no. 91-WA-EEP-36, presented at the 1991 ASME Winter Annual Meeting, December, Atlanta, GA.
[Abstract].

G.W. Recktenwald, J.W. Ramsey, and S.V. Patankar, "The impact of piston-induced flow on hysteresis loss on Helium-filled gas springs", in Numerical Heat Transfer, ASME HTD-Vol. 130, K.Vafai and J.L.S. Chen (eds.), presented at AIAA/ASME Thermophysics and Heat Transfer Conference, Seattle, WA, June 1990.
[Abstract].

G.W. Recktenwald, J.W. Ramsey, and S.V. Patankar, "Toward robust implementation of SIMPLE-based algorithms for unsteady and highly turbulent flows", in Forum on Unsteady Flow, ASME FED-vol.83, P.H. Rothe (ed.), 1989.
[Abstract].

G.W. Recktenwald, J.W. Ramsey, and S.V. Patankar, "Predictions of heat transfer in compressor cylinders", Proceedings of the 1986 International Compressor Engineering Conference at Purdue University, with J.W. Ramsey and S.V. Patankar.

Other Conference Papers

S.S. Berger, and G.W. Recktenwald, "Development of an Improved Model for Piezo-Electric Driven Ink Jets", Proceedings of IS&T NIP 19 International Conference on Digital Printing Technologies, Society for Imaging Science and Technology, Sept. 28-Oct. 3, 2003, New Orleans, Louisiana.
[Abstract]   [PDF version of complete paper].

S.V. Patankar, K.A. Kelkar, and G.W. Recktenwald, "Microcomputer software for heat transfer education", Proceedings of 1987 IBM Academic Information Systems University Conference, Boston, MA, June 1987.

Papers in preparation