G.W. Recktenwald, Numerical Methods with MATLAB: Implementations and Applications, 2000, Prentice-Hall, Upper-Saddle River, NJ.
B. Bhatnagar and G. W. Recktenwald
"Design of the Inlet for an
Open Circuit Wind Tunnel for Testing
Full Scale Class Eight Trucks",
Paper number FEDS 2004-56354,
2004 ASME Heat Transfer/Fluids Engineering Summer Conference
Charlotte, North Carolina,
July 11-15, 2004
[Abstract]
[Presentation slides (PDF, 9.7 MByte)]
S. L. Kernazhitskiy and G. W. Recktenwald
"Numerical Modelling of a Large Quench Tank",
Paper number FEDS 2004-56419,
2004 ASME Heat Transfer/Fluids Engineering Summer Conference
Charlotte, North Carolina,
July 11-15, 2004
[Abstract]
J.M. Leland, and G.W. Recktenwald,
"Optimization of Phase Change Heat Sink for Extreme Environments",
Proceedings of Semitherm XIX, Santa Clara, CA, March 2003.
[Abstract]
[PDF version of complete paper].
G.W. Recktenwald, "Prediction of
Device Temperatures with Depth-Averaged Models of the Flow Field Over Printed
Circuit Boards", in Cooling and Thermal Design of Electronic Systems,
pp. 129-136, C. Amon, ed., HTD-Vol. 319, 1995, ASME, New York.
[Abstract]
[PDF version of complete paper].
G.W. Recktenwald, "Using the
PCBCAT to Model Convective Heat Transfer from Electronic Devices on Printed
Circuit Boards", in Cooling and Thermal
Design of Electronic Systems, pp. 137-144, C. Amon, ed., HTD-Vol. 319,
1995, ASME, New York.
[Abstract]
[PDF version of complete paper].
G.W. Recktenwald and P. Gotseff,
"A Visualization Tool for CFD Models of Convectively Cooled Printed Circuit
Boards", Proceedings of 1995 ASME National Heat Transfer Conference, vol. 9, G.
Vradis, and K.A. Woodbury, eds., 1995, ASME, New York.
[Abstract]
[PDF version of complete paper].
Ma, Y. and G.W. Recktenwald
"Simplified simulation of convective heat transfer from an array of heated
blocks in a rectangular channel", in Advances
in Electronic Packaging 1993, Proceedings of the 1993 ASME International
Electronics Packaging Conference, P.A. Engel, and W.T. Chen, eds., 1993, ASME,
New York.
[Abstract].
G.W. Recktenwald, and P. Butler, "Depth-averaged modeling of
convective heat transfer from printed circuit boards", ASME paper no.
91-WA-EEP-36, presented at the 1991 ASME Winter Annual Meeting, December,
Atlanta, GA.
[Abstract].
G.W. Recktenwald, J.W. Ramsey, and S.V. Patankar, "The impact of
piston-induced flow on hysteresis loss on Helium-filled gas springs", in
Numerical Heat Transfer, ASME HTD-Vol.
130, K.Vafai and J.L.S. Chen (eds.), presented at AIAA/ASME Thermophysics and
Heat Transfer Conference, Seattle, WA, June 1990.
[Abstract].
G.W. Recktenwald, J.W. Ramsey, and S.V. Patankar, "Toward robust
implementation of SIMPLE-based algorithms for unsteady and highly turbulent
flows", in Forum on Unsteady Flow,
ASME FED-vol.83, P.H. Rothe (ed.), 1989.
[Abstract].
G.W. Recktenwald, J.W. Ramsey, and S.V. Patankar, "Predictions of heat transfer in compressor cylinders", Proceedings of the 1986 International Compressor Engineering Conference at Purdue University, with J.W. Ramsey and S.V. Patankar.
S.S. Berger, and G.W. Recktenwald,
"Development of an Improved Model for Piezo-Electric Driven Ink Jets",
Proceedings of IS&T NIP 19 International Conference on Digital Printing Technologies,
Society for Imaging Science and Technology, Sept. 28-Oct. 3, 2003, New Orleans, Louisiana.
[Abstract]
[PDF version of complete paper].
S.V. Patankar, K.A. Kelkar, and G.W. Recktenwald, "Microcomputer software for heat transfer education", Proceedings of 1987 IBM Academic Information Systems University Conference, Boston, MA, June 1987.