Jason Leland and Gerald Recktenwald
Presented at SEMI-THERM XIX 11-13 March 2003, San Jose, CA
Nineteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Results of numerical optimization are reported for a phase change heat sink used to cool electronic equipment in extreme environments. The heat sink consists of a conventional, extruded aluminum sink embedded in a block of phase change material. This type of heat sink is used in infrared cameras carried by fire fighters into burning buildings.
Optimization of the geometry of the heat sink assembly involves determination of the fin length, the fin thickness, and the base thickness that maximizes the time time before the base of the heat sink reaches a critical temperature. The numerical model is briefly described, and representative results of the simulation are presented. The optimum design for a given combination of heat load, conductance to ambient, and phase change material is discussed. The model can easily be applied to other geometries, heat loads, and material properties.