1. Select the Package option. The Package graphical interface appears (see Figure 17).
          Figure 17. The Package graphical interface

          The Package graphical interface is divided into four quadrants. The drawings are not true third-angle projections and have been scaled to maximize the size of the graphics and improve visibility. The length dimensions are always drawn along the x-axis and the width dimensions along the y-axis.

          1. The top left quadrant can be toggled to present views of the top, x, and y sections and is view-only.
          2. The bottom left quadrant can be toggled to present views of the top, x, and y sections and is view-only. To toggle, select the quadrant title field and press Enter.
          3. The top right quadrant presents a window in which you assign or edit package parameters or designs.
          4. The bottom right quadrant presents a window in which you can choose among a range of values for some parameters.
          The Package screen also contains three options:
          1. Design Aids helps you to choose an interconnect, substrate, and mounting technology and package type.
          2. Zoom enables you to view enlarged views.
          3. Save enables you to save your design.
          6.3.1 The Design Aids Option

          Interconnection, substrate, and mounting and package technology selection is a complex process involving many tradeoffs. No one technology addresses all the requirements for any application. The Design Aids option provides a starting point for selecting the technologies that best meet your operating criteria by enabling you to compare the limiting characteristics of each technology. You can then choose a technology, or refer to other information provided in the display, such as technology cost or availability, to help narrow your choices. After you choose the technologies, you will input them in other Design options as you design the package. You should understand that Design Aids merely lists your choices—you do not assign them in this option, but in the other Design options. If you already know which technologies you will use, go to the Constraints option, Section 6.3.4.1, and start designing. Design Aids contains three commands:

          1. Inner-interconnect helps you to choose an interconnect technology.
          2. Substrate helps you to choose a substrate technology.
          3. Mounting Technology and Package Type helps you to choose mounting and package technologies.
          6.3.1.1 The Inner-interconnect Command 

          Inner-interconnect refers to the interconnects connecting the die(s) to the package.

          1. Select the Inner-interconnect command from the Design Aids menu. The window in Figure 18 appears. It is divided into four sections:
          Figure 18. The Inner-interconnect command
          1. The Interconnect Technology section lists the five interconnect technologies available: wirebond, TAB, flip-TAB, flip-chip, and HDI. These fields are not selectable.
          2. The quantitative attributes section lists the technologies’ quantitative characteristics. These fields are selectable.
          3. The information section provides information to help you choose technologies. You must scroll down to view all the data. These fields are not selectable.
            Go to the end of this section to read definitions of the field catagories.
          1. Select attribute values in the qualitative and quantitative fields that meet your minimum design criteria. Upon selection, the values are highlighted in blue. As you select attribute values, all interconnect technologies meeting them are highlighted in yellow. Because CADMP-II highlights all technologies that accommodate a value range, some ranges are valid for more than one technology. For example, if the minimum chip pitch can be 10-15, all five technologies are highlighted when you select the 10-15 field. Or, if your lowest maximum I/O count can be 700, three technologies are highlighted if you select a value 700 or lower. Selecting a value a technology cannot meet unhighlights it. For example, in Figure 19, three technologies are unhighlighted be cause they cannot support a >700 maximum I/O count. You can sometimes unhighlight a value and a technology you are not interested in by selecting its range. For example, in Figure 20, selecting the 5 value for mutual inductance unhighlighted the Wire Bond technology. Most technology choices are eliminated as you finish choosing attribute values.

            2.  
            Figure 19. Technologies unhighlighted in range
            Figure 20. Unhighlighting single range

             

          2. Often, no technologies meet all attribute requirements, and the ones that best meet them are listed. View the Information section to help narrow the choices. Make a note of your choice, which you will input in the Design options.
          6.3.1.2 The Substrate Command  
          1. Select the Substrate command from the Design Aids menu. The window in Figure 22 appears. It does not contain a qualitative attributes category but otherwise operates as described in Section 6.3.1.1.
          Figure 22. The Substrate command

          6.3.1.3    The Mounting Technology and Package Type Command

          1. Select the Mounting Tech. and Pack. Type command from the Design Aids menu. The window in Figure 23 appears and operates as in Section 6.3.1.1. The top header lists two mounting technology categories: insertion mounts and surface mounts. Insertion mounts include SIP(Single In-line Package), DIP (Dual In-line Package), and PGA (Pin Grid Array) packages. Surface mounts include SO (Small Outline) and FP (Flat Pack) packages. The package names are at the bottom of the window in blue.
           
          Figure 23. Mounting Tech. and Pack. Type command