Date: Tuesday, May 31 2011
Time: 4:40P 6:30P
Location: URBN 204
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M. Kitano et. al. Analysis of Package Cracking During Reflow Solder Process, International Reliability Physics Symposium. 26th Annual Proceedings. pp 90-95. 1988.
A. Nishimura, et. al. Life Estimation for IC Packages Under Temperature Cycling Based on Fracture Mechanics, IEEE Trans. CHMT, Vol. 10, p637 (1987).
S. Peck, "Comprehensive Model for Humidity Testing Correlation," in Proc. 24th Ann. Int'l Reliability Physics Symposium, pp44-50 (1986).
C. G. Shirley and R. C. Blish II, Thin-Film Cracking and Wire Ball Shear in Plastic Dips Due to Temperature Cycle and Thermal Shock, Proceedings of 25th Annual International Reliability Physics Symposium, pp. 238-249 April, 1987.
G. Shirley and C. Hong, "Optimal Acceleration of Cyclic THB Tests for Plastic-Packaged Devices," in Proc. 29th Ann. Int'l Reliability Physics Symposium, pp12-21 (1991)
C. G. Shirley, M. Shell-DeGuzman, Moisture-Induced Gold Bond Degradation of Polyimide-Passivated Devices in Plastic Packages, Proceedings of 31st Annual Reliability Physics Symposium, pp. 217-226, 1993.
C. G. Shirley, THB Reliability Models and Life Prediction for Intermittently-Powered Non-Hermetic Components, Proceedings of 32nd Annual Reliability Physics Symposium, pp. 72-78, 1994.
C. G. Shirley, A New Generation HAST System, Non-proprietary Report to Intel, Despatch Industries, and Micro-Instrument Corp. describing learnings during development of NG HAST. December, 1994.
JEDEC. For up-to-date standards, visit the web site (free membership).