Plastic Package Reliability  ECE 414/514

Class Information

Date: Tuesday, May 31 2011
Time: 4:40P – 6:30P
Location: URBN 204

Presentation Material

Slide format.
Handout format.

These materials have been superseded by slides and videos (parts 1, 2, 3) prepared for an ASQ Reliability Division webinar on August 2-4, 2011.


D. Edwards et. al. “Shear Stress Evaluation of Plastic Packages” Components, Hybrids, and Manufacturing Technology, IEEE Transactions on , vol.10, no.4, pp. 618- 627, Dec 1987

I. Fukuzawa, et. al.  “Moisture Resistance Degradation of Plastic LSIs by Reflow Solder Process,”  IRPS, 1988

O. Hallberg and D. S. Peck, "Recent Humidity Accelerations, A Base for Testing Standards,"  Quality and Reliability Engineering International,  Vol. 7  pp169-180  (1991)

M. Kitano et. al.  “Analysis of Package Cracking During Reflow Solder Process”, International Reliability Physics Symposium. 26th Annual Proceedings.  pp 90-95.  1988.

A. Nishimura, et. al. “Life Estimation for IC Packages Under Temperature Cycling Based on Fracture Mechanics,”  IEEE Trans. CHMT, Vol. 10, p637 (1987).

S. Peck, "Comprehensive Model for Humidity Testing Correlation," in Proc. 24th Ann. Int'l Reliability Physics Symposium, pp44-50 (1986).

C. G. Shirley and R. C. Blish II, “Thin-Film Cracking and Wire Ball Shear in Plastic Dips Due to Temperature Cycle and Thermal Shock”, Proceedings of 25th Annual International Reliability Physics Symposium, pp. 238-249 April, 1987.

G. Shirley and C. Hong, "Optimal Acceleration of Cyclic THB Tests for Plastic-Packaged Devices,"  in Proc. 29th Ann. Int'l Reliability Physics Symposium, pp12-21 (1991)

C. G. Shirley, M. Shell-DeGuzman, “Moisture-Induced Gold Bond Degradation of Polyimide-Passivated Devices in Plastic Packages,” Proceedings of 31st Annual Reliability Physics Symposium, pp. 217-226, 1993.

C. G. Shirley, “THB Reliability Models and Life Prediction for Intermittently-Powered Non-Hermetic Components,” Proceedings of 32nd Annual Reliability Physics Symposium, pp. 72-78, 1994.

C. G. Shirley,  “A New Generation HAST System”, Non-proprietary Report to Intel, Despatch Industries, and Micro-Instrument Corp. describing learnings during development of NG HAST.  December, 1994.

MIL-STF-883F.  “Test Method Standard, Microcircuits”  United States Department of Defense  June 2004 (List of MIL standards).

JEDEC.  For up-to-date standards, visit the web site (free membership).