Predesigned interconnects with file names are chosen at various points in the design process, such as in the element screen, and the substrate screen. To design the interconnects and give them a file name for selection in the other screens, use the interconnect command in the upper right quadrant of the package designer.

When you select the Interconnects command, there is no action in the lower right quadrant. Use Design Aids, Section 6.3.1.1, to help select a technology.

If you invoke the Interconnects buttons but have not defined an environment in Mission Profile, the error message "There is no active environment" may appear. Go to Mission Profile, define an environment, and returning to editing/designing the interconnects.

Editing the Interconnects parameters

The Interconnects Option screen shown in Figure 56, is accessible from the Interconnect Design Button in the Package Design Screen. It contains two options:

· Design enables you to select and edit an interconnect design.
· Library enables you to edit or create new interconnect designs.

6.3.4.12.1 The Design Option

• Select the Design option in the Interconnect screen. A menu appears, containing a Die Interconnect and a Substrate Interconnect entry (see Figure 56).
• Select the interconnect type you want to use. A Select Die window appears (Figure 57).
Figure 57. Design button response  
• Select the die you want to design the interconnect for and select the Edit button. A parameter window appears (see Figure 58). The various fields and windows are defined under the Library Option.
Figure 58. Defining bond window  
• After editing, select the Accept button to confirm changes, Cancel to cancel and return to the Select Die windo
• Select Close to close the select die wirebond.

Use the Library option to edit or create wirebonds. The option contains four commands:

· Open activates existing interconnect files.
· New enables you to create new interconnect files.
· Save As enables you to save files under a new name.
· Erase enables you to delete files.
 

6.3.4.12.2.1 The Open Command

• Select the Open command in the Library menu. A window listing interconnect technologies appear
• Select a technology and press Open. A window listing wirebonds appear
• Select a wirebond type. To view the technology’s parameters, select the Parameter button. A read only parameter. To edit the parameter select OK. An edit parameter window appears.

Edit the fields in the window if you wish. Select the Accept button to accept the new data, Cancel to cancel. You return to the Interconnect Design screen.

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