Journal Paper      Conference Paper        Book      thesis

Publications

Journal Paper 

 

bullet Kim, H.H., Choi, S.H., Shin, S.H., Lee, Y. K., Choi, S. M., Yi, Sung, Thermal transient characteristics of die attach in high power LED PKG, Microelectronics Reliability, Volume 48, Issue 3, Pages 445-454, March 2008.
bullet Gao, S., Hong, J.P., Kim, J.S., Yoo, D.J., Jeong, T., Choi, S., Yi, Sung, Development of an Ultra-slim System in Package (SiP), Journal of the Microelectronics and Packaging Society, Korea, Vol. 15, No. 1, p.7-18, 2008.
bullet Ling, S.-F.; Zhang, D.; Yi, Sung; Foo, S. W., Real-Time Quality Evaluation of Wire Bonding Using Input Impedance, IEEE Transactions on Electronics Packaging Manufacturing, Volume 29, Issue 4, p. 280 – 284, Oct. 2006.
bullet Su, Fei, Chian, K. S., Yi, Sung, An Optical Characterization Technique for Hygroscopic Expansion of Polymers and Plastic Packages. Microelectronics Reliability, 46(2-4): 600-609, 2006.
bullet Beldica, Cristina E., Hilton, Harry H., Yi, Sung, Viscoelastic Damping and Piezo-electric Control of Structures Subjected to Aerodynamic Noise, Technical Acoustics, ISSN 1819-2408, 2006.
bullet Liu, L., Yi, Sung, Ong, L. S., Chain, K. S., Osiyemi, S., Lim, S. H., Su, F., Chemo-thermal Modeling and Finite Element Analysis for Microwave Cure Process of Underfill in Flip-Chip Packaging, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 4, pp. 355-362, October 2005.
bullet Su, Fei, Chian, Kerm Sin, Yi, Sung, and Dai, Fulong, Development and instrumentation of an integrated three–dimensional optical testing system for application in integrated circuit packaging, Review of Scientific Instruments, 76, 2005.
bullet Hilton, H. H. and Yi, Sung, Generalized Viscoelastic 1-DOF Deterministic Nonlinear Oscillators, Nonlinear Dynamics Vol. 36, pp. 281–298, 2004.
bullet Yi, Sung and Gao, Shan, Thermo-mechanical Behavior of Cracked Ti-55.4%Ni Shape Memory Alloys under Mechanical Loading, Key Engineering Materials, Vols, 261-263, pp. 903-912, 2004.
bullet Lie Liu, Sung Yi, Lin Seng Ong and Kerm Sin Chian, Finite element analysis for microwave cure of underfill in flip chip packaging, Thin Solid Films, Volumes 462-463, September 2004, Pages 436-445
bullet Tee, T. T., Yi. S., Shen, X, Su, F., and Zhong Z., Comprehensive Numerical and Experimental Analysis of Matrix TFBGA Warpage, Journal of Surface Mounting Technology, Volume 17 Issue 2, pp. 11-17, 2004.
bullet Su, F. Yi, S., and Chian, K. S., A Simple Method to Unwrap the Geometrically Discontinuous Phase Map and its Application in the Measurement of IC Package, Optics and Lasers in Engineering, Vol. 41,  pp. 463–473, 2004..
bullet Xiong, C. Y., Zhang, J., Li, M., Fang, J., and Yi, S., Fourier and wavelet transform analysis of Moire Fringe Patterns in Electronic Packaging, Microelectronics International, Vol. 21, No.2, pp. 45-51, 2004.
bullet Chia, Y. C., Yam, H. S., Lim, S. H., Chian, K. S., Yi, S., Chen, W. T., An Optimization Study of Underfill Dispensing Volume, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 3, July 2003, pp.205-210.
bullet Gao, S. and Yi, S., Experimental Study on the Anisotropic Behavior of Textured NiTi Pseudoelastic Shape Memory Alloys, Materials Science and Engineering A, Volume 362, Issues 1-25 December 2003 , Pages 107-111.
bullet Gao, S. and Yi, S. Anisotropic  Transformation Behavior Study of Texutred NiTi Shape Memory Alloys, Journal of Materials Science, 2002 (submitted).
bullet W.D. van Driel, G.Q. Zhang, J.H.J. Janssen, L.J. Ernst, F. Su, K.S. Chian, S. Yi, Prediction and verification of process induced warpage of electronic packages, Microelectronics Reliability Vol. 43 pp. 765–774, 2003.
bullet Gao, S. and Yi, S., Experimental Study on the Anisotropic Behavior of Textured NiTi Pseudoelastic Shape Memory Alloys, Material Science and Engineering A (CKOC1314), (submitted on Nov. 2001) Carl C. Koch, Editor Material Science and Engineering North Carolina State University, BOX 7907, Raleigh, NC 27695-7907, USA.
bullet Gao, S. and Yi, S. Martensite Transformation Behavior of Cracked Ti-55.4%Ni Shape Memory Alloys under Mechanical Loading, International Journal of Fracture, 2002 (submitted).
bullet Gao, S. and Yi, S. Anisotropic  Transformation Behavior Study of Texutred NiTi Shape Memory Alloys, Journal of Materials Science, 2002 (submitted).
bullet Gao, S. and Yi, S. Investigation on the Stress-Induced Matensitic Transformation Behavior of Cracked Ti-55.4%Ni Shape Memory Alloys, Materials Science and Engineering A, 2002 (submitted).
bullet Yi, S, Luo G. X. and Chian, K. S., Viscoplastic Micro-Deformation Mechanism of Eutectic Solders, accepted by ASME: Journal of Electronic Packaging, Vol 124, pp. 92-96, 2002.
bullet Zhong, C. H.,, Yi, S. and Whalley, D. C., Solder Ball Failure Mechanisms in Plastic Ball Grid Array Packages, Soldering & Surface Mount Technology, Vol. 14, No. 2, pp. 40-50, 2002.
bullet Chian, K. S. and Yi, S.,  Synthesis and Characterization of an Isocyanurate-oxazolidone Polymer:  Effect of Stoichiometry, Journal of Applied Polymer Science, Volume 82, Issue 4, pp. 879-888, 2001.
bullet Yi, S., Ling S. F., Ying, M., Time Domain Analysis of Acoustic-Structures Interaction Problems, The Journal of Acoustics Society of American, 109 (6), pp. 2762- 2770, 2001.
bullet Shen, L. and Yi, S., An Effective Inclusion Model of Effective Elastic Moduli of Microcracked Solids, International Journal for Solids and Structures, Vol. 38, pp. 5789-5805, 2001.
bullet Yi, S., Gao, S. and Shen, L.,  Fracture Analysis of Shape Memory Alloys under Mixed Mode Loading ,  International Journal for Solids and Structures, Vol. 38 pp. 4463-4476, 2001.
bullet Yi, S., Kim, J. K., Yue, C. Y. and Hsieh, J. H., Adhesion Strengths of Epoxy Molding Compounds to Gold Plated Copper, The Journal of Adhesion, Vol. 73, pp. 1-17, 2000.
bullet Yi, S., Kim, J. K., Yue, C. Y. and Hsieh, J. H., Bonding Strengths at Plastic Encapsulated-Gold Plated Copper Leadframe Interface, Microelectronics Reliability, Vol. 40, pp.1207-1214, 2000.
bullet Yi, S. and Sze, K. Y.,  A Finite Element Formulation for Composite Laminates  with Smart Constrained Layer Damping, Advances in Engineering Software, pp 529-537, Vol. 31 (8-9), Aug. 2000.
bullet Sze, K. Y., Yao, L. and Yi, S., A Hybrid-Stress ANS Solid-Shell Element and Its Generalization for Smart Structure Modeling - Part II: Smart Structure Modeling, International Journal for Numerical Methods in Engineering, Vol. 48, pp. 565-582, 2000.
bullet Yi, S. and Gao, S., Fracture Toughness of Shape Memory Alloys due to Martensite Transformation, International Journal for Solids and Structures, Vol. 37, pp.5315-5327, 2000.
bullet Shen, L. and Yi, S., New Solutions for Effective Elastic Moduli of Microcracked Solids, International Journal for Solids and Structures, Vol. 37, pp. 3525-3534, 2000.
bullet Yi, Sung, Shen, Lianxi, Kim, Jang Kyo and Yue, Chee Yoon, A Failure Criterion for Debonding between Encapsulants and Leadframes, Journal of Adhesion Science and Technology, Vol. 14, No. 1, pp. 93-105, 2000.
bullet Chia, Y.C., Lim, S.H., Chian, K. S., Yi, S. and Chen, W.T., An Optimization Study of Underfill Dispensing Process, International Journal of Microcircuits & Electronic Packaging, Vol. 22, No. 4, 1999, pp. 345-352.
bullet Yi, S., Ling, S. F. and Ying, M.,  Large Deformation Finite Element Analyses of Composite Structures Integrated with Piezoelectric Sensors and Actuators, Finite Element Analyses and Design, UK, Vol. 35, pp. 1-15,  1999.
bullet Yuan, W. Q. and Yi, S.,  Pseudo-elastic Strain Estimation of Textured TiNi-based Shape Memory Alloys, Materials Science and Engineering Part. A, pp. 439-448, 1999.
bullet Yuan, W. Q. and Yi, S. Determination of Orientation Distribution Function in the TiNi-based SMA Parent and Martensite Phases, Scripta Materialia, 41(12), pp. 1319-1325, 1999.
bullet Xiao, Z. M., Guo, J. Y., Yi, Sung, Stress Intensity Factors for Ring-Shaped Crack Surrounded by Spherical Inclusions, Theoretical and Applied Fracture Mechanics, Vol. 32, pp. 147-155, 1999.
bullet Gao, S. and Yi, S. Martensite Transformation Behavior of Cracked Ti-55.4%Ni Shape Memory Alloys under Mechanical Loading, International Journal of Fracture, 2002 (submitted).
bullet Yi, Sung, Yue, Chee Yoon, Hsieh, Jang-Hsing, Fong, Liwha, Lahiri, Syamal K., ``Effects of Oxidation and Plasma Cleaning on Adhesion Strength between Copper Leadframes and Molding Compounds’’, Journal of Adhesion Science and Technology, Vol. 17, No. 7, pp.789-804, 1999.
bullet Yi, S., Ling, S. F.,Ying, M., Hilton, H. H. & Vinson, J. R., "Finite Element Formulation of Anisotropic Coupled Piezo-hygro-thermo-viscoelastic-dynamic Problems," International Journal for Numerical Methods in Engineering, Vol. 45, pp.1531-1546, 1999.
bullet Hsieh, J.H., Fong, L.H., Yi, S., Metha, G., Plasma cleaning of copper leadframe with Ar and Ar/H2 gases, Surface and Coatings Technology, Vol. 112, No. 1-3, pp. 245-249, 1999.
bullet Hilton, H. H. and Yi, S., "Stochastic Delamination Simulations of Non-linear Viscoelastic Composites During Cure’’, Journal of Sandwich Structures & Materials, Vol. 1, pp. 111-127, April 1999.
bullet Zhong, C. H. and Yi, Sung, ``Solder Joint Reliability of Plastic Ball Grid Array Packages,’’ Soldering and Surface Mount Technology, UK, Vol. 11, No. 1, pp.44-48, 1999.
bullet Yi, S. and Sze, K. Y., ``Cooling Rate Effect on Post Cure in Plastic Encapsulated IC Packages," Transaction of ASME: Journal of Electronic Packaging, Vol. 120, pp. 385-390, 1998.
bullet Yi, Sung, Ling, Shih-Fu, and Ying, Ming, ``Finite Element Analysis of Composite Structures with Smart Constrained Layer Damping’’, Advances in Engineering Software, UK, Vol. 29, No. 3-6, pp. 265-271, 1998.
bullet Ying, M., Zou, Q., and Yi, Sung, ``Finite Element Analysis of Silicon Condenser Microphones with Corrugated Diaphragms’’, Finite Elements in Analysis and Design, Vol. 30, pp. 163-173, 1998.
bullet Yi, Sung and Sze, Kam Yim, ``Finite Element Analysis of Moisture Distribution and Hygrothermally Induced Stresses in TSOP Packages", Finite Elements in Analysis and Design, Vol. 30, pp. 65-79, 1998.
bullet Yi, S. and Hilton, H. H., ``Effects of Thermo-mechanical Properties of Composites on Viscosity, Temperature and Degree of Cure in Thick Thermosetting Composite Laminates during Curing Process," Journal of Composite Materials, Vol. 32, No. 7, pp. 600- 622, 1998.
bullet Yi, S., Ahmad, M.F. and Hilton, H.H., "Nonlinear Viscoelastic Stress Singularies near Free Edges of Unsymmetrically Laminated Composites", International Journal for Solids and Structures, Vol. 35, pp.3221-327, 1998.
bullet Yi, S., Hilton, H. H. and Ahmad, M. F., "Cure Cycle Simulations of Composites with Temperature and Cure Dependent Anisotropic Viscoelastic Properties and Stochastic Delaminations’’, Mechanics of Composite Materials & Structures, Vol. 5, pp.81-101, 1998.
bullet Hilton, H. H. and Yi, S., "The Significance of Anisotropic Viscoelastic Poisson’s Ratio Stress and Time Dependencies," International Journal for Solids and Structures, Vol. 35, pp. 3081-3095, 1998.
bullet Zou, Q., Tan, Z., Wang, Z., Lin, R., Yi, S., Gong, H., Lim, M., Liu Litian and Li Zhijian, "A Novel Integrated Silicon Capacitive Microphone", IEEE/ASME Journal of Microelectromechanical Systems, Vol. 7, pp. 310-315, 1997.
bullet Zou, Q., Tan, Z., Wang, Z., Lin, R., Yi, S., Gong, H., Lim, M., Li, Zhijian and Liu, Litian, "A Study on Corrugated Diaphragms for High-sensitivity Structures", Journal of Micromech. Microeng. Vol. 7, pp. 310-315, 1997.
bullet Yi, Sung, Goh, J. S. and Yang, J. C., "Residual Stresses in Plastic IC Packages During Surface Mounting Process Preceded by Moisture Soaking Test," IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, USA, Vol. 20, No. 3, March 1997, pp. 247-255.
bullet Yi, Sung and Hilton, Harry H., "Free Edge Stresses in Elastic and Viscoelastic Composite Laminates under Uniaxial Extension, Bending and Twisting," ASME: Journal of Engineering Materials and Technology, 119:266-272, 1997.
bullet Yi, Sung, "Finite Element Analysis of Free Edge Stresses in Nonlinear Viscoelasitc Composites Under Uniaxial Extension, Bending and Twisting", International Journal for Numerical Methods in Engineering, UK, Vol. 40, pp. 4225-4238, 1997.
bullet Sze, K. Y., Yi, Sung, and Tay, M. H., "An Explicit Hybrid Stabilized Eighteen-Node Solid Element for Thin Shell Analysis", International Journal for Numerical Methods in Engineering, UK, July, Vol. 40, pp. 1839-1856, 1997.
bullet Yi, S., "Effects of a Time-dependent Interfacial Layer on the Thermomechanical Response of Polymer Matrix Composites", Journal of Materials Processing Technology, V67, N1-3, P183-188, May 1997.
bullet Yi, S., Ahmad, M. F., and Hilton, H. H., "Finite Element Algorithms for Dynamic Simulation of Viscoelastic Composite Shell Structures Using Conjugated Gradient Method on Coarse Grained and Massively Parallel Machines", International Journal for Numerical Methods in Engineering, UK, Vol. 40, pp.1857-1875, 1997.
bullet Yi, S., Hilton, H. H. and Ahmad, M. F., "Finite Element Approach for Cure Simulation of Thermosetting Matrix Composites", Computers and Structures, UK, Vol. 64, No. 1-4, pp. 383-388, 1997.
bullet Hilton, H. H., Yi, S. and Danyluk, M. J., "Probabilistic Analysis of Delamination Onset in Linear Anisotropic Elastic and Viscoelastic Composite Columns'', International Journal of Reliability Engineering and System Safety, Vol. 56, pp. 237-248, 1997.
bullet Yi, S., Ahmad, M. F. and A. Ramesh, "Data Parallel Finite Element Computation for Thermo-Viscoelastic Composite Structures", Advances in Engineering Software, UK, OCT-NOV, Vol. 27, N1-2, pp.97-102. ISSN 0965-9978, 1996.
bullet Swellam, M., Yi, S., Ahmad, M. F. and Huber, L., ``Mechanical Properties of Cellular Materials I, Linear Analysis of Hexagonal Honeycombs," Journal of Applied Polymer Science, Vol. 63, pp. 383-393, 1997.
bullet Yi, S., Hilton, H. H. and Ahmad, M. F., "Nonlinear Thermo-viscoelastic Analysis of Interlaminar Stresses in Laminated Composites", (AIAA Paper 94-1637), ASME: Journal of Applied Mechanics, USA, pp. 218-224, Vol. 63, March 1996.
bullet Yi, S., Ahmad, M. F., and Hilton, H. H., "Dynamic Responses of Plates with Free Layer Viscoelastic Damping Treatment'', ASME: Journal of Vibration and Acoustics, USA, Vol. 118, pp. 362-367, 1996.
bullet Yi. S. and Hilton, H. H., "Hygrothermal Effects on Viscoelastic Responses of Laminated Composites", Composites Engineering, UK, Vol. 5, No. 2, 1995, pp. 183-193.
bullet Yi, S., Pollock, G., Ahmad, M. F., and Hilton, H. H., "Effective Transverse Young’s Modulus of Composites with Viscoelastic Interphase", AIAA Journal, USA, Vol. 33, No. 8, 1995, pp. 1548-1550.
bullet Yi, S., Pierson, K. H., and Ahmad, M. F., "Parallel Implementation of Dynamic Simulation to Filamentary Composite Structures with General Rate Dependent Damping", Computing Systems in Engineering, UK, Vol. 5, pp. 469-477, 1994.
bullet Yi, S. and Hilton, H. H., "Dynamic Finite Element Analysis of Viscoelastic Composite Plates", International Journal for Numerical Methods in Engineering, USA, Vol. 37, 1994, pp. 4081-4096.
bullet Yi, S., "Thermoviscoelastic Analysis of Delamination Onset and Free Edge Response in Epoxy Matrix Composite Laminates", AIAA Journal, USA, Vol. 31, No. 12, 1993, pp. 2320-2328.
bullet Hilton, H. H. and Yi, S., "Stochastic Thermo-Viscoelastic Delamination Failure Analysis of Laminated Composites", Journal of Composite Materials, USA, Vol. 27, No. 11, 1993, pp.1097-1113.
bullet Hilton, H. H. and Yi, S., "Anisotropic Viscoelastic Finite Element Analysis of Mechanically and Hygrothermally Loaded Composites", Composites Engineering, UK, Vol. 3, No. 2, 1993, pp. 123-135.
bullet Yi, S., Pollock, G., Ahmad, M. F., and Hilton, H. H., "Time Dependent Analysis of Viscoelastic Composite Shell Structures'', Computing Systems in Engineering, UK, Vol. 3, 1992, pp.457-467.
bullet Hilton, H. H. and Yi, S., "Analytic Formulation of Optimum Material Properties for Viscoelastic Damping", Smart Materials and Structures, UK, Vol. 1, 1992, pp.113-122.
bullet Lin, K. Y. and Yi, S., "Analysis of Interlaminar Stresses in Viscoelastic Composites", International Journal of Solids and Structures, UK, Vol. 27, No. 7, 1991, pp. 929-945.

 

Conference Paper

Papers in Conference Proceedings or Symposia, etc.

bullet W. K. Jeung, C. H. Lim, J. L. Yuan, S. W. Park, S. M. Choi, and Sung Yi, Reflowable ISM WLP, Proceedings. of 58th Electronic Components and Technology Conference, (ECTC '08), pp. 297-302, 2008.
bullet Shan Gao, Jupyo Hong, Sanghyun Shin, Yongki Lee, Seogmoon Choi, Sung Yi, Design Optimization on the Heat Transfer and Mechanical Reliability of High Brightness Light Emitting Diodes Package, Proceedings. of 58th Electronic Components and Technology Conference, (ECTC '08), pp. 798-803, 2008.
bullet Kim, Tae Hyun, Yi, Sung, Roh, Jae Ky, Jung, Chang Mu, Guo, Yan Shuang, Do, Jae Chun, Kim, Jin Gu, Gao, Shan, and Hong, Jupyo, Effect of Underfilling Materials and Processes on the Reliability of System in Package, Proceedings of ASME InterPACK '07, IPACK2007-33034, July 8-12, 2007, Vancouver, British Columbia, CANADA.
bullet Gao, Shan, Hong, Jupyo, Choi, Sanghyun, Choi, Seogmoon, Yi, Sung, Heat Transfer Analysis and Design Optimization of Alox High Brightness Light Emitting Diode Package, Proceedings of IPACK2007, ASME InterPACK '07, IPACK2007-33103, July 8-12, 2007, Vancouver, British Columbia, CANADA.
bullet Hong, Jupyo, Gao, Shan, Ha, Job, Yang, Sijoong, Kang, Ingoo, Kim, Taehoon, Choi, Seogmoon, and Yi, Sung, Design Optimization of a Wafer Level Package for Surface Acoustic Wave Filters, Proceedings of ASME InterPACK '07, IPACK2007-33031, July 8-12, 2007, Vancouver, British Columbia, CANADA.
bullet Kim, T. Hoon; Jeung, Won Kyu; Yang, Si Joong; Choi, Seog Moon; Park, Seung Wook; Kim, Hyun Ho; Ha, Job; Park, Mi Jin; Kao, S.; Hong, J.P.; Yi, Sung; Hwang, Jun Sik; Lim, Ji Hyuk; Kim, Woon Bae, Miniaturization and Optimization of RF SAW Filter Using Wafer Level Packaging Technology, Proceedings. of 57th Electronic Components and Technology Conference, (ECTC '07), pp. 574-579, May 29-June 1, 2007.
bullet Jeung, Won Kyu; Shin, Sang Hyun; Hong, Suk Youn; Choi, Seog Moon; Yi, Sung; Yoon, Young Bok; Kim, Hyun Jun; Lee, Sung Jun; Park, Ki Yeol, Silicon-Based, Multi-Chip LED Package, Proceedings. of 57th Electronic Components and Technology Conference, (ECTC '07), pp. 722-727, May 29-June 1, 2007.
bullet Kim, Tae Hyun; Yi, Sung; Seo, Hyoung Ho; Jung, Tae Sung; Guo, Yan Shuang; Doh, Jae Cheon; Okuno, Atsushi; Lee, Seog Hee, New Encapsulation Process for the SIP (System in Package), Proceedings. of 57th Electronic Components and Technology Conference, (ECTC '07), pp. 1420-1424, May 29-June 1, 2007.
bullet Yi, Sung, Daharwal, P.D.; Lee, Y.J.; Harkness, B.R., Study of Low-modulus Die Attach Adhesives and Molding Componds on Warpage and Damage of PBGA, Proceedings. of 56th Electronic Components and Technology Conference, (ECTC '06), pp. 939-945, May 30-June 2, 2006.
bullet Yi, Sung and Su, Fei, A study of hygro-thermal deformations and stresses in FCPBGA, International Symposium on Electronics Materials and Packaging, 2005. EMAP 2005. pp.15 – 20, Dec. 11-14, 2005.
bullet Yi, Sung, Daharwal, P.D.; Lee, Y.J.; Harkness, B.R., Effects of Low-modulus Die Attach Adhesive on Warpage and Damage of BGA, International Symposium on Electronics Materials and Packaging, 2005, (EMAP 2005), Page(s):162 – 168, Dec. 11-14, 2005.
bullet Yi, Sung, Zeyan Yu; Neo, R.; Lee, Y.J., Hygro-thermo-mechanical behavior of molding compounds at elevated environments, Proceedings. of 54th Electronic Components and Technology Conference, (ECTC '04), pp. 180-185, June 1-June 4, 2004.
bullet Zhang, Dong, Ling, Shih-Fu, Yi, Sung, Foo, Say Wee, Improved Monitoring of Ultrasonic Wire Bonding via Input Electrical Impedance, Proceedings of 6th Electronics Packaging Technology Conference, 2004. (EPTC 2004). Page(s): 359 – 363, 2004.
bullet Yi, Sung, Liu, Lie, Park, Sang Kyoo, Cure of Underfills in Flip Chips using Microwave, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2004. Page(s):92 – 98, 12-15 Sept. 2004.
bullet Li, Jianjun and Yi, Sung, Studies on thermal and mechanical properties of PBGA substrate and material construction, Proceedings of 52nd Electronic Components and Technology Conference, 2002. pp. 1595- 1604, 2002.
bullet Yongqing Fu, Hejun Du, Shan Gao, Sung Yi , Mechanical Properties of Sputtered TiNiCu Shape Memory Alloy Thin Films, Proceedings of the second International Conference on Advanced Materials Processing (ICAMP 2002). P. 37-40.
bullet Yi, Sung, Liu, Lie, Chian, Kerm Sin; Su, Fei, Gao, Shan, A study of Microwave Curing Process for Underfill used in Flip Chip Packaging. Part 2: 3D FEM Simulation of Microwave Power Distribution inside Variable Frequency Microwave Oven, Proceedings of International Symposium on Electronic Materials and Packaging, 2001. EMAP 2001. Page(s):29 – 33, 19-22 Nov. 2001
bullet Yi, S., Liu Lie, Chian Kerm Sin and Stephen Osiyemi, Comparison and Kinetic Analysis of Micro-wave and thermal Cure of Underfill Materials, Proceeding of  International Conference on Materials for Advanced Technologies, 1 – 6 July 2001, Singapore.
bullet Yi, S, Luo G. X., Chian, K. S., and Chen, W. T., Viscoplastic Micro-Deformation Mechanism of Eutectic Solders, Proceedings of International Symposium on Electronic Materials and Packaging, Hong Kong, 2000, pp. 183-190.
bullet Chian, K. S., Lim, S. H., Yi, S.and Chen, W. T., Effect of Moisture on the Curing Behavior of Underfills, Proceedings of International Symposium on Electronic Materials and Packaging, Hong Kong, 2000, pp. 289-296.
bullet Szeto, W. K., Xie, M.Y., Kim, J.K., Yuen M.M.F., Tong, P., and Yi, S., Interface Failure Criterion of Button Shear test as a Means of Interface Adhesion Measurement in Plastic Packages, Proceedings of International Symposium on Electronic Materials and Packaging, Hong Kong, 2000, pp. 263-281.
bullet Yi, Sung and Sze, K. Y. Sze, Delamination Analysis of Flip Chip Packages, Proceedings of International Conference on Computational Engineering & Sciences, LA, Aug 21- Aug 25, 2000.
bullet Chia, Y.C., Lim, S.H., Chian, K. S., Yi, S. and Chen, W.T., "An Optimization Study of Underfill Dispensing Process", Interpack 99, June 1999.
bullet Yi, Sung and Neo, Guan Hock, "Hygrothermo-mechanical Behavior of Mold Compound Materials at Elevated Environment", Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, France, ASME, pp. 287-292, 1998.
bullet Yi, Sung and Yue, Chee Yoon, "Hygrothermally Induced Residual Stresses in a Plastic BGA", Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, France, ASME, pp. 271-275, 1998.
bullet Yuan, W. Q. and Yi, S., "Quantitative Texture Analysis and Maximum Recoverable phase transformation strain estimation of TiNiCu memory alloy", Proceeding of National Symposium on Progress in Materials Research, pp. 45-50, Singapore, Mar 1998.
bullet Yuan, W. Q. and Yi, S., "Textures in a dual phase CuZnAl alloy by alternate cold-rolling and annealing", Proceeding of National Symposium on Progress in Materials Research, pp. 393-398, Singapore, Mar 1998.
bullet H. H. Hilton and S. Yi, "Generalized Viscoelastic 1-DOF deterministic nonlinear oscillators", Developments in Mechanics, 19:6.7-6.9, South Dakota School of Mines & Technology, Rapid City, SD, 1998.
bullet H. H. Hilton, J. R. Vinson and S. Yi, "Viscoelastic damping contributions to dynamic piezo-electric responses", Proceedings of the International Modal Analysis Conference XVI, II:1433-1439, 1998.
bullet H. H. Hilton, J. R. Vinson and S. Yi, "Nonlinear anisotropic piezo- electro- thermo- viscoelasticity with applications to composite plates", Proceedings of the 35th Annual Meeting of the Society for Engineering Science, Pullman WA, September 27-30, 1998.
bullet H. H. Hilton and S. Yi, "Creep divergence of nonlinear viscoelastic lifting surfaces with piezo-electric control", Proceedings of the Second International Conference on Nonlinear Problems in Aviation and Aerospace, Daytona Beach, FL, April 29 - May 1, 1998.
bullet C. E. Beldica, H. H. Hilton and S. Yi, "A sensitivity study of viscoelastic, structural and piezo-electric damping for flutter control", Proceedings 39th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, 2:1304-1314, AIAA Paper 98-1848, 1998.
bullet H. H. Hilton and S. Yi, "Large deformation generalized anisotropic nonlinear viscoelastic constitutive relations: mathematical modeling and numerical simulations", Proceedings of the Second International Conference on Mechanics of Time Dependent Materials, 23-25, Pasadena, CA,1998.
bullet C. E. Beldica, H. H. Hilton and S. Yi, "Viscoelastic damping and piezo-electric control of structures subjected to aerodynamic noise", Proceedings of the 4th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 98-2343, 2:805-815, Toulouse, France, 1998.
bullet H. H. Hilton and S. Yi, "Stochastic delamination simulations of nonlinear viscoelastic composites during cure", Proceedings of the Fourth International Conference on Stochastic Structural Dynamics, South Bend, IN, August 6 - 8, 1998.
bullet Hilton, H. H., Vinson, J. R. and Yi, S., "Viscoelastic Damping Contributions to Dynamic Piezo-electric Responses", Proceedings of the International Modal Analysis Conference XVI, II:1433-1439, 1998.
bullet Yi, S. and Hilton, H. H., "Thermo-rheological Behavior of Polymer Matrix Composites During Curing Processes", Proceedings of 37th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, April 15-17, 1997, USA, (AIAA Paper 97-1326).
bullet Hilton, H. H., Vinson, J. R., and Yi, S., "Anisotropic Piezo-Electro-Thermo-Viscoelasticity Theory with Applications to Composites", Proceedings of the Eleventh International Conference on Composite Materials (ICCM-11), Gold Coast, Australia, July 14-18, 1997.
bullet Yi, S. and Hilton, H. H., Ahmad, M. F, "Finite Element Analysis on Coarse Grained Vector Machines of Residual Stresses in Plastic IC Packages During Surface Mounting Processes", HPC 97, Santiago, July, 1997.
bullet Xioa, Z. M., Guo, J. Y. and Yi, Sung, "Moisture-Induced Cracking in Plastic Encapsulant with Voids", Proceedings of the 2nd International Symposium on Electronic Packaging Technology, Shanghai, China, Dec. 9-12, 1996, pp. 450-455.
bullet Yi, S., Ling, S. F., and Ying, M., "Dynamic Response of Composite Shell Structures with Viscoelastic Damping Treatment", Proceedings of the KSME International Session on Dynamics, Systems and Design, 1996 KSME Fall Annual Meeting, Inchon, Korea, Nov. 1-2, pp. 64-71, 1996.
bullet Yi, S. and Hilton, H. H., Ahmad, M. F., and Pierson, K. H., "Cure Cycle Simulations of Composites with Temperature and Cure Dependent Anisotropic Viscoelastic Properties", Proceedings of 36th AIAA/ASME/ASCE/ AHS/ ASC Structures, Structural Dynamics and Materials Conference, April 15-17, 1996, Salt Lake City, Utah, USA, (AIAA-96-1577).
bullet Yi, S., Goh, J. S. and Yang, J. C., "Finite Element Analysis of Hygrothermally Induced Stresses in Plastic Packages", Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA-95), Singapore, pp.11 - 16, Nov. 27 - Dec. 1, 1995.
bullet Yi, S., Hilton, H. H. and Ahmad, M. F., "Curing Process Induced Viscoelastic Residual Stresses in Polymer Matrix Laminated Composites", Proceedings the ASME Materials Division, Vol. 1, pp.65 - 76, 1995.
bullet Yi, S., "Effects of Time-Dependent Interfacial Layer on Thermomechanical Response of Polymer Matrix Composites", Proceedings of International Conference on Mechanics and Material Engineering, pp. 802-808, 1995.
bullet Yi, S., Pierson, K. H., Ahmad, M. F. and Hilton, H. H., "MIMD Implementations of Finite Element Analysis of Polymer Matrix Composite Structures ", Proceedings of Fourth International Conference on Applications of Supercomputers in Engineering, pp. 237-252, June 19-21, 1995, Milan, Italy.
bullet Yi, S. and Hilton, H. H., "Constitutive Relations for Thermosetting Resins During Curing Processes'', Proceedings of 36th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, April 10-12, 1995, New Orleans, Louisiana, USA, (AIAA-95-1428).
bullet Yi, S., Ahmad, M. F., and Hilton, H. H., "Manufacturing Process Induced Residual Deformation and Stress in Filamentary Polymer Matrix Composites", Proceedings of 36th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, April 10-12, 1995, New Orleans, Louisiana, USA, (AIAA-95-1476).
bullet Hilton, H. H., Yi, S. and Dynyluk, M. J., "Stochastic Delamination Buckling of Elastic and Viscoelstic Columens", Computational Stochastic Mechanics, Edited by P. D. Spanos, Balknema, Rotterdam, Netherlands, pp. 687-696, 1995.
bullet Yi, S., Hilton, H. H. and Ahmad, M. F., "Nonlinear Thermo-viscoelastic Analysis of Interlaminar Stresses in Laminated Composites", Proceedings of 35th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, April 18-21, 1994, Hilton Head, South Carolina, USA, (AIAA Paper 94-1637).
bullet Yi, S., Ahmad, M. F. and A. Ramesh, "Data Parallel Finite Element Computation for Thermo-Viscoelastic Composite Structures", Proceedings of 2nd International Conf. on Computational Structures Technology: Advances in Parallel and Vector Processing for Structural Mechanics, August 30-September 1, 1994, Athens, Greece, pp. 207-214.
bullet Yi, S., Hilton, H. H. and Ahmad, M. F., "Finite Element Analysis of Thick Thermosetting Matrix Composite Curing Process", Proceedings of 2nd Inter- national Conf. on Computational Structures Technology: Advances in Non-Linear Finite Element Methods, August 30-September 1, 1994, Athens, Greece, pp. 177-186.
bullet Yi, S., Hilton, H. H. and Ahmad, M. F., "Performance Evaluations of Viscoelastic Finite Element Supercomputer Algorithms", Proceedings of Third International Conference on Applications of Supercomputers in Engineering, September 27-29, 1993, Bath, UK, pp. 497-510.
bullet Hilton, H. H. and Yi, S., "Stochastic Thermo-Viscoelastic Delamination Failure Analysis of Laminated Composites", Proceedings of 6th International Conference on Structural Safety and Reliability, Innsbruck, Austria, 9-13 August, 1993. pp. 615-621.
bullet Yi, S., Ahmad, M. F., and Hilton, H. H., "Dynamic Responses of Plates with Viscoelastic Damping Treatment'', Proceeding of Fourteenth Biennial ASME Conference on Mechanical Vibration and Noise, Albuquerque, New Mexico, USA, September 19-22, 1993, pp. 437-445.
bullet Yi, S., Pollock, G., Ahmad, M. F., and Hilton, H. H., "Thermo-viscoelastic Analysis of Fiber-Matrix Interphase", Proceedings of 34th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, (AIAA-93-1517), 1993, pp. 1803-1817.
bullet Hilton, H. H. and Yi, S., "Large Deformation Analysis of Finite Length, Encased, Nonlinear Elastic, Pressurized Circular Cylinders", Proceeding of 2nd U. S. National Congress on Computational Mechanics, Washington, D.C., USA, August 16-18, 1993, pp. 189.
bullet Yi, S., Hilton, H. H., Ahmad, M. F., and Pollock, G. D., "Viscoelastic Stress Analysis around Cutouts in Composite Laminated Shells", Proceeding of 2nd U.S. National Congress on Computational Mechanics, Washington, D.C., USA, August 16-18, 1993, pp. 215.
bullet Hilton, H. H. and Yi, S., "Structural Motion Control by Analytic Determination of Optimum Viscoelastic Material Properties", Proceedings of ADPA/AIAA/ ASME/SPIE Active Materials and Adaptive Structures Conference, 1991, pp.227-231.
bullet Yi, Sung, "Thermoviscoelastic Analysis of Delamination Onset and Free Edge Response in Epoxy Matrix Composite Laminates", Proceedings of 32nd AIAA/ASME/ ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, 1991, pp. 1016-1026.
bullet Hilton, H. H. and Yi, S., "Dynamic Finite Element Analysis of Viscoelastically Damped Composite Structures", Proceedings of 2nd International Conference on Applications of Supercomputers in Engineering, 1991, pp. 495-511.
bullet Hilton, H. H. and Yi, S., "Bending and Stretching Finite Element Analysis of Anisotropic Viscoelastic Composite Plates", Proceedings of Third AirForce/NASA Symposium on Recent Advances in Multidiscipinary Analysis and Optimization, 1990, pp. 488-494.
bullet Hilton, H. H. and Yi, S., "Finite Element Formulation for Thermo-Viscoelastic Analysis of Composite Structures Subjected to Mechanical and Hygrothermal Loadings", Proceedings of First NCSA Conference on Finite Element Applications in Computational Mechanics, 1990, pp. 1-11.

Book or Chapters in Books 

Yi, S., Hilton, H. H., and Ahmad, M. F., "Thermo-viscoelastic Finite Element Analysis Performance on Coarse Grained and Massively Parallel Supercomputers'', High Performance Computing in Engineering, Edited by Henry Power, Elsevier, Southhampton, UK, January 1995.

Thesis 

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This page is created and maintained by Gao Shan.
Comments or questions should be sent to msgao@ntu.edu.sg.