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Sung Yi Mailing Address: |
At a Glance Education Teaching/Research Experience Professional Activities
Awards & Honors Research Grants Publications
Currently Sung Yi holds a professor position at the Department of Mechanical and
Materials Engineering of the Portland State University, OR. He was
awarded a Ph.D. degree in aeronautical and astronautical
engineering from the University of Illinois at Urbana-Champaign, IL, in 1992.
His primary teaching and research interests lie in the areas of microelectronic
packaging, delamination & failure mechanisms of electronic packages and
composites, constitutive modeling and characterization of materials,
computational simulation, etc.
In 1991, Dr.
Yi developed a time-dependent failure criterion for delamination onsets in
laminated composites, thereby significantly contributing to the prediction of
life times of composites and received the Jefferson Goblet paper award at the
32nd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials
Conference, Baltimore, MD. He also received the Roger A. Strehlow
Memorial Award for his outstanding research accomplishment in UIUC in 1992. He
co-developed the "Yi-Hilton model’’ to describe the
chemo-thermo-viscoelastic behavior for thermosetting polymers during curing.
Recently, he co-created a new technical term "piezoelectro-hygro-thermo-viscoelasticity" for PVDF smart materials
and successfully formulated the variational principle
for piezo-electro-hygro-thermo-viscoelastic
materials. He is the first one who formulated based on coupling hygro-thermo-viscoelastic physics and solved the pop-corn
problem which is one of the most critical reliability problems in plastic IC
packages. He also developed the system to measure in-situ moisture ingress in
IC packages and polymers with complex geometry and to calculate their diffusion
properties accurately.
After
joining Samsung Electro-Mechanics in 2006, he has been privileged to build a
brand new microelectronic packaging team. The mission of the Packaging Team is
generating creative microelectronics packaging technology and providing total
packaging solutions for all products. The team is focusing on core future
technology and it's incubation. This approach makes
the company have more aggressive R&D culture. In Samsung, he and his team
developed several advanced electronic and MEMS packaging technologies including
embedding active devices and passives into organic substrates, the world’s smallest
saw filter using wafer level packaging, ALOX high thermal dissipation substrate
technology for power devices and LED devices, 3-D advanced packaging
technology, etc. The embedding IC into substrate technology received the
Samsung Technology award in 2008. He also received a Hedong
Technology award in 2007. The Hedong Award is an
award sponsored by Hedong Science Cultural Foundation.
Most of his
current research efforts have direct applications to the critical technologies
needed in developing the next generation of MEMS and IC packaging.
- Ph.D.
(1992), University of Illinois at Urbana-Champaign, IL, USA;
- M.S.
(1987), University of Washington, Seattle, WA, USA;
- B.S.
(1982), Hanyang University, Seoul, Korea.
·
Vice
President (2006-2008)
Central R&D Institute, Samsung Electro-Mechanics, Suwon, Korea, 443-743.
·
Head
of Engineering Mechanics Division, School of Mechanical and Production
Engineering, Nanyang Technological University,
Singapore (2001-2002)
·
Singapore-MIT
Alliance Fellow (1999 - 2002)
·
Associate
Professor (1999-2002), Senior Lecturer (1997 - 1998), Lecturer (1995-1996),
School of Mechanical and Production Engineering, Nanyang
Technological University, Singapore
·
Visiting
Assistant Professor (1994 - 1995), Department of Theoretical and Applied
Mechanics, University of Illinois at Urbana-Champaign, Urbana, USA
·
Research
Fellow (1991 - 1997), NCSA (National Center for Supercomputing Applications),
University of Illinois at Urbana-Champaign, Urbana, USA.
Professionally-related
Service
A. Editorial Board
·
Editorial
Advisory Board Member for the Journal of Soldering and Surface Mount
Technology (1998-present).
·
Editorial
Advisory Board Member for the Journal of Recent
Patents on Electrical Engineering, (2007-present).
·
Editorial
Board Member for Journal of the
Microelectronics and Packaging Society, Korea (IMAPS, Korea) (2007-2008).
·
Associate
Editor for ASME: Journal of Electronic Packaging (2001-2004).
·
Editorial
Advisory Board Member for the Journal of Finite Elements in Analysis and
Design (2000-2004).
·
Guest Editor with D. C. Whalley and P. P. Conway, IEEE
Transactions on Electronics Packaging Manufacturing, Vol. 26, No.3, July
2003.
· Guest
Editor for a Special Issue on Application of Finite Element Analysis in
Electronic Packaging for the Journal of Finite
Elements in Analysis and Design, Vol. 30, 1998.
·
Co-Editor,
IES Journal of Manufacturing, Institute
of Engineers, Singapore. (1997-2001)
B. Conference/Symposium
Organizer/Chair/Advisory Committee
· Program Chair, US-Korea Conference on BNCIT
(Bio-Nano, Communications-Information, Transportation) Systems Technology, Hyatt Regency Hotel, San Francisco, CA, August 6-9, 2014.
· International
Steering Committee Member, 15th International
Conference on Electronic Materials and Packaging Materials, Seoul, Korea,
Oct. 6-9, 2013.
· International
Steering Committee Member, 14th International
Conference on Electronic Materials and Packaging Materials, Hong Kong,
December 13-16, 2012.
· International
Advisory Committee Member, IMPACT2012, Taipei, Taiwan, Oct.
24-26, 2012.
· International
Advisory Committee Member, 13th International
Conference on Electronic Materials and Packaging Materials, Kyoto, Japan,
December 12-15, 2011.
· Program Chair, The 5th North-West US-Korea
Conference on BNCIT (Bio-Nano, Communications-Information, Transportation)
Systems Technology, Portland
State University, Portland, OR, December 11-12, 2010.
· Chair,
12th International Conference on Electronic Materials and Packaging
Materials, Orchard Hotel, Singapore, October 25-27, 2010.
· International
Advisory Committee Member, IMPACT/EMAP2008, Taipei, Taiwan, Oct. 22-24., 2008.
·
Technical
Track Committee Chair, Advanced Packaging, ASME INTERPACK 2007, Vancouver, BC,
Canada, July 8-12, 2007.
· International
Advisory Committee Member, EMAP2007, Daejun, Korea, 19-22 Nov., 2007.
·
Advisory
Committee Member, Micro-Joining & Packaging Society, 2007.
·
Symposium
Advisory Committee Member, Microelectronics Science & Technology (MST)
Symposium, UKC2006, New York, USA, August 11-13, 2006.
·
Chair,
5th International
Conference on Electronics Materials and Packaging Materials, Singapore, Nov. 17-20,
2003.
· International
Advisory Committee Member, EUROSMT2002, Paris, France, September 10-14, 2002.
·
International
Advisory Committee Member, 4th International
Conference on Electronics Materials and Packaging Materials, Kaoshiung, Taiwan,
Dec. 4 - 6, 2002.
· Track Committee
Member for Phonic and Optoelectronics Packaging for ASME INTERPACK 2001 Hawaii, USA, 2001.
· Chairman, Symposium
on Packaging Materials & Processes for Microelectronics, Optoelectronics,
MEMS and Displays, Singapore, July 1- 6, 2001.
· International
Advisory Committee Member, 3rd International Symposium on
Electronics Packaging and Materials, Cheju, Korea, November 30- December 2,
2001,
· Technical Committee
Member, POLYTRONIC 2001, Potsdam, Germany, October 21-24, 2001.
· International
Advisory Committee Member, 2nd International Symposium on
Electronics Packaging and Materials, Hong Kong, November 30- December 2, 2000.
· Conference Committee
Member, the 3rd Annual IMAPS-UK/IEEE-CPMT/ASME/SPE/SPIE/ MRS Workshop (POLY
2000), London, England, December 3-6, 2000.
· Program Committee
Member, International Symposium on Smart Structures and Microsystems, Hong
Kong, October 19-21, 2000.
· Program Chair,
International Symposium on Electronics Packaging and Materials, Singapore,
September 1999.
· Learning Star Award (Intel-ATD, Malaysia, 2009)
·
Hedong Technology Award (Hedong Foundation, 2007)
·
Appointed to a Technology Development Strategy
Committee Member by Ministry of Commerce Industry and Energy, Korea (Oct. 2007)
·
Who’s Who in Science and Engineering (1998)
·
Roger A. Strehlow Memorial Award (AAE, UIUC, 1992)
· AIAA Jefferson Goblet Paper Award (32nd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, Baltimore, MD, USA, 1991)
·
Member, Tau Beta Pi, National Engineering
Honorary Society
· Member, Sigma Xi, The Scientific Research Society
- Principal Investigator, Study of Microwave Curing of Polymers, Korea Institute of Industrial Technology (KITECH), 2013-2014.
- Principal Investigator, StuPrincipal Investigator, Study of Fatigue Life of Lead-free Solder Joints of Ball Grid Array Packages, Intel Cooperation & Oregon Metallurgy Institute, 2013-2014.
- Principal
Investigator, Development of an Integrated Single Chip Module with Multi Functional Sensors using 3-D Wafer Level Package
Process, Sponsored by OKINS ELECTRONICS CO., LTD, 2009 - 2012.
- Principal
Investigator, Development of Advanced Packaging Technology for
Telecommunications and Broadcasting Conversion Services, Ministry of
Knowledge Economy, Republic of Korea, 2008-2011.
- Principal
Investigator, Analysis of Thermo-mechanical Behavior of PCBs, Intel
Cooperation, 2005-2006,
- Principal
Investigator, Modeling of BGA Packages, Dow-Corning, 2003-2004.
- Principal
Investigator, Reliability Testing and Failure Analysis of Microelectronic
Devices and Systems, Intel-OUS Engineering & Computer Science
Curriculum Fellowships and Student Labs 2002 Grant Program, 2002-2003.
- Principal
Investigator, 3-D Interferometry Measurement of Deformation of BGAs,
2001-2002 Sponsored by Philips, Netherlands.
- Principal
Investigator, Study of Mechanical Behavior of 63Sn37Pb Eutectic Solders
under High Strain Rates,: Sponsored Intel
Cooperation & Oregon Metallurgy Institute, 2002-2003.
- Principal
Investigator, Development of SMART Laboratories for Micro-mechanical
Testing of Semiconductor Materials, Sponsored by Institute of Materials
Research and Engineering & NTU, 11/1998-10/2001.
- Co-Principal
Investigator, Development of A Novel Rubber Toughened Epoxy Molding
Compounds, Sponsored by AMOCO Electronics Materials, USA, 4/1998-3/2000.
- Principal
Investigator, Development of Advanced Manufacturing Process of Plastic IC
Packages, Sponsored by Ministry of Education (MOE), 11/1997-10/2000.
- Principal
Investigator, Studies on Smart Materials and Material Systems for
Mechanical Applications, NSTB Strategic Research Project, 1/1997-1/2002.
- Principal
Investigator, Research and Development of Advanced Engineering Mechanics
Technology for Design and Manufacturing of Plastic Encapsulated Integrated
Circuits (JT ACR 1/96), Sponsored by Ministry of Education (MOE),
7/1996-7/1999.
Plenary, Keynote or Invited Talks at Conferences or International Meetings
- (Invited
Plenary Lecture), Embedded ICs and Passives Technology for Wireless
Communication Applications, The 35th International Electronics
Manufacturing Technology Conference, Ipoh, Malaysia, Nov. 6- Nov. 8, 2012.
- (Invited
Plenary Lecture), A Solution for Miniaturization of Micro-Electronic
Devices and Systems, The 13th International
Conference on Microelectronics and Packaging, Kyoto, Japan, December
12-15, 2011.
- (Invited
Plenary Lecture), Wafer Level Packaging Technology for Portable Wireless
Telecommunications, International Welding/Joining Conference, Korea, May
12, 2007.
- (Invited
Plenary Lecture), Wafer Level Packaging & Its Applications,
Micro-Joining & Packaging Society Fall Symposium, KINTEX, Korea, Oct.
11, 2007.
- (Invited
Plenary Lecture), Embedded IC and Passive Technology for Micro Systems
Packaging, International Symposium on MSP Global Network & Exchanges,
Seoul, Korea, Oct. 17, 2007.
- (Invited
Plenary Lecture), Reliability of System in Package, The
5th International Conference on Microelectronics and Packaging,
(ISMP2006), Seoul, Korea, Oct. 11-12, 2006.
- (Invited
Plenary Lecture), A Study of Hygro-Thermal
Deformations and Stresses in FCPBGA, The 7th
International Conference on Electronics Materials and Packaging, Tokyo,
Japan, Dec. 11-14, 2005.
- (Invited
Keynote), Finite Element Analysis for Microwave Cure of Underfills in Flip Chips, Sixth World Congress on
Computational Mechanics in conjunction with Second Asian-Pacific Congress
on Computational Mechanics, Beijing, China, September 5-10, 2004.
Refereed Publications or Other Creative
Achievements
1.
Books,
Journal Special Issue & Conference Proceedings
Edited Journal
Special Issues:
[2] Special Issue on Electronic Materials and Packaging, with D. C. Whalley and P. P. Conway, IEEE
Transactions on Electronics Packaging Manufacturing, Vol. 26, No.3, July
2003.
[1] Special Issue on Application of Finite
Element Analysis in Electronic Packaging, with M. Petch, Finite Elements in Analysis and Design, Vol. 30, No 1/2, 1998.
Edited Conference Proceedings:
[2] Proceeding of 12th International
Conference on Electronics Materials and Packaging, Sung Yi and Paul P. Conway, (Eds.), ISBN-13: 978-1456597832, ISBN-10:
1456597833, 2010.
[1] Proceeding of 5th International
Conference on Electronics Materials and Packaging, Sung Yi, D. Whalley and K. C. Teo, (Eds.), ISBN: 981-05-0078-5, 2003.
2. Chapters
[2] Yi, Sung, Hygro-Thermally Induced
Residual Stresses and Failures in Plastic IC Packages During Reflow Process, Encyclopedia of
Thermal Stresses, Edited by Richard Hetnarski, Springer,
May 2014.
[1] Yi, S., Hilton, H. H., and Ahmad, M. F.,
Thermo-viscoelastic Finite Element Analysis Performance on Coarse Grained and
Massively Parallel Supercomputers, High Performance Computing in Engineering,
Edited by Henry Power and C. A. Brebbia, Computational Mechanics
Publications, UK, 2: 167-198, January 1995.
3. Articles
[95] Steingrimsson, B., Jones, R., Etesami, F., and Yi, Sung, The Ecosystem for Engineering Design Applied to Formula SAE, Design Learning-A Comparative Analysis, International Journal of Engineering Education, Vol. 33, No. 5, pp. 1–14, 2017.
[94]
Suhir, E., Yi, Sung and Ghaffarian, R., Assessed Interfacial Strength and
Elastic Moduli of the Bonding Material from Shear-off Test Data,
Journal of Materials Science: Materials
in Electronics,
DOI 10.1007/s10854-017-6376-x,
Volume 28, Issue 9,
pp. 6794-6799,
2017.
[93]
Suhir, E., Yi, S.,
Nicolics, J., Khatibi, G. and
Lederer, M., Semiconductor Film Grown on a Circular Substrate: Predictive
Modeling of Lattice Misfit Stresses,
Journal of Materials Science: Materials in Electronics,
DOI
10.1007/s10854-016-4976-5, Volume 27, Issue 9, pp 9356–9362,
2016.
[92] Yi,
Sung and Tran, Hieu T., Shear Strengths of CBGA/PBGA Solder Ball Joints with
Lead-Free Solder Pastes, International
Journal of Materials and Structural Integrity,
Vol.8, No.1/2/3, pp.62–75,
2014.
[91] Chu, Y. F., Yi, Sung, and Geng, Phil, Thermal Fatigue Life Prediction
of Solder Joints of Plastic Ball Grid Array Packages, International Journal of Materials and Structural Integrity,
Vol.8, No.1/2/3, pp.3 – 20, 2014.
[90] Yi, Sung, Kim, KyungO,
Lee, Dongwan, Kim,
Hongwon and Jung, Taesung, Embedded
Passive Device Technology for Wireless Mobile Devices, Microelectronics International, Vol. 30, Iss: 1, pp.33 – 39, 2013.
[89] Lee,
H., Kim, D. and Yi, S., Horizontally
Progressive Mirror for Blind Spot Detection in Automobiles, Optics Letters, Vol. 38, No. 3, pp. 317-319, 2013.
[88] Yi,
Sung and Lam, Tatiana M., Analysis of Warpage and Residual Stress in Plastic
Ball Grid Array Package after Post Mold Cure, Microelectronics International,
Vol. 29, No. 3, pp. 163-171, 2012.
[87] Na,
H. C., Sung, T. J., Yoon, S. H., Hyun, S. K., Kim, M. S., Lee, Y. G., Shin, S.
H., Choi, S. M. and Yi, Sung, Formation of Unidirectional Nanoporous Structures in Thickly Anodized Aluminum Oxide Layer,
Transactions
of Nonferrous Metals Society of China, Elsevier
Publisher, Vol. 19, Issue 4,
pp. 1013-1017, 2009.
[86] Yuan,
Jingli, Jeung, Won-Kyu , Lim, Chang-Hyun, Park, Seung-Wook, Kweon, Young-Do
and Yi, Sung, A Low-cost through Via Interconnection for ISM WLP, Microsystem Technologies, Vol. 15, No.
8, pp. 1273-1277, 2009.
[85] Kim,
H. H., Choi, S. H., Shin, S. H., Lee, Y. K., Choi, S. M. and Yi, Sung, Thermal
Transient Characteristics of Die Attach in High Power LED PKG, Microelectronics Reliability, Vol. 48,
Issue 3, pp. 445-454, 2008.
[84] Gao,
S., Hong, J.P., Kim, J.S., Yoo, D.J., Jeong, T.S., Choi, S.M. and Yi, Sung,
Development of an Ultra-Slim System in Package (SiP), Journal of the Microelectronics
and Packaging Society, Vol.
15, No. 1, pp. 7-18, 2008.
[83] Sung, T. J., Jung, Taek Kyun, Kim, Mok Soon and Yi, Sung, Processing and Properties of Al Based
Amorphous/Crystalline Alloy Composites, Materials Science Forum - MATER SCI FORUM, Vol. 544-545, pp.
431-434, 2007.
[82] Yi,
Sung, Park, Sang Kyoo and Teo, Kiat Choon, A Study of Aluminum Wire Failure in
Automotive under-hood Applications, Microelectronics
International, Vol. 23, Issue: 2, pp.11 – 20, 2006.
[81] Noh, S. J., Jung, Taek Kyun , Lee, Dong Suk, Kim, Mok Soon and Yi, Sung, Synthesis and Properties of Bulk Amorphous/Nanocrystalline Aluminum Alloy Composites, Materials Science Forum - MATER SCI FORUM, Vol. 510-511, pp. 830-833, 2006.
[80] Ling,
S. F., Zhang, D., Yi, Sung and Foo, S. W., Real-Time Quality Evaluation of Wire
Bonding Using Input Impedance, IEEE
Transactions on Electronics Packaging Manufacturing, Vol. 29, Issue 4, pp.
280 – 284, Oct. 2006.
[79] Su, Fei, Chian, K. S. and Yi, Sung, An Optical Characterization Technique for
Hygroscopic Expansion of Polymers and Plastic Packages, Microelectronics Reliability, 46(2-4):
pp. 600-609, 2006.
[78] Beldica, Cristina
E., Hilton, Harry H. and Yi, Sung, Viscoelastic Damping and Piezo-electric Control
of Structures Subjected to Aerodynamic Noise, Technical Acoustics, ISSN 1819-2408, 2006.
[77] Liu,
L., Yi, Sung, Ong, L. S., Chain, K. S., Osiyemi, S., Lim, S. H., Su, F.,
Chemo-thermal Modeling and Finite Element Analysis for Microwave Cure Process
of Underfill in Flip-Chip Packaging, IEEE
Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 4, pp.
355-362, October 2005.
[76] Su,
Fei, Chian, Kerm Sin, Yi, Sung, and Dai, Fulong, Development and
Instrumentation of an Integrated Three–dimensional Optical Testing System for
Application in Integrated Circuit Packaging, Review of Scientific
Instruments, Vol. 76, Issue 9, On
page(s): 093109 - 093109-5, 2005.
[75] Zhang, J., Li, M., Xiong,
C. Y., Fang, J., and Yi, Sung, Thermal Deformation Analysis of BGA Package by
Digital Image Correlation Technique, Microelectronics International,
Vol. 21, No.2, pp. 45-51, 2004.
[74] Hilton,
H. H. and Yi, Sung, Generalized Viscoelastic 1-DOF Deterministic Nonlinear
Oscillators, Nonlinear Dynamics,
Vol. 36, pp. 281–298, 2004.
[73] Su, Fei, Dai, Fulong, Chian, Kerm Sin, Yi, Sung, Simultaneous recording of fringe
patterns with one camera, Acta Mechanica
Sinica , Vol. 20, No. 6, pp. 642-648,
2004.
[72] Yi, Sung and Gao, Shan, Thermo-mechanical Behavior of Cracked Ti-55.4%Ni Shape Memory Alloys under Mechanical Loading, Key Engineering Materials, Vols, 261-263, pp. 903-912, 2004.
[71] Liu,
Lie, Yi, Sung, Ong, Lin Seng and Chian, Kerm Sin, Finite Element Analysis for
Microwave Cure of Underfill in Flip Chip Packaging, Thin Solid Films,
Vols. 462-463, pp. 436-445, September 2004.
[70] Tee,
T. T., Yi. Sung, Shen, X, Su, F., and Zhong, Z., Comprehensive Numerical and
Experimental Analysis of Matrix TFBGA Warpage, Journal of Surface Mount Technology, Vol. 17,
Issue 2, pp. 11-17, 2004.
[69] Su,
F., Yi, Sung and Chian, K. S., A Simple Method to Unwrap the Geometrically
Discontinuous Phase Map and its Application in the Measurement of IC Package,
Optics and Lasers in Engineering, Vol. 41,
pp. 463–473, 2004.
[68] Su,
F., Sun, Y., Chian, K. S. and Yi, Sung, Use of Wollaston Prism to Simplify the
Polarization Method for Simultaneous Recording of Moiré Interferometry Fringe
Patterns, Optics Engineering, Vol. 43, No 12, pp. 3003–3007, December
2004.
[67] Xiong, C. Y., Zhang, J., Li, M., Fang, J., and Yi, Sung,
Fourier and wavelet transform analysis of Moiré Fringe Patterns in Electronic
Packaging, Microelectronics International, Vol. 21, No.2, pp. 45-51,
2004.
[66] Chia,
Y. C., Yam, H. S., Lim, S. H., Chian, K. S., Yi, Sung and Chen, W. T., An
Optimization Study of Underfill Dispensing Vol., IEEE Transactions on
Electronics Packaging Manufacturing, Vol. 26, No. 3, pp.205-210, July 2003.
[65] Gao,
S. and Yi, Sung, Experimental Study on the Anisotropic Behavior of Textured
NiTi Pseudoelastic Shape Memory Alloys, Materials Science and Engineering A,
Vol. 362, Issues 1-25, pp. 107-111, December 2003.
[64] van
Driel, W.D., Zhang, G. Q., Janssen, J.H.J., Ernst,
L.J., Su, F., Chian, K. S. and Yi, Sung, Prediction and Verification of Process
Induced Warpage of Electronic Packages, Microelectronics Reliability
Vol. 43 pp. 765–774, 2003.
[63] Fu,
Y., Du, H., Gao, S. and Yi, Sung, Mechanical
Properties of Sputtered TiNiCu Shape Memory Alloy Thin Films, Material
Science Forums Vol. 437-438, pp.37-40, 2003.
[62] Donthu, S. K., Vora, M. M., Lahiri, S. K., Thompson, C. V.
and Yi, Sung, Activation Energy
Determination for Recrystallization in Electroplated-Copper Films Using
Differential Scanning Calorimetry, Journal of Electronic Materials, Vol. 32, No. 6, pp. 531 – 534, 2003.
[61] Yi, S, Luo G. X. and
Chian, K. S., Viscoplastic Micro-Deformation Mechanism of Eutectic
Solders, Transaction of ASME: Journal of Electronic Packaging, Vol. 124, pp.
92-96, 2002.
[60] Yi,
Sung, Chian, K. S. and Hilton, H. H., Nonlinear
Viscoelastic Finite Element Analyses in Thermosetting Polymeric Composites
During Cool-Down After Curing, Journal
of Composite Materials, Vol. 36,
No. 01, pp. 3-17, 2002.
[59] Gao, Shan and Yi, Sung, Fracture Toughening Analysis of Shape Memory
Alloys, Key Engineering Materials, Vol. 227, pp. 49-54, 2002.
[58] Wang, B. and Yi, Sung,
Dynamic Plastic Behavior of 63 wt% Sn 37 wt% Pb Eutectic Solder under High
Strain Rates, Journal of Materials Science Letters, Vol. 21, pp. 697– 698, 2002.
[57] Chian , K. S., Du, X. Y., Goy, H. A., Feng, J. L., Yi, Sung
and Yue, C. Y., Mechanical
Properties and Morphology of Poly(ethylene glycol)-side-chain-modified
Bismaleimide Polymer Journal of Applied Polymer Science, Vol. 86, Issue
3, pp. 715-724, October 2002.
[56] Chian,
K. S., Du, X. Y., Goy, H. A., Feng, J. L., Yi, Sung and Yue, C. Y., Synthesis of Bismaleimide Resin
Containing the Poly(ethylene glycol) side Chain: Curing Behavior and Thermal
Properties, Journal of Applied Polymer Science, Vol. 85, Issue
14, Date: 29 pp. 2935-2945, 2002.
[55] Zhong, C. H., Yi, Sung and Whalley, D. C., Solder Ball Failure Mechanisms in
Plastic Ball Grid Array Packages, Soldering & Surface Mount Technology,
Vol. 14, No. 2, pp. 40-50, 2002.
[54] Chian, K. S. and Yi, Sung,
Synthesis and Characterization of an Isocyanurate-oxazolidone Polymer: Effect
of Stoichiometry, Journal of Applied Polymer Science, Vol. 82, Issue 4,
pp. 879-888, 2001.
[53] Yi,
Sung, Ling S. F. and Ying, M., Time Domain Analysis of Acoustic-Structures
Interaction Problems, The Journal of Acoustics Society of American,
109 (6), pp. 2762- 2770,
2001.
[52] Shen,
L. and Yi, Sung, An Effective Inclusion Model of Effective Elastic Moduli of
Microcracked Solids, International
Journal for Solids and Structures, Vol. 38, pp. 5789-5805, 2001.
[51] Yi,
Sung, Gao, S. and Shen, L., Fracture Analysis of Shape Memory Alloys under
Mixed Mode Loading, International Journal for Solids and Structures, Vol. 38, pp.
4463-4476, 2001.
[50] Yi,
Sung, Kim, J. K., Yue, C. Y. and Hsieh, J. H., Adhesion Strengths of Epoxy
Molding Compounds to Gold Plated Copper, The
Journal of Adhesion, Vol. 73, pp. 1-17, 2000.
[49] Shen,
L and Yi, Sung, Approximate Evaluation for Effective Elastic Moduli for Cracked
Solids, International Journal of
Fracture, Vol. 106, No. 2, pp. 15-20(6), Nov. 2000.
[48] Yi, Sung, Kim, J. K., Yue, C. Y. and
Hsieh, J. H., Bonding Strengths at Plastic Encapsulated-Gold Plated Copper
Leadframe Interface, Microelectronics
Reliability, Vol. 40, pp.1207-1214, 2000.
[47] Yi,
Sung and Sze, K. Y., A Finite Element
Formulation for Composite Laminates with
Smart Constrained Layer Damping, Advances
in Engineering Software, pp 529-537,
Vol. 31 (8-9), Aug. 2000.
[46] Sze, K. Y., Yao, L. and Yi, Sung, A Hybrid-Stress ANS Solid-Shell Element and Its
Generalization for Smart Structure Modeling - Part II: Smart Structure
Modeling, International
Journal for Numerical Methods in Engineering, Vol.
48, pp. 565-582, 2000.
[45] Yi,
Sung and Gao, S., Fracture Toughness of Shape Memory Alloys due to Martensite
Transformation, International Journal
for Solids and Structures, Vol. 37, pp.5315-5327, 2000.
[44] Shen,
L. and Yi, Sung, New Solutions for Effective Elastic Moduli of Microcracked
Solids, International Journal for Solids
and Structures, Vol. 37, pp. 3525-3534, 2000.
[43] Yi,
Sung, Shen, Lianxi, Kim, Jang Kyo and Yue, Chee Yoon, A Failure Criterion for
Debonding between Encapsulants and Leadframes, Journal of Adhesion Science and Technology, Vol. 14, No. 1, pp.
93-105, 2000.
[42] Chia,
Y.C., Lim, S.H., Chian, K. S., Yi, Sung and Chen, W.T., An Optimization Study
of Underfill Dispensing Process, International
Journal of Microcircuits & Electronic Packaging, Vol. 22, No. 4, 1999,
pp. 345-352.
[41] Yi,
Sung, Ling, S. F. and Ying, M., Large Deformation Finite Element Analyses of
Composite Structures Integrated with Piezoelectric Sensors and Actuators, Finite Element Analyses and Design, UK,
Vol. 35, pp. 1-15, 1999.
[40] Yuan,
W. Q. and Yi, Sung,
Pseudo-elastic Strain Estimation of Textured TiNi-based Shape
Memory Alloys, Materials Science and
Engineering Part. A, pp. 439-448, 1999.
[39] Yuan,
W. Q. and Yi, Sung Determination of Orientation Distribution Function in the TiNi-based
SMA Parent and Martensite Phases, Scripta
Materialia, 41(12), pp. 1319-1325, 1999.
[38] Xiao,
Z. M., Guo, J. Y., Yi, Sung, Stress Intensity Factors for Ring-Shaped Crack
Surrounded by Spherical Inclusions, Theoretical
and Applied Fracture Mechanics, Vol. 32, pp. 147-155, 1999.
[37] Yi,
Sung, Yue, Chee Yoon, Hsieh, Jang-Hsing, Fong, Liwha, Lahiri, Syamal K.,
Effects of Oxidation and Plasma Cleaning on Adhesion Strength between Copper
Leadframes and Molding Compounds, Journal
of Adhesion Science and Technology, Vol. 17, No. 7, pp.789-804, 1999.
[36] Yi,
Sung, Ling, S. F., Ying, M., Hilton, H. H. & Vinson, J. R., Finite Element Formulation of Anisotropic
Coupled Piezo-hygro-thermo-viscoelastic-dynamic Problems, International Journal for Numerical Methods in Engineering, Vol.
45, pp.1531-1546, 1999.
[35] Zhong, C. H. and Yi,
Sung, Solder Joint Reliability of
Plastic Ball Grid Array Packages, Soldering and Surface Mount Technology,
UK, Vol. 11, No. 1, pp.44-48, 1999.
[34] Hsieh, J.H., Fong, L.H., Yi, Sung, Metha,
G., Plasma cleaning of copper leadframe
with Ar and Ar/H2 gases, Surface
and Coatings Technology, Vol. 112, No. 1-3, pp. 245-249, 1999.
[33] Hilton,
H. H. and Yi, Sung, Stochastic Delamination Simulations of Non-linear
Viscoelastic Composites During Cure, Journal
of Sandwich Structures & Materials, Vol. 1, pp. 111-127, April 1999.
[32] Yi,
Sung and Sze, K. Y., Cooling Rate Effect
on Post Cure in Plastic Encapsulated IC Packages, Transaction
of ASME: Journal of Electronic Packaging, Vol. 120, pp. 385-390, 1998.
[31] Yi,
Sung, Ling, Shih-Fu, and Ying, Ming,
Finite Element Analysis of Composite Structures with Smart Constrained
Layer Damping, Advances in Engineering
Software, UK, Vol. 29, No. 3-6, pp. 265-271, 1998.
[30] Ying,
M., Zou, Q., and Yi, Sung, Finite
Element Analysis of Silicon Condenser Microphones with Corrugated Diaphragms, Finite Elements in Analysis and Design,
Vol. 30, pp. 163-173, 1998.
[29] Yi,
Sung and Sze, Kam Yim, Finite Element Analysis
of Moisture Distribution and Hygrothermally Induced Stresses in TSOP Packages, Finite Elements in Analysis and Design,
Vol. 30, pp. 65-79, 1998.
[28] Yi,
Sung and Hilton, H. H., Effects of
Thermo-mechanical Properties of Composites on Viscosity, Temperature and Degree
of Cure in Thick Thermosetting Composite Laminates during Curing Process, Journal of Composite Materials, Vol.
32, No. 7, pp. 600- 622, 1998.
[27] Yi,
Sung, Ahmad, M.F. and Hilton, H.H.,
Nonlinear Viscoelastic Stress Singularities near Free Edges of Unsymmetrically Laminated Composites, International Journal for Solids and
Structures, Vol. 35, pp.3221-327, 1998.
[26] Yi,
Sung, Hilton, H. H. and Ahmad, M. F.,
Cure Cycle Simulations of Composites with Temperature and Cure Dependent
Anisotropic Viscoelastic Properties and Stochastic Delaminations, Mechanics of Composite Materials &
Structures, Vol. 5, pp.81-101, 1998.
[25] Hilton,
H. H. and Yi, Sung, The Significance of
Anisotropic Viscoelastic Poisson’s Ratio Stress and Time Dependencies, International
Journal for Solids and Structures, Vol. 35, pp. 3081-3095, 1998.
[24] Zou, Q., Tan, Z., Wang, Z., Lin, R., Yi, Sung, Gong, H.,
Lim, M., Liu Litian and Li Zhijian, A
Novel Integrated Silicon Capacitive Microphone, IEEE/ASME Journal of Microelectromechanical Systems, Vol. 7, No. 2,
pp. 224-233, 1998.
[23] Zou, Q., Tan, Z., Wang, Z., Lin, R., Yi, Sung, Gong, H.,
Lim, M., Li, Zhijian and Liu, Litian, A
Study on Corrugated Diaphragms for High-sensitivity Structures, Journal of Micromech. Microeng. Vol. 7,
pp. 310-315, 1997.
[22] Yi,
Sung, Goh, J. S. and Yang, J. C.,
Residual Stresses in Plastic IC Packages During Surface Mounting Process
Preceded by Moisture Soaking Test, IEEE Transactions on Components, Packaging,
and Manufacturing Technology-Part B, USA, Vol. 20, No. 3, pp. 247-255,
March 1997.
[21] Yi,
Sung and Hilton, Harry H., Free Edge
Stresses in Elastic and Viscoelastic Composite Laminates under Uniaxial
Extension, Bending and Twisting, Transaction of ASME: Journal of Engineering
Materials and Technology, 119:266-272, 1997.
[20] Yi,
Sung, Finite Element Analysis of Free
Edge Stresses in Nonlinear Viscoelasitc Composites Under Uniaxial Extension,
Bending and Twisting, International
Journal for Numerical Methods in Engineering, UK, Vol. 40, pp. 4225-4238,
1997.
[19] Sze,
K. Y., Yi, Sung, and Tay, M. H., An
Explicit Hybrid Stabilized Eighteen-Node Solid Element for Thin Shell Analysis,
International Journal for Numerical
Methods in Engineering, UK, July, Vol. 40, pp. 1839-1856, 1997.
[18] Yi,
Sung, Effects of a Time-dependent Interfacial Layer on the Thermo-mechanical
Response of Polymer Matrix Composites, Journal
of Materials Processing Technology, V67, N1-3, P183-188, May 1997.
[17] Yi,
Sung, Ahmad, M. F., and Hilton, H. H.,
Finite Element Algorithms for Dynamic Simulation of Viscoelastic
Composite Shell Structures Using Conjugated Gradient Method on Coarse Grained
and Massively Parallel Machines , International
Journal for Numerical Methods in Engineering, UK, Vol. 40, pp.1857-1875,
1997.
[16] Yi,
Sung, Hilton, H. H. and Ahmad, M. F.,
Finite Element Approach for Cure Simulation of Thermosetting Matrix
Composites, Computers and Structures,
UK, Vol. 64, No. 1-4, pp. 383-388, 1997.
[15] Hilton,
H. H., Yi, Sung and Danyluk, M. J.,
Probabilistic Analysis of Delamination Onset in Linear Anisotropic
Elastic and Viscoelastic Composite Columns, International Journal of Reliability Engineering and System Safety,
Vol. 56, pp. 237-248, 1997.
[14] Yi,
Sung, Ahmad, M. F. and A. Ramesh, Data
Parallel Finite Element Computation for Thermo-Viscoelastic Composite
Structures, Advances in Engineering
Software, UK, OCT-NOV, Vol. 27, N1-2, pp.97-102. ISSN 0965-9978, 1996.
[13] Swellam, M., Yi, Sung, Ahmad, M. F. and Huber, L.,
Mechanical Properties of Cellular Materials I, Linear Analysis of Hexagonal
Honeycombs, Journal of Applied Polymer
Science, Vol. 63, pp. 383-393, 1997.
[12] Yi,
Sung, Hilton, H. H. and Ahmad, M. F., Nonlinear Thermo-viscoelastic Analysis of
Interlaminar Stresses in Laminated Composites, ASME: Journal of Applied Mechanics, USA, pp. 218-224, Vol. 63,
March 1996.
[11] Yi,
Sung, Ahmad, M. F., and Hilton, H. H., Dynamic Responses of Plates with Free
Layer Viscoelastic Damping Treatment, ASME:
Journal of Vibration and Acoustics, USA, Vol. 118, pp. 362-367, 1996.
[10]
Yi, Sung and Hilton, H. H.,
Hygrothermal Effects on Viscoelastic Responses of Laminated Composites
, Composites
Engineering, UK, Vol. 5, No. 2, pp. 183-193, 1995.
[9] Yi,
Sung, Pollock, G., Ahmad, M. F., and Hilton, H. H., Effective Transverse Young’s Modulus of
Composites with Viscoelastic Interphase, AIAA
Journal, USA, Vol. 33, No. 8,
pp. 1548-1550, 1995.
[8] Yi,
Sung, Pierson, K. H., and Ahmad, M. F., Parallel Implementation of Dynamic
Simulation to Filamentary Composite Structures with General Rate Dependent
Damping, Computing Systems in
Engineering, UK, Vol. 5, pp. 469-477, 1994.
[7] Yi,
Sung and Hilton, H. H., Dynamic Finite
Element Analysis of Viscoelastic Composite Plates , International Journal for Numerical Methods in Engineering, USA,
Vol. 37, pp. 4081-4096, 1994.
[6]
Yi, Sung, Thermoviscoelastic
Analysis of Delamination Onset and Free Edge Response in Epoxy Matrix Composite
Laminates, AIAA Journal, USA, Vol.
31, No. 12, pp. 2320-2328, 1993.
[5] Hilton,
H. H. and Yi, Sung, Stochastic
Thermo-Viscoelastic Delamination Failure Analysis of Laminated Composites, Journal of Composite Materials, USA, Vol. 27, No. 11, pp.1097-1113, 1993.
[4] Hilton,
H. H. and Yi, Sung, Anisotropic
Viscoelastic Finite Element Analysis of Mechanically and Hygrothermally Loaded
Composites, Composites Engineering,
UK, Vol. 3, No. 2, pp. 123-135, 1993.
[3] Yi,
Sung, Pollock, G., Ahmad, M. F., and Hilton, H. H., Time Dependent Analysis of
Viscoelastic Composite Shell Structures, Computing
Systems in Engineering, UK, Vol. 3, pp.457-467, 1992.
[2] Hilton,
H. H. and Yi, Sung, Analytic Formulation of Optimum Material Properties for
Viscoelastic Damping, Smart Materials
and Structures, UK, Vol. 1,
pp.113-122, 1992.
[1] Lin,
K. Y. and Yi, Sung, Analysis of Interlaminar Stresses in Viscoelastic
Composites, International Journal of Solids and Structures, UK, Vol. 27, No. 7,
pp. 929-945, 1991.
4. Papers in Conference
Proceedings or Symposia, etc.
[105] Yi, Sung, Thakare, Aditya, Kim, Jun Ki,
Kang, Jeong Jin, Lee, So Jung and Choi, Han, Rapid Curing of Polymeric
Materials for Microelectronics Applications Using Microwave, 15th International Conference on Electronics Materials and
Packaging, (EMAP 2013),
Paper No: EMP-0232, Oct. 6-Oct. 9,
Seoul, Korea, 2013.
[104] Snyder,
Trevor
and Yi, Sung,
System Modeling of
Embedded Active Chips: Design and Optimization, 15th International Conference on Electronics Materials and
Packaging, (EMAP 2013),
Paper No: M&S -0233, Oct. 6-Oct.
9, Seoul, Korea, 2013.
[103] Tran,
Hieu T., Chu, Yin Fun, Yi, Sung and Geng, Phil, Effects of Microstructure on Thermal
Fatigue Life Prediction of Solder Joints, 14th
International Conference on Electronics Materials and Packaging, (EMAP 2012),
Page(s): 1 - 8, Dec.
13 - Dec. 16, Hong Kong, 2012. (IEEE
DOI: 10.1109/ EMAP.2012.6507879)
[102] Lam, Tatiana and Yi, Sung, Effects A Study of Warpage and Residual Stress in Plastic Ball Grid
Array Package, 14th International Conference on Electronics Materials and
Packaging, (EMAP 2012),
Page(s): 1 - 8, Dec.
13-Dec. 16, Hong Kong, 2012. (IEEE DOI: 10.1109/ EMAP.2012.6507877)
[101] Yi,
Sung and Pickup, Kevin, Thermal Stress Analyses of Inductive Proximity Sensors
under Thermal Cycling Condition, Proceedings
of 18th International Workshop on Thermal investigations of ICs and Systems,
pp. 5-11, Budapest, Hungary, 2012.
[100] Le, Huy, Wern, Chien, Turcic, David and Yi,
Sung, Three Dimensional MEMS Gyroscope Testing, Proceedings of 12th International Conference on Electronics
Materials and Packaging, (EMAP
2010), pp. 291-296, 2010.
[99]
Jeung, W. K., Lim, C. H. and Yi,
Sung, Low Temperature Multi Layer Stack Wafer Bonding Technology
Development, Proceedings of 59th Electronic Components and Technology
Conference, (ECTC '09), pp. 20 – 24, 2009.
[98]
Romero,
C., Lim, J., Yoon, Y. H., Kim, T., Yi, Sung,
Novel Approach in Design and Test of Embedded Capacitors in
Organic-based Substrate for Highly Compact RF Systems-in-Package Devices, Proceedings of ICEP2009, pp.23-28,
2009.
[97]
Harr, K. M.Harr, Kim,
D. H., Kim, Y. M., Cho, H.Y.Cho, Lee, C. B.Lee, Kim, J. G., Yi, Sung and Kim,
Y. H., Chip-on Flex(COF) Bonding Technology Using Tin Bumps and Non-Conductive
Adhesives (NCAs) for CMOS Image Sensor Device, Proceedings of ICEP2009, pp.119-124, 2009.
[96]
Harr, K., M., Kim, Y. M., Lim, D. H.,
Kim, Y. H., Kim, J. G. and Yi, Sung, A New
COF Bonding Technique using Sn Bumps and a Non-conductive adhesive (NCA) for
Image Sensor Packaging, Proceedings of
59th Electronic Components and Technology Conference, (ECTC
'09), pp. 1475 – 1478, 2009.
[95] Yuan, J. L., Jeung, W. K., Lim, C. H., Park, S. W., Kweon, Y. D.
and Yi, Sung, A Low-cost Through via Interconnection for ISM WLP, Proceedings of Symposium on Design, Test, Integration and
Packaging of MEMS/MOEMS, pp. 115 – 118, 2008.
[94] Kim, K. O., Kim, T., Kim, H., Lee, D. and Yi, Sung, Low Cost Embedded Duplexer Implementation for
WiMAX Front End Module with Multi-layer Organic Substrate, Proceedings of 38th European
Microwave Conference (EuMC 2008), pp. 32 – 35, 2008.
[93]
Jeung, W.
K., Lim, C. H., Yuan, J. L., Park, S. W., Choi, S. M. and Yi, Sung, Reflowable
ISM WLP, Proceedings of 58th Electronic Components and Technology
Conference, (ECTC '08), pp. 297-302, 2008.
[92]
Gao, S., Hong, J. P., Shin, S. H.,
Lee, Y. K., Choi, S. M. and Yi, Sung, Design Optimization on the Heat Transfer
and Mechanical Reliability of High Brightness Light Emitting Diodes Package,
Proceedings of 58th Electronic Components and Technology Conference (ECTC
'08), pp. 798-803, 2008.
[91] Hong, J. P., Gao, S., Park, S. W., Moon, S. H., Baek, J. W.,
Choi, S. M. and Yi, Sung, Parametric
Design Study for Minimized Warpage of WL-CSP,
Proceedings of 2nd
Electronics System-Integration Technology Conference (ESTC 2008), pp. 187 – 192, 2008.
[90] Gao, S., Hong, J. P., Kim, J. S., Kim, J. G., Choi, S. M. and Yi,
Sung, Reliability Evaluation and Structure Design Optimization of Wafer Level
Chip Scale Packaging (WLCSP), Proceedings of 2nd
Electronics System-Integration Technology Conference, (ESTC 2008), pp. 701 – 706, 2008.
[89] Park, S. W., Hong, J. P., Kim, T. H. K., Yang, S. J., Ha, J.,
Kim, T. H., Park, S. W., Kweon, Y. D., and Yi, Sung, Fabrication and Optimization of Wafer Level
SAW Filter Package using Laser Via Drilling,
Proceedings of 2nd
Electronics System-Integration Technology Conference (ESTC 2008), pp.1273 – 1278, 2008.
[88] Kim, J. W., Hong, J. P., Gao, S., Choi, S. M. and Yi, Sung, Warpage Simulation for Chip-in-Substrates, Proceedings of 33rd IEEE/CPMT International
Symposium on Electronic Manufacturing Technology (IEMT 2008), pp. 1 – 4, 2008.
[87] Lee, S. S., Baik, J. W., Kim, J. S., Jeon, H. J. and Yi,
Sung, Wafer Level Packaging by Residual
Stress Evaluation using Piezoresistive Stress Sensors for the Enhancement of
Reliability, Proceedings
of 33rd
IEEE/CPMT International Symposium on Electronic Manufacturing Technology (IEMT 2008), pp.: 1 – 5, 2008.
[86] Kim, T. H., Jeon, J. Y., Kwak, Y. P., Kim, T. H., Lim, Y. J.,
Park, J. H., Choi, S. M. and Yi, Sung,
Interconnection Via Technology and Wafer Level Package for Crystal Unit
Device, Proceedings of 33rd IEEE/CPMT International
Symposium on Electronic Manufacturing Technology (IEMT 2008), pp. 1 – 5, 2008.
[85] Kim T. E., Kim, K. O., Kim, H. W., Jung, T. S. and Yi, Sung, Tolerance Analysis for Embedded Passive in
Organic Substrate, Proceedings of 10th International Conference
on Electronics Materials and Packaging (EMAP 2008),
pp. 317 – 320, 2008.
[84] Kim, T. H., Jeon, J. Y., Kwak, Y. P., Hong, J. P., Kim, T. H., Lim,
E. J., Park, J. H., Choi, S. M. and Yi,
Sung, New Approach for Wafer Level
Crystal Unit Package, Proceedings of 10th International Conference on Electronics
Packaging Technology (EPTC 2008), pp. 1247 – 1252, 2008.
[83] Kim, T. E., Kim, H. W., Kim, K. O., Kim, J. S., Jung, T. S. and
Yi, Sung, Tolerance Improvement for
Organic Embedded Passive RF Module Substrate, Proceedings
of 10th International Conference on Electronics Packaging Technology (EPTC
2008), pp. 1226 – 1230, 2008.
[82] Kim, H. H., Ye, Y. D., Choi, S. H., Lim, J., Yim, S. G. and Yi,
Sung, RF multi-DUT Testing Technology for RF WLP, Proceedings
of 2nd International Conference on Electronics System-Integration
Technology Conference (ESTC 2008), pp. 547 – 550, 2008.
[81] Kim, J. W., Park, H. S., Lee, S. C., Chung, Y. K., Choi, S. M.
and Yi, Sung, Development of Lamination Process for Chip-in-Substrates, Proceedings of 9th International Conference on
Electronics Materials and Packaging (EMAP 2007),
pp. 1 – 6, 2007.
[80] Kim, T.
H., Yi, Sung, Roh, J. K., Jung, C. M., Guo, Y. S., Do, J. C., Kim, J. G., Gao,
S., and Hong, J. P., Effect of Underfilling Materials and Processes on the
Reliability of System in Package, Proceedings of ASME InterPACK '07,
(IPACK2007-33034), Vancouver, British Columbia, CANADA, July 8-12, 2007.
[79] Gao, S., Hong, J. P., Choi, S.
H., Choi, S. M. and Yi, Sung, Heat Transfer Analysis and Design Optimization of
Alox High Brightness Light Emitting Diode Package, Proceedings of ASME
InterPACK '07, (IPACK2007-33103), Vancouver, British Columbia, CANADA, July 8-12, 2007.
[78]
Hong, J. P., Gao, S., Ha, J., Yang, S.
J., Kang, I. G., Kim, T. H., Choi, S. M. and Yi, Sung, Design Optimization of a
Wafer Level Package for Surface Acoustic Wave Filters, Proceedings of ASME InterPACK '07, (IPACK2007-33031), Vancouver,
British Columbia, CANADA, July 8-12, 2007.
[77]
Kim, T. H., Jeung, W. K., Yang, S. J.,
Choi, S. M., Park, S. W., Kim, H. H., Ha, J., Park, M. J., Gao, S., Hong, J.P.,
Yi, Sung, Hwang, J. S., Lim, J. H. and Kim, W. B., Miniaturization and Optimization of RF SAW
Filter Using Wafer Level Packaging Technology, Proceedings of 57th Electronic Components and Technology
Conference, (ECTC '07), pp. 574-579, 2007.
[76]
Jeung, W. K.,
Shin, S. H., Hong, S. Y., Choi, S. M.,
Yi, Sung, Yoon, Y. B.,
Kim, H. J., Lee, S. J. and Park,
K. Y., Silicon-Based, Multi-Chip LED
Package, Proceedings of 57th
Electronic Components and Technology Conference, (ECTC '07), pp. 722-727,
2007.
[75]
Kim, T. H., Yi, Sung, Seo, H. H., Jung, T. S., Guo, Y.
S., Doh, J. C., Okuno, A. and Lee, S. H., New Encapsulation Process for the
SIP (System in Package), Proceedings of
57th Electronic Components and Technology Conference (ECTC '07),
pp. 1420-1424, 2007.
[74]
Gao, Shan,
Hong, Jupyo, Kim, Jinsu, Choi,
Seogmoon and Yi, Sung, Effects of Packaging Materials on the
Reliability of System in Package, Proceedings
of 8th International Conference on Electronic Packaging Technology (ICEPT
2007), pp.1-5, 2007.
[73]
Gao, S. Hong, J. P.,
Kim, T. H., Choi, S. M. and Yi, Sung, Study of a Wafer Level Package (WLP) for
Surface Acoustic Wave (SAW) Filter, Proceedings
of 8th International Conference on Electronics Materials and
Packaging (EMAP 2006), pp.1–4, 2006.
[72]
Yi, Sung, Daharwal, P.D., Lee, Y.J. and Harkness,
B.R., Study of Low-modulus Die Attach Adhesives and Molding Compounds
on Warpage and Damage of PBGA, Proceedings
of 56th Electronic Components and Technology Conference (ECTC
'06), pp. 939-945, May 30-June 2, 2006.
[71]
Kim, T. H.,
Jeung, W. K., Yang, S. J., Choi, S. M., Park, M J.,
Park, J. H., Yi, Sung, Hwang, J. S., Lim, J. H. and Kim,
W. B., Design and Characterization of Wafer Level SAW Filter Package Using
LT-LT Wafer Structure, Proceedings
of 8th International Conference on Electronics Materials and
Packaging (EMAP 2006), pp. 1 – 5, 2006.
[70]
Yi, Sung and Su, Fei, A Study of
Hygro-thermal Deformations and Stresses in FCPBGA, Proceedings of 7th International Conference on Electronics
Materials and Packaging (EMAP 2005), pp.15–20, Dec. 11-14, 2005.
[69]
Yi, Sung, Daharwal, P.D., Lee, Y.J. and
Harkness, B.R., Effects of Low-modulus Die Attach Adhesive on Warpage and
Damage of BGA, Proceedings of 7th
International Conference on Electronics Materials and Packaging (EMAP
2005), pp. 162–168, Dec. 11-14, 2005.
[68]
Yi, Sung, Yu, Zeyan, Neo, R. G. H. and
Lee, Y.J., Hygro-thermo-mechanical Behavior of Molding Compounds at Elevated
Environments, Proceedings of 54th
Electronic Components and Technology Conference (ECTC '04), pp. 180-185, June 1-June 4, 2004.
[67]
Zhang, Dong, Ling, Shih-Fu, Yi, Sung,
Foo, Say Wee, Improved Monitoring of Ultrasonic Wire Bonding via Input
Electrical Impedance, Proceedings of 6th
Electronics Packaging Technology Conference (EPTC 2004). pp. 359 – 363,
2004.
[66]
Yi, Sung, Liu, Lie and Park,
Sang Kyoo, Cure of Underfills in Flip Chips using Microwave, Proceedings of 4th IEEE International Conference on Polymers and Adhesives in
Microelectronics and Photonics (POLYTRONIC 2004), pp. 92 – 98, 12-15 Sept.
2004.
[65]
Hilton, H.
H., Vinson, J, R.,
Yi, Sung and Kohl, C H, Anisotropic Nonlinear
Piezo-electro-chemo-thermo viscoelasticity:
Characterization, Simulations,
Probabilistic Failures and Structural
Integrity, Second International Conference on High Performance
Structures and Materials, Ancona, Italy, pp. 263-274, 2004 .
[64]
Su, F., Yi,
Sung and Chian, K. S., Experimental Investigation of Hygroscopic Expansions of
Molding Compounds and Plastic IC Packages, Proceedings
of 5th International Conference on
Electronic Materials and Packaging, (EMAP 2003), pp. 150
– 157, 17-19
Nov. 2003.
[63]
Li, M., Zhang, J., Xiong,
C. Y., Fang, J. and Yi, S, Thermal Deformation Analysis of BGA Package by
Digital Image Correlation Technique, Proceedings
of 5th International Conference on
Electronic Materials and Packaging, (EMAP 2003), pp. 98
– 104, 17-19
Nov. 2003.
[62]
Chia, Y. C.,
Yam, H. S., Chian, K. S., and Yi, Sung, Flow Assessment Flip Chip Underfilling
Process,
Proceedings of 5th International Conference on
Electronic Materials and Packaging, (EMAP 2003), pp. 108
– 115, 17-19
Nov. 2003.
[61]
Xiong, C. Y., Zhang, J, Li, M., Fang, J. and Yi,
Sung, Fourier and Wavelet Transform Analysis of Moire Fringe Patterns in
Electronic Packaging, Proceedings of 5 th International Conference on
Electronic Materials and Packaging, (EMAP 2003), pp. 232
– 238, 17-19
Nov. 2003.
[60]
Li, Jianjun
and Yi, Sung, Studies on Thermal and Mechanical Properties of PBGA Substrate
and Material Construction, Proceedings of 52nd Electronic Components and Technology
Conference,
pp. 1595- 1604, 2002.
[59]
van Driel, W.D., Zhang, G.Q., Janssen J., Ernst, L. J., Su, F.
and Yi, Sung, "Prediction and verification of process-induced thermal
deformation of electronic packages using non-linear FEM and 3D
interferometry". Proc. EuroSimE2002, pp. 362-367, 2002.
[58] Abdul, J., Guo, N., Yi, Sung and Wong, B.S., Ultrasonic
characterization of the interface between die attach and copper leadframe in IC
packaging, Proceedings of Third
International Conference on Experimental Mechanics , SPIE, Vol. 4537, pp.
174-150, 2002.
[57] Fu, Yongqing, Du, Hejun, Gao, Shan, Yi, Sung, Mechanical
Properties of Sputtered TiNiCu Shape Memory Alloy Thin Films, Proceedings
of the Second International Conference on Advanced Materials Processing (ICAMP 2002), pp.
37-40, 2002.
[56]
Yi, Sung, Liu, Lie, Chian, Kerm Sin,
Su, Fei, Gao, Shan, A study of Microwave Curing Process for Underfill used in
Flip Chip Packaging. Part 2: 3D FEM Simulation of Microwave Power Distribution
inside Variable Frequency Microwave Oven, Proceedings
of International Symposium on Electronic Materials and Packaging, (EMAP
2001), pp. 29 – 33, 19-22 Nov. 2001.
[55]
Shen, Lianxi, Yi, Sung, Caers, J., Zhao,
X. and Zhang, K., A Damage Parameter Based on
Fracture Surface for Fatigue Life Prediction of CSP Solder Joints, Proceeding of International Symposium on
Electronic Materials and Packaging (EMAP 2001), pp. 412 – 416, 19-22 Nov.
2001.
[54]
Yi, Sung and Chian, Kerm Sin,
Chemo-thermo-viscoelastic Behavior of Underfill Materials during Curing
Process, Proceeding of International
Symposium on Electronic Materials and Packaging, 2001, (EMAP 2001), pp. 254
– 260, 19-22 Nov. 2001.
[53]
Yi, Sung, Liu, Lie, Chian, Kerm Sin
and Osiyemi, Stephen, Comparison and Kinetic Analysis of Microwave and Thermal
Cure of Underfill Materials, Proceeding of International Conference on
Materials for Advanced Technologies, Singapore, 1 – 6 July 2001.
[52]
Tee, T. Y., Sivakumar, K., Herard, L., Yi, Sung, Shen, L., Mukund, V. M., and Su, F., Comprehensive Analysis of BGA Block Warpage Induced after Post Mold Cure, Proc. ICEP Conf., Tokyo, Japan, pp.460 - 465 , 2001.
[51]
Yi, Sung, Luo, Guangxing, Chian, Kerm
Sin and Chen, W.T., A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic
Solders, Proceeding of International
Symposium on Electronic Materials and Packaging (EMAP 2000), pp.183 – 190,
30 Nov.-2 Dec. 2000.
[50]
Chian, K.S.,
Lim, S.H., Yi, Sung and Chen, W.T., Effect of Moisture on the Curing Behaviour
of Underfills, Proceeding of
International Symposium on Electronic Materials and Packaging (EMAP 2000).
pp. 289 – 296, 30 Nov.-2 Dec. 2000.
[49]
Szeto, W.K., Xie,
M.Y., Kim, J.K., Yuen, M.M.F., Tong, P., and Yi, Sung, Interface Failure
Criterion of Button Shear Test as a Means of Interface Adhesion Measurement in
Plastic Packages, Proceeding of
International Symposium on Electronic Materials and Packaging (EMAP 2000),
pp. 263 – 268, 30 Nov.-2 Dec. 2000.
[48]
Zhong, C.H.,
Yi, Sung, Mui, Y.C., Howe, C.P., Olsen, D. and Chen, W.T., Missing Solder Ball
Failure Mechanisms in Plastic Ball Grid Array Packages, Proceedings of 50th Electronic Components and Technology Conference
(ECTC2000), pp. 151 – 159, 21-24 May 2000.
[47]
Yi, Sung and Sze, K. Y., Delamination
Analysis of Flip Chip Packages, Proceedings of International Conference on
Computational Engineering & Sciences, LA, Aug 21- Aug 25, 2000.
[46]
Chia, Y.C., Lim, S.H., Chian, K. S.,
Yi, Sung and Chen, W.T., An Optimization Study of Underfill Dispensing
Process, Proceeding of INTERPACK 99, ASME, June 1999.
[45]
Yi, Sung and Neo, Guan Hock,
Hygro-thermo-mechanical Behavior of Mold Compound Materials at Elevated
Environment, Proceedings of the 1998
Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages
of IC Devices, ASME, pp. 287-292, Paris, France, 1998.
[44]
Yi, Sung and Yue, Chee Yoon,
Hygrothermally Induced Residual Stresses in a Plastic BGA, Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric
Materials and Plastic Packages of IC Devices, ASME, pp. 271-275, Paris,
France, 1998.
[43]
Zhong, C. H.
and Yi, Sung, Effects of Ball Pad
Metallurgy and Ball Composition
on Solder Ball Integrity
of Plastic Ball Grid
Array Packages, Proceedings of the 24th
international Symposium for testing and Failure Analysis, November, Dallas
Texas, pp. 405-409,
1998.
[42]
Yuan, W..Q. and Yi, Sung, Quantitative Texture Analysis
and Maximum Recoverable phase transformation strain estimation of TiNiCu memory
alloy, Proceeding of National Symposium
on Progress in Materials Research, pp. 45-50, Singapore, 1998.
[41]
Yuan, W. Q. and Yi, Sung, Textures in a
Dual Phase CuZnAl Alloy by Alternate Cold-Rolling and Annealing, Proceeding of National Symposium on
Progress in Materials Research, pp. 393-398, Singapore, Mar 1998.
[40]
Hilton, H. H. and Yi, Sung,
Generalized Viscoelastic 1-DOF Deterministic Nonlinear Oscillators, Developments in Mechanics, 19:6.7-6.9, South Dakota School of
Mines & Technology, Rapid City, SD, 1998.
[39]
Hilton, H. H., Vinson, J.R. and Yi,
Sung, Viscoelastic damping contributions to dynamic piezo-electric responses, Proceedings of the International Modal
Analysis Conference XVI, II:1433-1439,
1998.
[38]
Hilton, H. H., Vinson, J. R. and Yi,
Sung, Nonlinear Anisotropic Piezo-electro-thermo-Viscoelasticity with
Applications to Composite Plates, Proceedings of the 35th Annual Meeting of
the Society for Engineering Science, Pullman
WA, September 27-30, 1998.
[37]
Hilton, H. H. and Yi, Sung, Creep
Divergence of Nonlinear Viscoelastic Lifting Surfaces with Piezo-electric
Control, Proceedings of the Second
International Conference on Nonlinear Problems in Aviation and Aerospace, Daytona Beach, FL, April 29 - May 1,
1998.
[36]
Beldica, C.
E., Hilton, H. H. and Yi, Sung, A Sensitivity Study of Viscoelastic, Structural
and Piezo-electric Damping for Flutter Control, Proceedings 39th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics
and Materials Conference, 2:1304-1314, (AIAA Paper 98-1848), 1998.
[35]
Hilton, H. H. and Yi, Sung, Large
Deformation Generalized Anisotropic Nonlinear Viscoelastic Constitutive
Relations: Mathematical Modeling and Numerical Simulations, Proceedings of the Second International
Conference on Mechanics of Time Dependent Materials, 23-25, Pasadena, CA, 1998.
[34]
Beldica, C.
E., Hilton, H. H. and Yi, Sung, Viscoelastic Damping and Piezo-electric Control
of Structures Subjected to Aerodynamic Noise, Proceedings of the 4th AIAA/CEAS Aeroacoustics Conference, (AIAA Paper 98-2343), 2:805-815, Toulouse, France, 1998.
[33]
Hilton, H. H. and Yi, Sung, Stochastic
Delamination Simulations of Nonlinear Viscoelastic Composites during Cure, Proceedings of the Fourth International
Conference on Stochastic Structural Dynamics, South Bend, IN, August 6 - 8, 1998.
[32]
Hilton, H. H., Vinson, J. R. and Yi,
Sung, Viscoelastic Damping Contributions to Dynamic Piezo-electric
Responses, Proceedings of the International Modal Analysis Conference XVI,
II:1433-1439, 1998.
[31]
Yi, Sung and Hilton, H. H., Thermo-rheological Behavior of Polymer Matrix
Composites During Curing Processes, Proceedings
of 38th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials
Conference, (AIAA Paper 97-1326), April 15-17, 1997.
[30] Hilton, H. H. and Yi, Sung, Mathematical and
Numerical Analysis Issues in Nonlinear Anisotropic Viscoelastic Composites, Proceedings
Second SIAM Conference on Mathematical Aspects of Material Science, pp. 25, Philadelphia, 1997.
[29] Yi, Sung and Hilton, H. H., Free edge stresses
in elastic and viscoelastic composite laminates under uniaxial extension,
bending and twisting. Proceedings of the Conference on Megatrends
in Mechanics and Materials: Infrastructure and Industrial Applications (McNU
97), pp.113, Evanston, IL, 1997.
[28]
Hilton, H. H., Vinson, J. R., and Yi,
Sung, Anisotropic Piezo-Electro-Thermo-Viscoelasticity Theory with Applications
to Composites. Proceedings of the Eleventh International Conference on Composite
Materials (ICCM-11), Gold Coast, Australia, July 14-18, 1997.
[27]
Yi, Sung and Hilton, H. H., Ahmad, M.
F, Finite Element Analysis on Coarse Grained
Vector Machines of Residual Stresses in Plastic IC Packages During
Surface Mounting Processes, HPC 97, Santiago, July, 1997.
[26]
Xioa, Z. M.,
Guo, J. Y. and Yi, Sung, Moisture-Induced Cracking in Plastic Encapsulant with
Voids, Proceedings of the 2nd International
Symposium on Electronic Packaging Technology, pp. 450-455, Shanghai, China,
Dec. 9-12, 1996.
[25]
Yi, Sung, Ling, S. F., and Ying, M.,
Dynamic Response of Composite Shell Structures with Viscoelastic Damping
Treatment, Proceedings of the KSME International Session on Dynamics, Systems and Design,
pp. 64-71, Inchon, Korea, Nov. 1-2, 1996.
[24]
Yi, Sung, Hilton, H. H.,
Ahmad, M. F., and Pierson, K. H., Cure
Cycle Simulations of Composites with Temperature and Cure Dependent Anisotropic
Viscoelastic Properties, Proceedings of
37th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials
Conference, (AIAA-96-1577), Salt Lake City, Utah, USA,. April 15-17, 1996.
[23]
Yi, Sung, Goh, J. S. and Yang, J.
C., Finite Element Analysis of Hygrothermally
Induced Stresses in Plastic Packages, Proceedings of 5th International Symposium
on the Physical and Failure Analysis of Integrated Circuits (IPFA-95),
pp.11 - 16, Singapore, Nov. 27 - Dec. 1, 1995.
[22]
Yi, Sung, Hilton, H. H. and Ahmad, M.
F., Curing Process Induced Viscoelastic
Residual Stresses in Polymer Matrix Laminated Composites, Proceedings
the ASME Materials Division, Vol. 1, pp.65 - 76, 1995.
[21]
Yi, Sung, Effects of Time-Dependent
Interfacial Layer on Thermo-mechanical Response of Polymer Matrix Composites, Proceedings of International Conference on
Mechanics and Material Engineering, pp. 802-808, 1995.
[20]
Yi,
Sung, Hilton, Harry
H., Ahmad, M. Fouad and Pierson,
Kendall
H., Viscoelastic Constitutive Relations and Finite
Element Analysis of Residual
Stresses in Thermosetting Matrix
Composites during Cure
Processes, Proceedings NCSA/IMM/NIST Workshop on Modeling the Development of
Residual Stresses During Thermoset Composites Curing, 1-18, 1995.
[19] Yi, Sung, Pierson, K. H., Ahmad, M. F. and
Hilton, H. H., MIMD Implementations of
Finite Element Analysis of Polymer Matrix Composite Structures, Proceedings of Fourth International
Conference on Applications of Supercomputers in Engineering, pp. 237-252,
Milan, Italy, June 19-21, 1995.
[18] Yi, Sung and Hilton, H. H., Constitutive Relations for Thermosetting
Resins During Curing Processes, Proceedings
of 36th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials
Conference, (AIAA-95-1428), New Orleans, Louisiana, USA,. April 10-12,
1995.
[17] Yi, Sung, Ahmad, M. F., and Hilton, H. H.,
Manufacturing Process Induced Residual Deformation and Stress in Filamentary
Polymer Matrix Composites, Proceedings
of 36th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials
Conference, (AIAA-95-1476), New Orleans, Louisiana, USA, April 10-12, 1995.
[16] Hilton, H. H., Yi, Sung and Dynyluk, M.
J., Stochastic Delamination Buckling of
Elastic and Viscoelstic Columns, Computational Stochastic Mechanics,
Edited by P. D. Spanos, Balknema, Rotterdam, Netherlands, pp. 687-696, 1995.
[15] Yi, Sung, Hilton, H. H. and Ahmad, M.
F., Nonlinear Thermo-viscoelastic
Analysis of Interlaminar Stresses in Laminated Composites, Proceedings of 35th AIAA/ASME/ASCE/AHS/ASC Structures, Structural
Dynamics and Materials Conference, (AIAA Paper 94-1637), Hilton Head, South
Carolina, USA, April 18-21, 1994.
[14] Yi, Sung, Ahmad, M. F. and Ramesh, A.
Data Parallel Finite Element Computation for Thermo-Viscoelastic Composite
Structures, Proceedings of 2nd International Conf. on Computational
Structures Technology: Advances in Parallel and Vector Processing for
Structural Mechanics, pp. 207-214, Athens, Greece, August 30-September 1,
1994.
[13] Yi, Sung, Hilton, H. H. and Ahmad, M.
F., Finite Element Analysis of Thick
Thermosetting Matrix Composite Curing Process, Proceedings of 2nd
International Conf. on Computational Structures Technology: Advances in
Non-Linear Finite Element Methods, pp. 177-186, Athens, Greece, August
30-September 1, 1994.
[12] Yi, Sung, Hilton, H. H. and Ahmad, M.
F., Performance Evaluations of
Viscoelastic Finite Element Supercomputer Algorithms, Proceedings of Third International Conference on Applications of
Supercomputers in Engineering, pp. 497-510, Bath, UK, September 27-29,
1993..
[11] Hilton, H. H. and Yi, Sung, Stochastic Thermo-Viscoelastic Delamination
Failure Analysis of Laminated Composites, Proceedings
of 6th International Conference on Structural Safety and Reliability,
Innsbruck, Austria, pp. 615-621, 9-13 August,1993.
[10] Yi, Sung, Ahmad, M. F., and Hilton, H.
H., Dynamic Responses of Plates with
Viscoelastic Damping Treatment, Proceeding of Fourteenth Biennial ASME
Conference on Mechanical Vibration and Noise, Albuquerque, New Mexico, USA, , pp. 437-445,
September 19-22, 1993.
[9] Yi, Sung, Pollock, G., Ahmad, M. F., and
Hilton, H. H., Thermo-viscoelastic
Analysis of Fiber-Matrix Interphase, Proceedings
of 34th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials
Conference, (AIAA-93-1517), pp.
1803-1817, 1993.
[8] Hilton, H. H. and Yi, Sung, Large Deformation Analysis of Finite Length,
Encased, Nonlinear Elastic, Pressurized Circular Cylinders , Proceeding of 2nd U. S. National Congress on Computational Mechanics, Washington,
D.C., USA, August 16-18, 1993, pp. 189.
[7] Yi, Sung, Hilton, H. H., Ahmad, M. F., and
Pollock, G. D., Viscoelastic Stress
Analysis around Cutouts in Composite Laminated Shells , Proceeding of 2nd U.S.
National Congress on Computational Mechanics, Washington, D.C., USA, August
16-18, pp. 215, 1993.
[6] Hilton,
H. H. and Yi, Sung, Structural Motion Control by Analytical Determination of
Optimum Vscoelastic Properties, Adaptive Materials and Adaptive Structures,
G. J. Knowles, Editor, Institute of Physics Publishing, Philadelphia, pp.
495-500, 1992 .
[5] Yi, Sung,
Thermoviscoelastic Analysis of Delamination Onset and Free Edge Response
in Epoxy Matrix Composite Laminates, Proceedings
of 32nd AIAA/ASME/ ASCE/AHS/ASC Structures, Structural Dynamics and Materials
Conference, pp. 1016-1026, 1991.
[4] Hilton, H. H. and Yi, Sung, Dynamic Finite Element Analysis of
Viscoelastically Damped Composite Structures, Applications of
Supercomputers in Engineering II, C. A. Brebbia,
D. Howard and A. Peters (eds.), Elsevier Applied Science, London, pp. 495-511, 1991.
[3] Hilton, H. H. and Yi, Sung, Structural
Motion Control by Analytic Determination of Optimum Viscoelastic Material
Properties, Proceedings of ADPA/AIAA/ ASME/SPIE Active Materials and Adaptive
Structures Conference, 1991,
pp.227-231.
[2] Hilton, H. H. and Yi, Sung, Bending and Stretching Finite Element
Analysis of Anisotropic Viscoelastic Composite Plates, Proceedings
of Third Air Force/NASA Symposium on Recent Advances in Multidisciplinary
Analysis and Optimization, pp.
488-494, 1990.
[1] Hilton, H. H. and Yi, Sung, Finite Element Formulation for
Thermo-Viscoelastic Analysis of Composite Structures Subjected to Mechanical
and Hygrothermal Loadings, Proceedings of First NCSA Conference on
Finite Element Applications in Computational Mechanics, pp. 1-11, 1990.
Other Research and
Other Creative Achievements
A. US
Patents
Held and Applications:
[14] Patent Number: US8302270 B2, Filing Date: Jan. 10, 2011, Issue Date: Nov. 6, 2012
Title: Method of manufacturing capacitor-embedded
Inventors: Woon-Chun KiM, Sung Yi, Hwa-Sun Park, Hong-Won Kim, Dae-Jun Kim, Jin-Seon Park
[13] Patent Number: US8283251 B2, Filing Date: Sept. 22, 2011,Issue Date: Oct. 9, 2012
Title: Method of manufacturing wafer level package
Inventors: Seung Seoup Lee, Sung
Yi
[12] Patent Number: US8351215 B2, Filing Date: Jan. 28, 2009, Issue Date: Jan. 8, 2013
Title: Method of manufacturing a chip embedded printed
circuit board
Inventors: Hong Won Kim, Sung Yi, Tae Sung Jeong, Joon Seok
Kang
[11] Patent Number: US8283768 B2, Filing Date: Apr. 15, 2009, Issue Date: Oct. 9, 2012
Title: Wafer Level package for heat dissipation and
method of manufacturing the same
Inventors: Joon Seok Kang, Sung Yi, Young Do Kweon
[10] Patent Number: 8110914, Filing Date: Jan 7, 2009, Issue Date: Feb 7, 2012
Title: Wafer level package with removable chip
protecting layer
Inventors: Joon Seok Kang, Sung Yi, Young Do Kweon
[9] Patent Number: 7992296, Filing Date: Jan 9, 2009, Issue Date: Aug 9, 2011
Title: PCB and manufacturing method
thereof
Inventors: Woon-Chun Kim, Sung Yi
[8] Patent Number: 7982982, Filing Date: Jan 16, 2009, Issue Date:
Jul 19, 2011
Title: Wafer Level Packaging
Image Sensor Module Having Lens Actuator
Inventors: Seung Seoup Lee,
Sung Yi
[7] Patent Number: 8026590, Filing Date: Oct 17, 2009, Issue Date: Sep 27, 2011
Title: Die package and method of manufacturing the same
Inventors:
Joon Seok Kang, Young Ho
Kim, Young Do Kweon, Jin Gu
Kim, Sung Yi
[6] Patent Number: 8064215, Filing Date: Sep 5, 2008, Issue Date: Nov 22, 2011
Title: Semiconductor chip package and printed circuit
board
Inventors: Yul-Kyo Chung, Sung Yi, Soon-Gyu Yim, Seog-Moon
Choi, Jin-Gu Kim, Young-Do Kweon
[5] Patent Number: 7727877, Filing Date: Apr 24, 2008, Issue Date: Jun 1, 2010
Title: Method of Manufacturing a Wafer Level Package that Uses the Same Seed Layer
Inventors: Joon-Seok
Kang, Sung Yi, Jong-Hwan Baek, Young-Do Kweon
[4] Patent Number: 7886414, Filing Date: Apr 22, 2008, Issue
Date: Feb 15, 2011
Title: Method of Manufacturing Capacitor-embedded PCB,
Inventors: Woon-Chun Kim, Sung Yi, Hwa-Sun Park, Hong-Won Kim, Dae-Jun
Kim, Jin-Seon Park
[3] Patent Number: 7730612, Filing Date: Apr 22, 2008, Issue
Date: Jun 8, 2010
Title: Method of Manufacturing Component-embedded Printed Circuit
Board
Inventors: Hwa-Sun Park, Sung Yi, Sang-Chul Lee, Jong-Woon Kim, Yul-Kyo Chung
[2] Patent Number: 7632709, Filing Date: Apr 25, 2008, Issue
date: Dec 15, 2009
Title: Method of manufacturing wafer level package
Inventors: Hyung-Jin Jeon,
Sung Yi, Young-Do Kweon, Jong-Yun Lee, Joon-Seok Kang, Seung-Wook Park
[1] Patent Number: 7663250, Filing Date: Sep 4, 2008, Issue
Date: Feb 16, 2010
Title: Wafer Level Package and Manufacturing Method Thereof
Inventors: Hyung Jin Jeon,
Sung Yi, Jong Yun Lee, Young Do Kweon, Jong Hwan Baek
In addition, 10 Patent Applications have been filed.