Sung Yi  


Mailing Address:
Mechanical Engineering Department
Portland State University
Post Box 751
Portland, Oregon 97207-0751
Fax:     (503) 725-8255
Phone: (503) 725-5470
Email: syi@pdx.edu

At a Glance     Education     Teaching/Research Experience     Professional Activities   

Awards & Honors     Research Grants      Publications


At a Glance:

Currently Sung Yi holds a professor position at the Department of Mechanical and Materials Engineering of the Portland State University, OR. He was awarded a Ph.D. degree in aeronautical and astronautical engineering from the University of Illinois at Urbana-Champaign, IL, in 1992. His primary teaching and research interests lie in the areas of microelectronic packaging, delamination & failure mechanisms of electronic packages and composites, constitutive modeling and characterization of materials, computational simulation, etc.

In 1991, Dr. Yi developed a time-dependent failure criterion for delamination onsets in laminated composites, thereby significantly contributing to the prediction of life times of composites and received the Jefferson Goblet paper award at the 32nd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, Baltimore, MD. He also received the Roger A. Strehlow Memorial Award for his outstanding research accomplishment in UIUC in 1992. He co-developed the "Yi-Hilton model’’ to describe the chemo-thermo-viscoelastic behavior for thermosetting polymers during curing. Recently, he co-created a new technical term "piezoelectro-hygro-thermo-viscoelasticity" for PVDF smart materials and successfully formulated the variational principle for piezo-electro-hygro-thermo-viscoelastic materials. He is the first one who formulated based on coupling hygro-thermo-viscoelastic physics and solved the pop-corn problem which is one of the most critical reliability problems in plastic IC packages. He also developed the system to measure in-situ moisture ingress in IC packages and polymers with complex geometry and to calculate their diffusion properties accurately.

After joining Samsung Electro-Mechanics in 2006, he has been privileged to build a brand new microelectronic packaging team. The mission of the Packaging Team is generating creative microelectronics packaging technology and providing total packaging solutions for all products. The team is focusing on core future technology and it's incubation. This approach makes the company have more aggressive R&D culture. In Samsung, he and his team developed several advanced electronic and MEMS packaging technologies including embedding active devices and passives into organic substrates, the world’s smallest saw filter using wafer level packaging, ALOX high thermal dissipation substrate technology for power devices and LED devices, 3-D advanced packaging technology, etc. The embedding IC into substrate technology received the Samsung Technology award in 2008. He also received a Hedong Technology award in 2007. The Hedong Award is an award sponsored by Hedong Science Cultural Foundation.

Most of his current research efforts have direct applications to the critical technologies needed in developing the next generation of MEMS and IC packaging.


Education:


Teaching/Research Experience:

·         Vice President  (2006-2008)
Central R&D Institute, Samsung Electro-Mechanics, Suwon, Korea, 443-743.

·         Head of Engineering Mechanics Division, School of Mechanical and Production Engineering, Nanyang Technological University, Singapore (2001-2002)

·         Singapore-MIT Alliance Fellow (1999 - 2002)

·         Associate Professor (1999-2002), Senior Lecturer (1997 - 1998), Lecturer (1995-1996), School of Mechanical and Production Engineering, Nanyang Technological University, Singapore

·         Visiting Assistant Professor (1994 - 1995), Department of Theoretical and Applied Mechanics, University of Illinois at Urbana-Champaign, Urbana, USA

·         Research Fellow (1991 - 1997), NCSA (National Center for Supercomputing Applications), University of Illinois at Urbana-Champaign, Urbana, USA.

 


 

Professionally-related Service

 

A.  Editorial Board

 

·       Editorial Advisory Board Member for the Journal of Soldering and Surface Mount Technology (1998-present).

·       Editorial Advisory Board Member for the Journal of Recent Patents on Electrical Engineering, (2007-present).

·       Editorial Board Member for Journal of the Microelectronics and Packaging Society, Korea (IMAPS, Korea) (2007-2008).

·       Associate Editor for ASME: Journal of Electronic Packaging (2001-2004).

·       Editorial Advisory Board Member for the Journal of Finite Elements in Analysis and Design (2000-2004).

·       Guest Editor with D. C. Whalley and P. P. Conway, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No.3, July 2003.

·    Guest Editor for a Special Issue on Application of Finite Element Analysis in Electronic Packaging for the Journal of Finite Elements in Analysis and Design, Vol. 30, 1998.

·       Co-Editor, IES Journal of Manufacturing, Institute of Engineers, Singapore. (1997-2001)

 

B.  Conference/Symposium Organizer/Chair/Advisory Committee

 

·    Program Chair, US-Korea Conference on BNCIT (Bio-Nano, Communications-Information, Transportation) Systems Technology, Hyatt Regency Hotel, San Francisco, CA, August 6-9, 2014.

·      International Steering Committee Member, 15th International Conference on Electronic Materials and Packaging Materials, Seoul, Korea, Oct. 6-9, 2013.

·    International Steering Committee Member, 14th International Conference on Electronic Materials and Packaging Materials, Hong Kong, December 13-16, 2012.

·       International Advisory Committee Member, IMPACT2012, Taipei, Taiwan, Oct. 24-26, 2012.

·     International Advisory Committee Member, 13th International Conference on Electronic Materials and Packaging Materials, Kyoto, Japan, December 12-15, 2011.

·     Program Chair, The 5th North-West US-Korea Conference on BNCIT (Bio-Nano, Communications-Information, Transportation) Systems Technology, Portland State University, Portland, OR, December 11-12, 2010.

·      Chair, 12th International Conference on Electronic Materials and Packaging Materials, Orchard Hotel, Singapore, October 25-27, 2010.

·       International Advisory Committee Member, IMPACT/EMAP2008, Taipei, Taiwan, Oct. 22-24., 2008.

·       Technical Track Committee Chair, Advanced Packaging, ASME INTERPACK 2007, Vancouver, BC, Canada, July 8-12, 2007.

·       International Advisory Committee Member, EMAP2007, Daejun, Korea, 19-22 Nov., 2007.

·       Advisory Committee Member, Micro-Joining & Packaging Society, 2007.

·       Symposium Advisory Committee Member, Microelectronics Science & Technology (MST) Symposium, UKC2006, New York, USA, August 11-13, 2006.

·       Chair, 5th International Conference on Electronics Materials and Packaging Materials, Singapore, Nov. 17-20, 2003.

·      International Advisory Committee Member, EUROSMT2002, Paris, France, September 10-14, 2002.

·       International Advisory Committee Member, 4th International Conference on Electronics Materials and Packaging Materials, Kaoshiung, Taiwan, Dec. 4 - 6, 2002.

·       Track Committee Member for Phonic and Optoelectronics Packaging for ASME INTERPACK 2001 Hawaii, USA, 2001.

·       Chairman, Symposium on Packaging Materials & Processes for Microelectronics, Optoelectronics, MEMS and Displays, Singapore, July 1- 6, 2001.

·       International Advisory Committee Member, 3rd International Symposium on Electronics Packaging and Materials, Cheju, Korea, November 30- December 2, 2001,

·       Technical Committee Member, POLYTRONIC 2001, Potsdam, Germany, October 21-24, 2001.

·       International Advisory Committee Member, 2nd International Symposium on Electronics Packaging and Materials, Hong Kong, November 30- December 2, 2000.

·       Conference Committee Member, the 3rd Annual IMAPS-UK/IEEE-CPMT/ASME/SPE/SPIE/ MRS Workshop (POLY 2000), London, England, December 3-6, 2000.

·       Program Committee Member, International Symposium on Smart Structures and Microsystems, Hong Kong, October 19-21, 2000.

·       Program Chair, International Symposium on Electronics Packaging and Materials, Singapore, September 1999.

 


Awards and Honors:

·       Learning Star Award (Intel-ATD, Malaysia, 2009)

·       Hedong Technology Award (Hedong Foundation, 2007)

·       Appointed to a Technology Development Strategy Committee Member by Ministry of Commerce Industry and Energy, Korea (Oct. 2007)

·       Who’s Who in Science and Engineering (1998)

·       Roger A. Strehlow Memorial Award  (AAE, UIUC, 1992)

·       AIAA Jefferson Goblet Paper Award  (32nd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, Baltimore, MD, USA, 1991)

·       Member, Tau Beta Pi, National Engineering Honorary Society

·       Member, Sigma Xi, The Scientific Research Society

 

Research Projects & Grants:


Plenary, Keynote or Invited Talks at Conferences or International Meetings


Publications

 Refereed Publications or Other Creative Achievements

 

 

1.      Books, Journal Special Issue & Conference Proceedings

 

Edited Journal Special Issues:

 

[2]    Special Issue on Electronic Materials and Packaging, with D. C. Whalley and P. P. Conway, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No.3, July 2003.

[1]     Special Issue on Application of Finite Element Analysis in Electronic Packaging, with M. Petch, Finite Elements in Analysis and Design, Vol. 30, No 1/2, 1998.

 

 

Edited Conference Proceedings:

 

[2]    Proceeding of 12th International Conference on Electronics Materials and Packaging, Sung Yi and Paul P. Conway, (Eds.), ISBN-13: 978-1456597832, ISBN-10: 1456597833, 2010.

[1]    Proceeding of 5th International Conference on Electronics Materials and Packaging, Sung Yi, D. Whalley and K. C. Teo, (Eds.), ISBN: 981-05-0078-5, 2003.

 

 

2.      Chapters

 

[2]     Yi, Sung, Hygro-Thermally Induced Residual Stresses and Failures in Plastic IC Packages During Reflow Process, Encyclopedia of Thermal Stresses, Edited by Richard Hetnarski, Springer, May 2012 (In Press).

[1]     Yi, S., Hilton, H. H., and Ahmad, M. F., Thermo-viscoelastic Finite Element Analysis Performance on Coarse Grained and Massively Parallel Supercomputers, High Performance Computing in Engineering, Edited by Henry Power and C. A. Brebbia, Computational Mechanics Publications, UK, 2: 167-198, January 1995.

 

 

3.      Articles

 

 

[92]   Yi, Sung and Tran, Hieu T., Shear Strengths of CBGA/PBGA Solder Ball Joints with Lead-Free Solder Pastes, International Journal of Materials and Structural Integrity, 2014 (In Press).

[91]  Chu, Y. F., Yi, Sung, and Geng, Phil, Thermal Fatigue Life Prediction of Solder Joints of Plastic Ball Grid Array Packages, International Journal of Materials and Structural Integrity, 2014 (In Press).

[90]   Yi, Sung, Kim, KyungO, Lee, Dongwan, Kim, Hongwon and Jung, Taesung, Embedded Passive Device Technology for Wireless Mobile Devices, Microelectronics International, Vol. 30, Iss: 1, pp.33 – 39, 2013.

[89]   Lee, H., Kim, D. and Yi, S., Horizontally Progressive Mirror for Blind Spot Detection in Automobiles, Optics Letters, Vol. 38, No. 3, pp. 317-319, 2013.

[88]   Yi, Sung and Lam, Tatiana M., Analysis of Warpage and Residual Stress in Plastic Ball Grid Array Package after Post Mold Cure, Microelectronics International, Vol. 29, No. 3, pp. 163-171, 2012.

[87]   Na, H. C., Sung, T. J., Yoon, S. H., Hyun, S. K., Kim, M. S., Lee, Y. G., Shin, S. H., Choi, S. M. and Yi, Sung, Formation of Unidirectional Nanoporous Structures in Thickly Anodized Aluminum Oxide Layer, Transactions of Nonferrous Metals Society of China, Elsevier Publisher, Vol. 19, Issue 4, pp. 1013-1017, 2009.

[86]   Yuan, Jingli, Jeung, Won-Kyu , Lim, Chang-Hyun, Park, Seung-Wook, Kweon, Young-Do and Yi, Sung, A Low-cost through Via Interconnection for ISM WLP, Microsystem Technologies, Vol. 15, No. 8, pp. 1273-1277, 2009.

[85]   Kim, H. H., Choi, S. H., Shin, S. H., Lee, Y. K., Choi, S. M. and Yi, Sung, Thermal Transient Characteristics of Die Attach in High Power LED PKG, Microelectronics Reliability, Vol. 48, Issue 3, pp. 445-454, 2008.

[84]   Gao, S., Hong, J.P., Kim, J.S., Yoo, D.J., Jeong, T.S., Choi, S.M. and Yi, Sung, Development of an Ultra-Slim System in Package (SiP), Journal of the Microelectronics and Packaging Society, Vol. 15, No. 1, pp. 7-18, 2008.

[83]   Sung, T. J., Jung, Taek Kyun, Kim, Mok Soon and Yi, Sung, Processing and Properties of Al Based Amorphous/Crystalline Alloy Composites,  Materials Science Forum - MATER SCI FORUM, Vol. 544-545, pp. 431-434, 2007.

[82]   Yi, Sung, Park, Sang Kyoo and Teo, Kiat Choon, A Study of Aluminum Wire Failure in Automotive under-hood Applications, Microelectronics International, Vol. 23, Issue: 2, pp.11 – 20, 2006.

[81]   Noh, S. J., Jung, Taek Kyun , Lee, Dong Suk, Kim, Mok Soon and Yi, Sung, Synthesis and Properties of Bulk Amorphous/Nanocrystalline Aluminum Alloy Composites,  Materials Science Forum - MATER SCI FORUM, Vol. 510-511, pp. 830-833, 2006.

[80]   Ling, S. F., Zhang, D., Yi, Sung and Foo, S. W., Real-Time Quality Evaluation of Wire Bonding Using Input Impedance, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29, Issue 4, pp. 280 – 284, Oct. 2006.

[79]   Su, Fei, Chian, K. S. and Yi, Sung, An Optical Characterization Technique for Hygroscopic Expansion of Polymers and Plastic Packages, Microelectronics Reliability, 46(2-4): pp. 600-609, 2006.

[78]   Beldica, Cristina E., Hilton, Harry H. and Yi, Sung, Viscoelastic Damping and Piezo-electric Control of Structures Subjected to Aerodynamic Noise, Technical Acoustics, ISSN 1819-2408, 2006.

[77]   Liu, L., Yi, Sung, Ong, L. S., Chain, K. S., Osiyemi, S., Lim, S. H., Su, F., Chemo-thermal Modeling and Finite Element Analysis for Microwave Cure Process of Underfill in Flip-Chip Packaging, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 4, pp. 355-362, October 2005.

[76]   Su, Fei, Chian, Kerm Sin, Yi, Sung, and Dai, Fulong, Development and Instrumentation of an Integrated Three–dimensional Optical Testing System for Application in Integrated Circuit Packaging, Review of Scientific Instruments, Vol. 76, Issue 9, On page(s): 093109 - 093109-5, 2005.

[75]   Zhang, J., Li, M., Xiong, C. Y., Fang, J., and Yi, Sung, Thermal Deformation Analysis of BGA Package by Digital Image Correlation Technique, Microelectronics International, Vol. 21, No.2, pp. 45-51, 2004.

[74]   Hilton, H. H. and Yi, Sung, Generalized Viscoelastic 1-DOF Deterministic Nonlinear Oscillators, Nonlinear Dynamics, Vol. 36, pp. 281–298, 2004.

[73]   Su, Fei, Dai, Fulong, Chian, Kerm Sin, Yi, Sung, Simultaneous recording of fringe patterns with one camera, Acta Mechanica Sinica , Vol. 20, No. 6, pp. 642-648, 2004.

[72]   Yi, Sung and Gao, Shan, Thermo-mechanical Behavior of Cracked Ti-55.4%Ni Shape Memory Alloys under Mechanical Loading, Key Engineering Materials, Vols, 261-263, pp. 903-912, 2004.

[71]   Liu, Lie, Yi, Sung, Ong, Lin Seng and Chian, Kerm Sin, Finite Element Analysis for Microwave Cure of Underfill in Flip Chip Packaging, Thin Solid Films, Vols. 462-463, pp. 436-445, September 2004.

[70]   Tee, T. T., Yi. Sung, Shen, X, Su, F., and Zhong, Z., Comprehensive Numerical and Experimental Analysis of Matrix TFBGA Warpage, Journal of Surface Mount Technology, Vol. 17, Issue 2, pp. 11-17, 2004.

[69]   Su, F., Yi, Sung and Chian, K. S., A Simple Method to Unwrap the Geometrically Discontinuous Phase Map and its Application in the Measurement of IC Package, Optics and Lasers in Engineering, Vol. 41,  pp. 463–473, 2004.

[68]   Su, F., Sun, Y., Chian, K. S. and Yi, Sung, Use of Wollaston Prism to Simplify the Polarization Method for Simultaneous Recording of Moiré Interferometry Fringe Patterns, Optics Engineering, Vol. 43, No 12, pp. 3003–3007, December 2004.

[67]  Xiong, C. Y., Zhang, J., Li, M., Fang, J., and Yi, Sung, Fourier and wavelet transform analysis of Moiré Fringe Patterns in Electronic Packaging, Microelectronics International, Vol. 21, No.2, pp. 45-51, 2004.

[66]   Chia, Y. C., Yam, H. S., Lim, S. H., Chian, K. S., Yi, Sung and Chen, W. T., An Optimization Study of Underfill Dispensing Vol., IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 3, pp.205-210, July 2003.

[65]   Gao, S. and Yi, Sung, Experimental Study on the Anisotropic Behavior of Textured NiTi Pseudoelastic Shape Memory Alloys, Materials Science and Engineering A, Vol. 362, Issues 1-25, pp. 107-111, December 2003.

[64]   van Driel, W.D., Zhang, G. Q., Janssen, J.H.J., Ernst, L.J., Su, F., Chian, K. S. and Yi, Sung, Prediction and Verification of Process Induced Warpage of Electronic Packages, Microelectronics Reliability Vol. 43 pp. 765–774, 2003.

[63]   Fu, Y., Du, H., Gao, S. and Yi, Sung, Mechanical Properties of Sputtered TiNiCu Shape Memory Alloy Thin Films, Material Science Forums Vol. 437-438, pp.37-40, 2003.

[62]   Donthu, S. K., Vora, M. M., Lahiri, S. K., Thompson, C. V. and Yi, Sung,  Activation Energy Determination for Recrystallization in Electroplated-Copper Films Using Differential Scanning Calorimetry, Journal of Electronic Materials, Vol. 32, No. 6, pp. 531 – 534, 2003.

[61]    Yi, S, Luo G. X. and Chian, K. S., Viscoplastic Micro-Deformation Mechanism of Eutectic Solders,  Transaction of ASME: Journal of Electronic Packaging, Vol. 124, pp. 92-96, 2002.

[60]   Yi, Sung, Chian, K. S. and Hilton, H. H., Nonlinear Viscoelastic Finite Element Analyses in Thermosetting Polymeric Composites During Cool-Down After Curing, Journal of Composite Materials, Vol. 36, No. 01, pp. 3-17, 2002.

[59]   Gao, Shan and Yi, Sung, Fracture Toughening Analysis of Shape Memory Alloys, Key Engineering Materials, Vol. 227, pp. 49-54, 2002.

[58]    Wang, B. and Yi, Sung, Dynamic Plastic Behavior of 63 wt% Sn 37 wt% Pb Eutectic Solder under High Strain Rates, Journal of Materials Science Letters, Vol. 21, pp. 697– 698, 2002.

[57]   Chian , K. S., Du, X. Y., Goy, H. A., Feng, J. L., Yi, Sung and Yue, C. Y.,  Mechanical Properties and Morphology of Poly(ethylene glycol)-side-chain-modified Bismaleimide Polymer Journal of Applied Polymer Science, Vol. 86, Issue 3, pp. 715-724, October 2002.

[56]   Chian, K. S., Du, X. Y., Goy, H. A., Feng, J. L., Yi, Sung and Yue, C. Y.,  Synthesis of Bismaleimide Resin Containing the Poly(ethylene glycol) side Chain: Curing Behavior and Thermal Properties, Journal of Applied Polymer Science, Vol. 85, Issue 14, Date: 29 pp. 2935-2945, 2002.

[55]   Zhong, C. H., Yi, Sung and Whalley, D. C.,  Solder Ball Failure Mechanisms in Plastic Ball Grid Array Packages, Soldering & Surface Mount Technology, Vol. 14, No. 2, pp. 40-50, 2002.

[54]  Chian, K. S. and Yi, Sung, Synthesis and Characterization of an Isocyanurate-oxazolidone Polymer: Effect of Stoichiometry, Journal of Applied Polymer Science, Vol. 82, Issue 4, pp. 879-888, 2001.

[53]   Yi, Sung, Ling S. F. and Ying, M., Time Domain Analysis of Acoustic-Structures Interaction Problems, The Journal of Acoustics Society of American, 109 (6), pp. 2762- 2770, 2001.

[52]   Shen, L. and Yi, Sung, An Effective Inclusion Model of Effective Elastic Moduli of Microcracked Solids, International Journal for Solids and Structures, Vol. 38, pp. 5789-5805, 2001.

[51]   Yi, Sung, Gao, S. and Shen, L., Fracture Analysis of Shape Memory Alloys under Mixed Mode Loading,  International Journal for Solids and Structures, Vol. 38, pp. 4463-4476, 2001.

[50]   Yi, Sung, Kim, J. K., Yue, C. Y. and Hsieh, J. H., Adhesion Strengths of Epoxy Molding Compounds to Gold Plated Copper, The Journal of Adhesion, Vol. 73, pp. 1-17, 2000.

[49]   Shen, L and Yi, Sung, Approximate Evaluation for Effective Elastic Moduli for Cracked Solids, International Journal of Fracture, Vol. 106, No. 2, pp. 15-20(6), Nov. 2000.

[48]   Yi, Sung, Kim, J. K., Yue, C. Y. and Hsieh, J. H., Bonding Strengths at Plastic Encapsulated-Gold Plated Copper Leadframe Interface, Microelectronics Reliability, Vol. 40, pp.1207-1214, 2000.

[47]   Yi, Sung and Sze, K. Y.,  A Finite Element Formulation for Composite Laminates  with Smart Constrained Layer Damping, Advances in Engineering Software, pp 529-537, Vol. 31 (8-9), Aug. 2000.

[46]   Sze, K. Y., Yao, L. and Yi, Sung, A Hybrid-Stress ANS Solid-Shell Element and Its Generalization for Smart Structure Modeling - Part II: Smart Structure Modeling, International Journal for Numerical Methods in Engineering, Vol. 48, pp. 565-582, 2000.

[45]   Yi, Sung and Gao, S., Fracture Toughness of Shape Memory Alloys due to Martensite Transformation, International Journal for Solids and Structures, Vol. 37, pp.5315-5327, 2000.

[44]   Shen, L. and Yi, Sung, New Solutions for Effective Elastic Moduli of Microcracked Solids, International Journal for Solids and Structures, Vol. 37, pp. 3525-3534, 2000.

[43]   Yi, Sung, Shen, Lianxi, Kim, Jang Kyo and Yue, Chee Yoon, A Failure Criterion for Debonding between Encapsulants and Leadframes, Journal of Adhesion Science and Technology, Vol. 14, No. 1, pp. 93-105, 2000.

[42]   Chia, Y.C., Lim, S.H., Chian, K. S., Yi, Sung and Chen, W.T., An Optimization Study of Underfill Dispensing Process, International Journal of Microcircuits & Electronic Packaging, Vol. 22, No. 4, 1999, pp. 345-352.

[41]   Yi, Sung, Ling, S. F. and Ying, M., Large Deformation Finite Element Analyses of Composite Structures Integrated with Piezoelectric Sensors and Actuators, Finite Element Analyses and Design, UK, Vol. 35, pp. 1-15,  1999.

[40]   Yuan, W. Q. and Yi, Sung,  Pseudo-elastic Strain Estimation of Textured TiNi-based Shape Memory Alloys, Materials Science and Engineering Part. A, pp. 439-448, 1999.

[39]   Yuan, W. Q. and Yi, Sung Determination of Orientation Distribution Function in the TiNi-based SMA Parent and Martensite Phases, Scripta Materialia, 41(12), pp. 1319-1325, 1999.

[38]   Xiao, Z. M., Guo, J. Y., Yi, Sung, Stress Intensity Factors for Ring-Shaped Crack Surrounded by Spherical Inclusions, Theoretical and Applied Fracture Mechanics, Vol. 32, pp. 147-155, 1999.

[37]   Yi, Sung, Yue, Chee Yoon, Hsieh, Jang-Hsing, Fong, Liwha, Lahiri, Syamal K., Effects of Oxidation and Plasma Cleaning on Adhesion Strength between Copper Leadframes and Molding Compounds, Journal of Adhesion Science and Technology, Vol. 17, No. 7, pp.789-804, 1999.

[36]   Yi, Sung, Ling, S. F., Ying, M., Hilton, H. H. & Vinson, J. R.,  Finite Element Formulation of Anisotropic Coupled Piezo-hygro-thermo-viscoelastic-dynamic Problems, International Journal for Numerical Methods in Engineering, Vol. 45, pp.1531-1546, 1999.

[35]   Zhong, C. H.  and Yi, Sung,  Solder Joint Reliability of Plastic Ball Grid Array Packages,   Soldering and Surface Mount Technology, UK, Vol. 11, No. 1, pp.44-48, 1999.

[34] Hsieh, J.H., Fong, L.H., Yi, Sung, Metha, G.,   Plasma cleaning of copper leadframe with Ar and Ar/H2 gases, Surface and Coatings Technology, Vol. 112, No. 1-3, pp. 245-249, 1999.

[33]   Hilton, H. H. and Yi, Sung, Stochastic Delamination Simulations of Non-linear Viscoelastic Composites During Cure, Journal of Sandwich Structures & Materials, Vol. 1, pp. 111-127, April 1999.

[32]   Yi, Sung and Sze, K. Y.,  Cooling Rate Effect on Post Cure in Plastic Encapsulated IC Packages,  Transaction of ASME: Journal of Electronic Packaging, Vol. 120, pp. 385-390, 1998.

[31]   Yi, Sung, Ling, Shih-Fu, and Ying, Ming,  Finite Element Analysis of Composite Structures with Smart Constrained Layer Damping, Advances in Engineering Software, UK, Vol. 29, No. 3-6, pp. 265-271, 1998.

[30]   Ying, M., Zou, Q., and Yi, Sung,  Finite Element Analysis of Silicon Condenser Microphones with Corrugated Diaphragms, Finite Elements in Analysis and Design, Vol. 30, pp. 163-173, 1998.

[29]   Yi, Sung and Sze, Kam Yim,  Finite Element Analysis of Moisture Distribution and Hygrothermally Induced Stresses in TSOP Packages, Finite Elements in Analysis and Design, Vol. 30, pp. 65-79, 1998.

[28]   Yi, Sung and Hilton, H. H.,  Effects of Thermo-mechanical Properties of Composites on Viscosity, Temperature and Degree of Cure in Thick Thermosetting Composite Laminates during Curing Process, Journal of Composite Materials, Vol. 32, No. 7, pp. 600- 622, 1998.

[27]   Yi, Sung, Ahmad, M.F. and Hilton, H.H.,  Nonlinear Viscoelastic Stress Singularities near Free Edges of  Unsymmetrically Laminated Composites, International Journal for Solids and Structures, Vol. 35, pp.3221-327, 1998.

[26]   Yi, Sung, Hilton, H. H. and Ahmad, M. F.,  Cure Cycle Simulations of Composites with Temperature and Cure Dependent Anisotropic Viscoelastic Properties and Stochastic Delaminations, Mechanics of Composite Materials & Structures, Vol. 5, pp.81-101, 1998.

[25]   Hilton, H. H. and Yi, Sung,  The Significance of Anisotropic Viscoelastic Poisson’s Ratio Stress and Time Dependencies,  International Journal for Solids and Structures, Vol. 35, pp. 3081-3095, 1998.

[24]   Zou, Q., Tan, Z., Wang, Z., Lin, R., Yi, Sung, Gong, H., Lim, M., Liu Litian and Li Zhijian,  A Novel Integrated Silicon Capacitive Microphone, IEEE/ASME Journal of Microelectromechanical Systems, Vol. 7, No. 2, pp. 224-233, 1998.

[23]   Zou, Q., Tan, Z., Wang, Z., Lin, R., Yi, Sung, Gong, H., Lim, M., Li, Zhijian and Liu, Litian,  A Study on Corrugated Diaphragms for High-sensitivity Structures, Journal of Micromech. Microeng. Vol. 7, pp. 310-315, 1997.

[22]   Yi, Sung, Goh, J. S. and Yang, J. C.,  Residual Stresses in Plastic IC Packages During Surface Mounting Process Preceded by Moisture Soaking Test,  IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, USA, Vol. 20, No. 3, pp. 247-255, March 1997.

[21]   Yi, Sung and Hilton, Harry H.,  Free Edge Stresses in Elastic and Viscoelastic Composite Laminates under Uniaxial Extension, Bending and Twisting,  Transaction of ASME: Journal of Engineering Materials and Technology, 119:266-272, 1997.

[20]   Yi, Sung,  Finite Element Analysis of Free Edge Stresses in Nonlinear Viscoelasitc Composites Under Uniaxial Extension, Bending and Twisting, International Journal for Numerical Methods in Engineering, UK, Vol. 40, pp. 4225-4238, 1997.

[19]   Sze, K. Y., Yi, Sung, and Tay, M. H.,  An Explicit Hybrid Stabilized Eighteen-Node Solid Element for Thin Shell Analysis, International Journal for Numerical Methods in Engineering, UK, July, Vol. 40, pp. 1839-1856, 1997.

[18]   Yi, Sung, Effects of a Time-dependent Interfacial Layer on the Thermo-mechanical Response of Polymer Matrix Composites, Journal of Materials Processing Technology, V67, N1-3, P183-188, May 1997.

[17]   Yi, Sung, Ahmad, M. F., and Hilton, H. H.,  Finite Element Algorithms for Dynamic Simulation of Viscoelastic Composite Shell Structures Using Conjugated Gradient Method on Coarse Grained and Massively Parallel Machines , International Journal for Numerical Methods in Engineering, UK, Vol. 40, pp.1857-1875, 1997.

[16]   Yi, Sung, Hilton, H. H. and Ahmad, M. F.,  Finite Element Approach for Cure Simulation of Thermosetting Matrix Composites, Computers and Structures, UK, Vol. 64, No. 1-4, pp. 383-388, 1997.

[15]   Hilton, H. H., Yi, Sung and Danyluk, M. J.,  Probabilistic Analysis of Delamination Onset in Linear Anisotropic Elastic and Viscoelastic Composite Columns, International Journal of Reliability Engineering and System Safety, Vol. 56, pp. 237-248, 1997.

[14]   Yi, Sung, Ahmad, M. F. and A. Ramesh,  Data Parallel Finite Element Computation for Thermo-Viscoelastic Composite Structures, Advances in Engineering Software, UK, OCT-NOV, Vol. 27, N1-2, pp.97-102. ISSN  0965-9978, 1996.

[13]   Swellam, M., Yi, Sung, Ahmad, M. F. and Huber, L., Mechanical Properties of Cellular Materials I, Linear Analysis of Hexagonal Honeycombs, Journal of Applied Polymer Science, Vol. 63, pp. 383-393, 1997.

[12]   Yi, Sung, Hilton, H. H. and Ahmad, M. F., Nonlinear Thermo-viscoelastic Analysis of Interlaminar Stresses in Laminated Composites, ASME: Journal of Applied Mechanics, USA, pp. 218-224, Vol. 63, March 1996.

[11]   Yi, Sung, Ahmad, M. F., and Hilton, H. H., Dynamic Responses of Plates with Free Layer Viscoelastic Damping Treatment, ASME: Journal of Vibration and Acoustics, USA, Vol. 118, pp. 362-367, 1996.

[10]   Yi, Sung and Hilton, H. H.,  Hygrothermal Effects on Viscoelastic Responses of Laminated Composites ,  Composites Engineering, UK,  Vol. 5, No. 2,  pp. 183-193, 1995.

[9]     Yi, Sung, Pollock, G., Ahmad, M. F., and Hilton, H. H.,  Effective Transverse Young’s Modulus of Composites with Viscoelastic Interphase, AIAA Journal, USA, Vol. 33, No. 8, pp. 1548-1550, 1995.

[8]     Yi, Sung, Pierson, K. H., and Ahmad, M. F., Parallel Implementation of Dynamic Simulation to Filamentary Composite Structures with General Rate Dependent Damping, Computing Systems in Engineering, UK, Vol. 5, pp. 469-477, 1994.

[7]     Yi, Sung and Hilton, H. H.,  Dynamic Finite Element Analysis of Viscoelastic Composite Plates , International Journal for Numerical Methods in Engineering, USA, Vol. 37, pp. 4081-4096, 1994.

[6]     Yi, Sung,  Thermoviscoelastic Analysis of Delamination Onset and Free Edge Response in Epoxy Matrix Composite Laminates, AIAA Journal, USA, Vol. 31, No. 12, pp. 2320-2328, 1993.

[5]     Hilton, H. H. and Yi, Sung,  Stochastic Thermo-Viscoelastic Delamination Failure Analysis of Laminated Composites, Journal of Composite Materials, USA, Vol. 27, No. 11, pp.1097-1113, 1993.

[4]     Hilton, H. H. and Yi, Sung,  Anisotropic Viscoelastic Finite Element Analysis of Mechanically and Hygrothermally Loaded Composites, Composites Engineering, UK, Vol. 3, No. 2, pp. 123-135, 1993.

[3]     Yi, Sung, Pollock, G., Ahmad, M. F., and Hilton, H. H., Time Dependent Analysis of Viscoelastic Composite Shell Structures, Computing Systems in Engineering, UK, Vol. 3, pp.457-467, 1992.

[2]     Hilton, H. H. and Yi, Sung, Analytic Formulation of Optimum Material Properties for Viscoelastic Damping, Smart Materials and Structures, UK, Vol. 1, pp.113-122, 1992.

[1]     Lin, K. Y. and Yi, Sung, Analysis of Interlaminar Stresses in Viscoelastic Composites,  International Journal of Solids and Structures, UK, Vol. 27, No. 7, pp. 929-945, 1991.

 

 

4.          Papers in Conference Proceedings or Symposia, etc.

 

 

[105]  Yi, Sung, Thakare, Aditya, Kim, Jun Ki, Kang, Jeong Jin, Lee, So Jung and Choi, Han, Rapid Curing of Polymeric Materials for Microelectronics Applications Using Microwave, 15th International Conference on Electronics Materials and Packaging, (EMAP 2013), Paper No: EMP-0232, Oct. 6-Oct. 9, Seoul, Korea, 2013.

[104]   Snyder, Trevor and Yi, Sung, System Modeling of Embedded Active Chips: Design and Optimization, 15th International Conference on Electronics Materials and Packaging, (EMAP 2013), Paper No: M&S -0233, Oct. 6-Oct. 9, Seoul, Korea, 2013.

[103]   Tran, Hieu T., Chu, Yin Fun, Yi, Sung and Geng, Phil, Effects of Microstructure on Thermal Fatigue Life Prediction of Solder Joints, 14th International Conference on Electronics Materials and Packaging, (EMAP 2012), Page(s): 1 - 8, Dec. 13 - Dec. 16, Hong Kong, 2012. (IEEE DOI:  10.1109/ EMAP.2012.6507879)

[102]   Lam, Tatiana and Yi, Sung, Effects A Study of Warpage and Residual Stress in Plastic Ball Grid Array Package, 14th International Conference on Electronics Materials and Packaging, (EMAP 2012), Page(s): 1 - 8, Dec. 13-Dec. 16, Hong Kong, 2012. (IEEE DOI: 10.1109/ EMAP.2012.6507877)

[101]   Yi, Sung and Pickup, Kevin, Thermal Stress Analyses of Inductive Proximity Sensors under Thermal Cycling Condition, Proceedings of 18th International Workshop on Thermal investigations of ICs and Systems, pp. 5-11, Budapest, Hungary, 2012.

[100]   Le, Huy, Wern, Chien, Turcic, David and Yi, Sung, Three Dimensional MEMS Gyroscope Testing, Proceedings of 12th International Conference on Electronics Materials and Packaging, (EMAP 2010), pp. 291-296, 2010.

[99]     Jeung, W. K., Lim, C. H. and Yi, Sung, Low Temperature Multi Layer Stack Wafer Bonding Technology Development,  Proceedings of 59th Electronic Components and Technology Conference, (ECTC '09), pp. 20 – 24, 2009.

[98]     Romero, C., Lim, J., Yoon, Y. H., Kim, T., Yi, Sung,  Novel Approach in Design and Test of Embedded Capacitors in Organic-based Substrate for Highly Compact RF Systems-in-Package Devices, Proceedings of ICEP2009, pp.23-28, 2009.

[97]     Harr, K. M.Harr, Kim, D. H., Kim, Y. M., Cho, H.Y.Cho, Lee, C. B.Lee, Kim, J. G., Yi, Sung and Kim, Y. H., Chip-on Flex(COF) Bonding Technology Using Tin Bumps and Non-Conductive Adhesives (NCAs) for CMOS Image Sensor Device, Proceedings of ICEP2009, pp.119-124, 2009.

[96]     Harr, K., M., Kim, Y. M., Lim, D. H., Kim, Y. H., Kim, J. G. and Yi, Sung,  A New COF Bonding Technique using Sn Bumps and a Non-conductive adhesive (NCA) for Image Sensor Packaging, Proceedings of 59th Electronic Components and Technology Conference, (ECTC '09), pp. 1475 – 1478, 2009.

[95]     Yuan, J. L., Jeung, W. K., Lim, C. H., Park, S. W., Kweon, Y. D. and Yi, Sung, A Low-cost Through via Interconnection for ISM WLP, Proceedings of Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, pp. 115 – 118, 2008.

[94]     Kim, K. O., Kim, T., Kim, H., Lee, D. and Yi, Sung,  Low Cost Embedded Duplexer Implementation for WiMAX Front End Module with Multi-layer Organic Substrate,  Proceedings of 38th European Microwave Conference (EuMC 2008), pp. 32 – 35, 2008.

[93]     Jeung, W. K., Lim, C. H., Yuan, J. L., Park, S. W., Choi, S. M. and Yi, Sung, Reflowable ISM WLP, Proceedings of 58th Electronic Components and Technology Conference, (ECTC '08), pp. 297-302, 2008.

[92]     Gao, S., Hong, J. P., Shin, S. H., Lee, Y. K., Choi, S. M. and Yi, Sung, Design Optimization on the Heat Transfer and Mechanical Reliability of High Brightness Light Emitting Diodes Package, Proceedings of 58th Electronic Components and Technology Conference (ECTC '08), pp. 798-803, 2008.

[91]     Hong, J. P., Gao, S., Park, S. W., Moon, S. H., Baek, J. W., Choi, S. M. and Yi, Sung,  Parametric Design Study for Minimized Warpage of WL-CSP,  Proceedings of 2nd Electronics System-Integration Technology Conference (ESTC 2008), pp. 187 – 192, 2008.

[90]     Gao, S., Hong, J. P., Kim, J. S., Kim, J. G., Choi, S. M. and Yi, Sung, Reliability Evaluation and Structure Design Optimization of Wafer Level Chip Scale Packaging (WLCSP), Proceedings of 2nd Electronics System-Integration Technology Conference, (ESTC 2008), pp. 701 – 706, 2008.

[89]     Park, S. W., Hong, J. P., Kim, T. H. K., Yang, S. J., Ha, J., Kim, T. H., Park, S. W., Kweon, Y. D., and Yi, Sung,  Fabrication and Optimization of Wafer Level SAW Filter Package using Laser Via Drilling,  Proceedings of 2nd Electronics System-Integration Technology Conference (ESTC 2008), pp.1273 – 1278, 2008.

[88]     Kim, J. W., Hong, J. P., Gao, S., Choi, S. M. and Yi, Sung,  Warpage Simulation for Chip-in-Substrates, Proceedings of 33rd IEEE/CPMT International Symposium on Electronic Manufacturing Technology (IEMT 2008), pp. 1 – 4, 2008.

[87]     Lee, S. S., Baik, J. W., Kim, J. S., Jeon, H. J. and Yi, Sung,  Wafer Level Packaging by Residual Stress Evaluation using Piezoresistive Stress Sensors for the Enhancement of Reliability,  Proceedings of 33rd IEEE/CPMT International Symposium on Electronic Manufacturing Technology (IEMT 2008), pp.: 1 – 5, 2008.

[86]     Kim, T. H., Jeon, J. Y., Kwak, Y. P., Kim, T. H., Lim, Y. J., Park, J. H., Choi, S. M. and Yi, Sung,  Interconnection Via Technology and Wafer Level Package for Crystal Unit Device,  Proceedings of 33rd IEEE/CPMT International Symposium on Electronic Manufacturing Technology (IEMT 2008), pp. 1 – 5, 2008.

[85]     Kim T. E., Kim, K. O., Kim, H. W., Jung, T. S. and Yi, Sung,  Tolerance Analysis for Embedded Passive in Organic Substrate,  Proceedings of 10th International Conference on Electronics Materials and Packaging (EMAP 2008), pp. 317 – 320, 2008.

[84]     Kim, T. H., Jeon, J. Y., Kwak, Y. P., Hong, J. P., Kim, T. H., Lim, E. J., Park, J. H.,  Choi, S. M. and Yi, Sung,  New Approach for Wafer Level Crystal Unit Package,  Proceedings of 10th International Conference on Electronics Packaging Technology (EPTC 2008), pp. 1247 – 1252, 2008.

[83]     Kim, T. E., Kim, H. W., Kim, K. O., Kim, J. S., Jung, T. S. and Yi, Sung,  Tolerance Improvement for Organic Embedded Passive RF Module Substrate, Proceedings of 10th International Conference on Electronics Packaging Technology (EPTC 2008), pp. 1226 – 1230, 2008.

[82]     Kim, H. H., Ye, Y. D., Choi, S. H., Lim, J., Yim, S. G. and Yi, Sung, RF multi-DUT Testing Technology for RF WLP, Proceedings of 2nd International Conference on Electronics System-Integration Technology Conference (ESTC 2008), pp. 547 – 550, 2008.

[81]     Kim, J. W., Park, H. S., Lee, S. C., Chung, Y. K., Choi, S. M. and Yi, Sung, Development of Lamination Process for Chip-in-Substrates, Proceedings of 9th International Conference on Electronics Materials and Packaging (EMAP 2007), pp. 1 – 6, 2007.

[80]     Kim, T. H., Yi, Sung, Roh, J. K., Jung, C. M., Guo, Y. S., Do, J. C., Kim, J. G., Gao, S., and Hong, J. P., Effect of Underfilling Materials and Processes on the Reliability of System in Package, Proceedings of ASME InterPACK '07, (IPACK2007-33034), Vancouver, British Columbia, CANADA, July 8-12, 2007.

[79]     Gao, S., Hong, J. P., Choi, S. H., Choi, S. M. and Yi, Sung, Heat Transfer Analysis and Design Optimization of Alox High Brightness Light Emitting Diode Package, Proceedings of ASME InterPACK '07, (IPACK2007-33103), Vancouver, British Columbia, CANADA, July 8-12, 2007.

[78]     Hong, J. P., Gao, S., Ha, J., Yang, S. J., Kang, I. G., Kim, T. H., Choi, S. M. and Yi, Sung, Design Optimization of a Wafer Level Package for Surface Acoustic Wave Filters, Proceedings of ASME InterPACK '07, (IPACK2007-33031), Vancouver, British Columbia, CANADA, July 8-12, 2007.

[77]     Kim, T. H., Jeung, W. K., Yang, S. J., Choi, S. M., Park, S. W., Kim, H. H., Ha, J., Park, M. J., Gao, S., Hong, J.P., Yi, Sung, Hwang, J. S., Lim, J. H. and Kim, W. B.,  Miniaturization and Optimization of RF SAW Filter Using Wafer Level Packaging Technology, Proceedings of 57th Electronic Components and Technology Conference, (ECTC '07), pp. 574-579, 2007.

[76]     Jeung, W. K., Shin, S. H., Hong, S. Y., Choi, S. M., Yi, Sung, Yoon, Y. B.,  Kim, H. J., Lee, S. J. and Park, K. Y.,  Silicon-Based, Multi-Chip LED Package, Proceedings of 57th Electronic Components and Technology Conference, (ECTC '07), pp. 722-727, 2007.

[75]      Kim, T. H., Yi, Sung, Seo, H. H., Jung, T. S., Guo, Y. S., Doh, J. C., Okuno, A. and Lee, S. H., New Encapsulation Process for the SIP (System in Package), Proceedings of 57th Electronic Components and Technology Conference (ECTC '07), pp. 1420-1424, 2007.

[74]     Gao, Shan, Hong, Jupyo, Kim, Jinsu, Choi, Seogmoon and Yi, Sung,  Effects of Packaging Materials on the Reliability of System in Package, Proceedings of 8th International Conference on Electronic Packaging Technology (ICEPT 2007), pp.1-5, 2007.

[73]     Gao, S. Hong, J. P., Kim, T. H., Choi, S. M. and Yi, Sung,  Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter, Proceedings of 8th International Conference on Electronics Materials and Packaging (EMAP 2006), pp.1–4, 2006.

[72]     Yi, Sung, Daharwal, P.D., Lee, Y.J. and Harkness, B.R., Study of Low-modulus Die Attach Adhesives and Molding Compounds on Warpage and Damage of PBGA, Proceedings of 56th Electronic Components and Technology Conference (ECTC '06), pp. 939-945, May 30-June 2, 2006.

[71]     Kim, T. H., Jeung, W. K., Yang, S. J., Choi, S. M., Park, M J., Park, J. H., Yi, Sung, Hwang, J. S., Lim, J. H. and Kim, W. B., Design and Characterization of Wafer Level SAW Filter Package Using LT-LT Wafer Structure, Proceedings of 8th International Conference on Electronics Materials and Packaging (EMAP 2006), pp. 1 – 5, 2006.

[70]     Yi, Sung and Su, Fei, A Study of Hygro-thermal Deformations and Stresses in FCPBGA, Proceedings of 7th International Conference on Electronics Materials and Packaging (EMAP 2005), pp.15–20, Dec. 11-14, 2005.

[69]     Yi, Sung, Daharwal, P.D., Lee, Y.J. and Harkness, B.R., Effects of Low-modulus Die Attach Adhesive on Warpage and Damage of BGA, Proceedings of 7th International Conference on Electronics Materials and Packaging (EMAP 2005), pp. 162–168, Dec. 11-14, 2005.

[68]     Yi, Sung, Yu, Zeyan, Neo, R. G. H. and Lee, Y.J., Hygro-thermo-mechanical Behavior of Molding Compounds at Elevated Environments, Proceedings of 54th Electronic Components and Technology Conference (ECTC '04), pp. 180-185, June 1-June 4, 2004.

[67]     Zhang, Dong, Ling, Shih-Fu, Yi, Sung, Foo, Say Wee, Improved Monitoring of Ultrasonic Wire Bonding via Input Electrical Impedance, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). pp. 359 – 363, 2004.

[66]     Yi, Sung, Liu, Lie and Park, Sang Kyoo, Cure of Underfills in Flip Chips using Microwave, Proceedings of 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC 2004), pp. 92 – 98, 12-15 Sept. 2004.

[65]     Hilton, H. H., Vinson, J, R., Yi, Sung and Kohl, C H, Anisotropic Nonlinear Piezo-electro-chemo-thermo viscoelasticity: Characterization, Simulations, Probabilistic Failures and Structural Integrity, Second International Conference on High Performance Structures and Materials, Ancona, Italy, pp. 263-274, 2004 .

[64]     Su, F., Yi, Sung and Chian, K. S., Experimental Investigation of Hygroscopic Expansions of Molding Compounds and Plastic IC Packages, Proceedings of 5th International Conference on Electronic Materials and Packaging, (EMAP 2003), pp. 150157, 17-19 Nov. 2003.

[63]      Li, M., Zhang, J., Xiong, C. Y., Fang, J. and Yi, S, Thermal Deformation Analysis of BGA Package by Digital Image Correlation Technique, Proceedings of 5th International Conference on Electronic Materials and Packaging, (EMAP 2003), pp. 98104, 17-19 Nov. 2003.

[62]     Chia, Y. C., Yam, H. S., Chian, K. S., and Yi, Sung, Flow Assessment Flip Chip Underfilling Process, Proceedings of 5th International Conference on Electronic Materials and Packaging, (EMAP 2003), pp. 108115, 17-19 Nov. 2003.

[61]     Xiong, C. Y., Zhang, J, Li, M., Fang, J. and Yi, Sung, Fourier and Wavelet Transform Analysis of Moire Fringe Patterns in Electronic Packaging, Proceedings of 5 th International Conference on Electronic Materials and Packaging, (EMAP 2003), pp. 232238, 17-19 Nov. 2003.

[60]     Li, Jianjun and Yi, Sung, Studies on Thermal and Mechanical Properties of PBGA Substrate and Material Construction, Proceedings of 52nd Electronic Components and Technology Conference, pp. 1595- 1604, 2002.

[59]     van Driel, W.D., Zhang, G.Q., Janssen J., Ernst, L. J., Su, F. and Yi, Sung, "Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry".  Proc. EuroSimE2002, pp. 362-367, 2002.

[58]     Abdul, J., Guo, N., Yi, Sung and Wong, B.S., Ultrasonic characterization of the interface between die attach and copper leadframe in IC packaging, Proceedings of Third International Conference on Experimental Mechanics , SPIE, Vol. 4537, pp. 174-150, 2002.

[57]     Fu, Yongqing, Du, Hejun, Gao, Shan, Yi, Sung, Mechanical Properties of Sputtered TiNiCu Shape Memory Alloy Thin Films, Proceedings of the Second International Conference on Advanced Materials Processing (ICAMP 2002), pp. 37-40, 2002.

[56]     Yi, Sung, Liu, Lie, Chian, Kerm Sin, Su, Fei, Gao, Shan, A study of Microwave Curing Process for Underfill used in Flip Chip Packaging. Part 2: 3D FEM Simulation of Microwave Power Distribution inside Variable Frequency Microwave Oven, Proceedings of International Symposium on Electronic Materials and Packaging, (EMAP 2001), pp. 29 – 33, 19-22 Nov. 2001.

[55]     Shen, Lianxi, Yi, Sung, Caers, J., Zhao, X. and Zhang, K., A Damage Parameter Based on Fracture Surface for Fatigue Life Prediction of CSP Solder Joints, Proceeding of International Symposium on Electronic Materials and Packaging (EMAP 2001), pp. 412 – 416, 19-22 Nov. 2001.

[54]     Yi, Sung and Chian, Kerm Sin, Chemo-thermo-viscoelastic Behavior of Underfill Materials during Curing Process, Proceeding of International Symposium on Electronic Materials and Packaging, 2001, (EMAP 2001), pp. 254 – 260, 19-22 Nov. 2001.

[53]     Yi, Sung, Liu, Lie, Chian, Kerm Sin and Osiyemi, Stephen, Comparison and Kinetic Analysis of Microwave and Thermal Cure of Underfill Materials, Proceeding of International Conference on Materials for Advanced Technologies, Singapore, 1 – 6 July 2001.

[52]     Tee, T. Y., Sivakumar, K., Herard, L., Yi, Sung, Shen, L., Mukund, V. M., and Su, F.,   Comprehensive Analysis of BGA Block Warpage Induced after Post Mold CureProc. ICEP Conf.,  Tokyo, Japan,  pp.460 - 465 , 2001.

[51]     Yi, Sung, Luo, Guangxing, Chian, Kerm Sin and Chen, W.T., A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders, Proceeding of International Symposium on Electronic Materials and Packaging (EMAP 2000), pp.183 – 190, 30 Nov.-2 Dec. 2000.

[50]     Chian, K.S., Lim, S.H., Yi, Sung and Chen, W.T., Effect of Moisture on the Curing Behaviour of Underfills, Proceeding of International Symposium on Electronic Materials and Packaging (EMAP 2000). pp. 289 – 296, 30 Nov.-2 Dec. 2000.

[49]     Szeto, W.K., Xie, M.Y., Kim, J.K., Yuen, M.M.F., Tong, P., and Yi, Sung, Interface Failure Criterion of Button Shear Test as a Means of Interface Adhesion Measurement in Plastic Packages, Proceeding of International Symposium on Electronic Materials and Packaging (EMAP 2000), pp. 263 – 268, 30 Nov.-2 Dec. 2000.

[48]     Zhong, C.H., Yi, Sung, Mui, Y.C., Howe, C.P., Olsen, D. and Chen, W.T., Missing Solder Ball Failure Mechanisms in Plastic Ball Grid Array Packages, Proceedings of 50th Electronic Components and Technology Conference (ECTC2000), pp. 151 – 159, 21-24 May 2000.

[47]     Yi, Sung and Sze, K. Y., Delamination Analysis of Flip Chip Packages, Proceedings of International Conference on Computational Engineering & Sciences, LA, Aug 21- Aug 25, 2000.

[46]     Chia, Y.C., Lim, S.H., Chian, K. S., Yi, Sung and Chen, W.T., An Optimization Study of Underfill Dispensing Process,  Proceeding of INTERPACK 99, ASME, June 1999.

[45]     Yi, Sung and Neo, Guan Hock, Hygro-thermo-mechanical Behavior of Mold Compound Materials at Elevated Environment, Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, ASME, pp. 287-292, Paris, France, 1998.

[44]     Yi, Sung and Yue, Chee Yoon, Hygrothermally Induced Residual Stresses in a Plastic BGA, Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, ASME, pp. 271-275, Paris, France, 1998.

[43]     Zhong, C. H. and Yi, Sung, Effects of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages, Proceedings of the 24th international Symposium for testing and Failure Analysis, November, Dallas Texas, pp. 405-409, 1998.

[42]      Yuan, W..Q. and Yi, Sung, Quantitative Texture Analysis and Maximum Recoverable phase transformation strain estimation of TiNiCu memory alloy, Proceeding of National Symposium on Progress in Materials Research, pp. 45-50, Singapore, 1998.

[41]    Yuan, W. Q. and Yi, Sung, Textures in a Dual Phase CuZnAl Alloy by Alternate Cold-Rolling and Annealing, Proceeding of National Symposium on Progress in Materials Research, pp. 393-398, Singapore, Mar 1998.

[40]     Hilton, H. H. and Yi, Sung, Generalized Viscoelastic 1-DOF Deterministic Nonlinear Oscillators, Developments in Mechanics, 19:6.7-6.9, South Dakota School of Mines & Technology, Rapid City, SD, 1998.

[39]     Hilton, H. H., Vinson, J.R. and Yi, Sung, Viscoelastic damping contributions to dynamic piezo-electric responses, Proceedings of the International Modal Analysis Conference XVI, II:1433-1439, 1998.

[38]     Hilton, H. H., Vinson, J. R. and Yi, Sung, Nonlinear Anisotropic Piezo-electro-thermo-Viscoelasticity with Applications to Composite Plates,  Proceedings of the 35th Annual Meeting of the Society for Engineering Science, Pullman WA, September 27-30, 1998.

[37]     Hilton, H. H. and Yi, Sung, Creep Divergence of Nonlinear Viscoelastic Lifting Surfaces with Piezo-electric Control, Proceedings of the Second International Conference on Nonlinear Problems in Aviation and Aerospace, Daytona Beach, FL, April 29 - May 1, 1998.

[36]     Beldica, C. E., Hilton, H. H. and Yi, Sung, A Sensitivity Study of Viscoelastic, Structural and Piezo-electric Damping for Flutter Control, Proceedings 39th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, 2:1304-1314, (AIAA Paper 98-1848), 1998.

[35]     Hilton, H. H. and Yi, Sung, Large Deformation Generalized Anisotropic Nonlinear Viscoelastic Constitutive Relations: Mathematical Modeling and Numerical Simulations, Proceedings of the Second International Conference on Mechanics of Time Dependent Materials, 23-25, Pasadena, CA, 1998.

[34]     Beldica, C. E., Hilton, H. H. and Yi, Sung, Viscoelastic Damping and Piezo-electric Control of Structures Subjected to Aerodynamic Noise, Proceedings of the 4th AIAA/CEAS Aeroacoustics Conference, (AIAA Paper 98-2343), 2:805-815, Toulouse, France, 1998.

[33]     Hilton, H. H. and Yi, Sung, Stochastic Delamination Simulations of Nonlinear Viscoelastic Composites during Cure, Proceedings of the Fourth International Conference on Stochastic Structural Dynamics, South Bend, IN, August 6 - 8, 1998.

[32]     Hilton, H. H., Vinson, J. R. and Yi, Sung, Viscoelastic Damping Contributions to Dynamic Piezo-electric Responses,  Proceedings of the International Modal Analysis Conference XVI, II:1433-1439, 1998.

[31]     Yi, Sung and Hilton, H. H.,  Thermo-rheological Behavior of Polymer Matrix Composites  During Curing Processes,  Proceedings of 38th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, (AIAA Paper 97-1326), April 15-17, 1997.

[30]     Hilton, H. H. and Yi, Sung, Mathematical and Numerical Analysis Issues in Nonlinear Anisotropic Viscoelastic Composites, Proceedings Second SIAM Conference on Mathematical Aspects of Material Science, pp. 25, Philadelphia, 1997.

[29]     Yi, Sung and Hilton, H. H., Free edge stresses in elastic and viscoelastic composite laminates under uniaxial extension, bending and twisting. Proceedings of the Conference on Megatrends in Mechanics and Materials: Infrastructure and Industrial Applications (McNU 97), pp.113, Evanston, IL, 1997.

[28]     Hilton, H. H., Vinson, J. R., and Yi, Sung, Anisotropic Piezo-Electro-Thermo-Viscoelasticity Theory with Applications to Composites.  Proceedings of the Eleventh International Conference on Composite Materials (ICCM-11), Gold Coast, Australia, July 14-18, 1997.

[27]     Yi, Sung and Hilton, H. H., Ahmad, M. F, Finite Element Analysis on Coarse Grained  Vector Machines of Residual Stresses in Plastic IC Packages During Surface Mounting Processes,   HPC 97, Santiago, July, 1997.

[26]     Xioa, Z. M., Guo, J. Y. and Yi, Sung, Moisture-Induced Cracking in Plastic Encapsulant with Voids, Proceedings of the 2nd International Symposium on Electronic Packaging Technology, pp. 450-455, Shanghai, China, Dec. 9-12, 1996.

[25]     Yi, Sung, Ling, S. F., and Ying, M., Dynamic Response of Composite Shell Structures with Viscoelastic Damping Treatment,  Proceedings of the KSME International Session on Dynamics, Systems and Design, pp. 64-71, Inchon, Korea, Nov. 1-2, 1996.

[24]     Yi, Sung, Hilton, H. H., Ahmad, M. F., and Pierson, K. H.,  Cure Cycle Simulations of Composites with Temperature and Cure Dependent Anisotropic Viscoelastic Properties, Proceedings of 37th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, (AIAA-96-1577), Salt Lake City, Utah, USA,. April 15-17, 1996.

[23]     Yi, Sung, Goh, J. S. and Yang, J. C.,  Finite Element Analysis of Hygrothermally Induced Stresses in Plastic Packages,  Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA-95), pp.11 - 16, Singapore, Nov. 27 - Dec. 1, 1995.

[22]     Yi, Sung, Hilton, H. H. and Ahmad, M. F.,  Curing Process Induced Viscoelastic Residual Stresses in Polymer Matrix Laminated Composites,  Proceedings the ASME Materials Division, Vol. 1, pp.65 - 76, 1995.

[21]     Yi, Sung, Effects of Time-Dependent Interfacial Layer on Thermo-mechanical Response of Polymer Matrix Composites, Proceedings of International Conference on Mechanics and Material Engineering, pp. 802-808, 1995.

[20]     Yi, Sung, Hilton, Harry H., Ahmad, M. Fouad and Pierson, Kendall H., Viscoelastic Constitutive Relations and Finite Element Analysis of Residual Stresses in Thermosetting Matrix Composites during Cure Processes, Proceedings NCSA/IMM/NIST Workshop on Modeling the Development of Residual Stresses During Thermoset Composites Curing, 1-18, 1995.

[19]     Yi, Sung, Pierson, K. H., Ahmad, M. F. and Hilton, H. H.,  MIMD Implementations of Finite Element Analysis of Polymer Matrix Composite Structures, Proceedings of Fourth International Conference on Applications of Supercomputers in Engineering, pp. 237-252, Milan, Italy, June 19-21, 1995.

[18]     Yi, Sung and Hilton, H. H.,  Constitutive Relations for Thermosetting Resins During Curing Processes, Proceedings of 36th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, (AIAA-95-1428), New Orleans, Louisiana, USA,. April 10-12, 1995.

[17]     Yi, Sung, Ahmad, M. F., and Hilton, H. H., Manufacturing Process Induced Residual Deformation and Stress in Filamentary Polymer Matrix Composites, Proceedings of 36th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, (AIAA-95-1476), New Orleans, Louisiana, USA, April 10-12, 1995.

[16]     Hilton, H. H., Yi, Sung and Dynyluk, M. J.,  Stochastic Delamination Buckling of Elastic and Viscoelstic Columns,  Computational Stochastic Mechanics, Edited by P. D. Spanos, Balknema, Rotterdam, Netherlands, pp. 687-696, 1995.

[15]     Yi, Sung, Hilton, H. H. and Ahmad, M. F.,  Nonlinear Thermo-viscoelastic Analysis of Interlaminar Stresses in Laminated Composites, Proceedings of 35th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, (AIAA Paper 94-1637), Hilton Head, South Carolina, USA, April 18-21, 1994.

[14]     Yi, Sung, Ahmad, M. F. and Ramesh, A. Data Parallel Finite Element Computation for Thermo-Viscoelastic Composite Structures, Proceedings of 2nd International Conf. on Computational Structures Technology: Advances in Parallel and Vector Processing for Structural Mechanics, pp. 207-214, Athens, Greece, August 30-September 1, 1994.

[13]     Yi, Sung, Hilton, H. H. and Ahmad, M. F.,  Finite Element Analysis of Thick Thermosetting Matrix Composite Curing Process, Proceedings of 2nd International Conf. on Computational Structures Technology: Advances in Non-Linear Finite Element Methods, pp. 177-186, Athens, Greece, August 30-September 1, 1994.

[12]     Yi, Sung, Hilton, H. H. and Ahmad, M. F.,  Performance Evaluations of Viscoelastic Finite Element Supercomputer Algorithms, Proceedings of Third International Conference on Applications of Supercomputers in Engineering, pp. 497-510, Bath, UK, September 27-29, 1993..

[11]      Hilton, H. H. and Yi, Sung,  Stochastic Thermo-Viscoelastic Delamination Failure Analysis of Laminated Composites, Proceedings of  6th International Conference on Structural Safety and Reliability, Innsbruck, Austria, pp. 615-621, 9-13 August,1993.

[10]     Yi, Sung, Ahmad, M. F., and Hilton, H. H.,    Dynamic Responses of Plates with Viscoelastic  Damping Treatment, Proceeding of Fourteenth Biennial ASME Conference on Mechanical Vibration and Noise,  Albuquerque, New Mexico, USA, , pp. 437-445, September 19-22, 1993.

[9]       Yi, Sung, Pollock, G., Ahmad, M. F., and Hilton, H. H.,  Thermo-viscoelastic Analysis of Fiber-Matrix Interphase, Proceedings of 34th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference,  (AIAA-93-1517), pp. 1803-1817, 1993.

[8]       Hilton, H. H. and Yi, Sung,  Large Deformation Analysis of Finite Length, Encased, Nonlinear Elastic, Pressurized Circular Cylinders , Proceeding of 2nd U. S. National Congress on Computational Mechanics, Washington, D.C., USA, August 16-18, 1993, pp. 189.

[7]       Yi, Sung, Hilton, H. H., Ahmad, M. F., and Pollock, G. D.,  Viscoelastic Stress Analysis around Cutouts in Composite Laminated Shells , Proceeding of 2nd U.S. National Congress on Computational Mechanics, Washington, D.C., USA, August 16-18, pp. 215, 1993.

[6]       Hilton, H. H. and Yi, Sung, Structural Motion Control by Analytical Determination of Optimum Vscoelastic Properties, Adaptive Materials and Adaptive Structures, G. J. Knowles, Editor, Institute of Physics Publishing, Philadelphia, pp. 495-500, 1992 .

[5]      Yi, Sung,  Thermoviscoelastic Analysis of Delamination Onset and Free Edge Response in Epoxy Matrix Composite Laminates, Proceedings of 32nd AIAA/ASME/ ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, pp. 1016-1026, 1991. 

[4]     Hilton, H. H. and Yi, Sung,  Dynamic Finite Element Analysis of Viscoelastically Damped Composite Structures, Applications of Supercomputers in Engineering II, C. A. Brebbia, D. Howard and A. Peters (eds.), Elsevier Applied Science, London, pp. 495-511, 1991.

[3]       Hilton, H. H. and Yi, Sung, Structural Motion Control by Analytic Determination of Optimum Viscoelastic Material Properties,  Proceedings of ADPA/AIAA/ ASME/SPIE Active Materials and Adaptive Structures  Conference, 1991, pp.227-231.

[2]       Hilton, H. H. and Yi, Sung,  Bending and Stretching Finite Element Analysis of Anisotropic Viscoelastic Composite Plates,  Proceedings of Third Air Force/NASA Symposium on Recent Advances in Multidisciplinary Analysis and Optimization,  pp. 488-494, 1990.

[1]       Hilton, H. H. and Yi, Sung,  Finite Element Formulation for Thermo-Viscoelastic Analysis of Composite Structures Subjected to Mechanical and Hygrothermal Loadings,  Proceedings of First NCSA Conference on Finite Element Applications in Computational Mechanics, pp. 1-11, 1990.

 

 

Other Research and Other Creative Achievements

 

A. US Patents Held and Applications:

 

[14]   Patent Number: US8302270 B2, Filing Date: Jan. 10, 2011, Issue Date: Nov. 6, 2012

            Title: Method of manufacturing capacitor-embedded

Inventors: Woon-Chun KiM, Sung Yi, Hwa-Sun Park, Hong-Won Kim, Dae-Jun Kim, Jin-Seon Park

[13]   Patent Number: US8283251 B2, Filing Date: Sept. 22, 2011,Issue Date: Oct. 9, 2012

             Title: Method of manufacturing wafer level package

             Inventors: Seung Seoup Lee, Sung Yi

[12]   Patent Number: US8351215 B2, Filing Date: Jan. 28, 2009, Issue Date: Jan. 8, 2013

             Title: Method of manufacturing a chip embedded printed circuit board

             Inventors: Hong Won Kim, Sung Yi, Tae Sung Jeong, Joon Seok Kang

[11]   Patent Number: US8283768 B2, Filing Date: Apr. 15, 2009, Issue Date: Oct. 9, 2012

             Title: Wafer Level package for heat dissipation and method of manufacturing the same

             Inventors: Joon Seok Kang, Sung Yi, Young Do Kweon

[10]   Patent Number: 8110914, Filing Date: Jan 7, 2009, Issue Date: Feb 7, 2012

             Title: Wafer level package with removable chip protecting layer     

             Inventors: Joon Seok Kang, Sung Yi, Young Do Kweon

[9]     Patent Number: 7992296, Filing Date: Jan 9, 2009, Issue Date: Aug 9, 2011

Title: PCB and manufacturing method thereof

Inventors: Woon-Chun Kim, Sung Yi

[8]     Patent Number: 7982982, Filing Date: Jan 16, 2009, Issue Date:  Jul 19, 2011

Title: Wafer Level Packaging Image Sensor Module Having Lens Actuator

Inventors: Seung Seoup Lee, Sung Yi

[7]     Patent Number: 8026590, Filing Date: Oct 17, 2009, Issue Date: Sep 27, 2011

             Title: Die package and method of manufacturing the same

             Inventors: Joon Seok Kang, Young Ho Kim, Young Do Kweon, Jin Gu Kim, Sung Yi

[6]     Patent Number: 8064215,  Filing Date: Sep 5, 2008, Issue Date: Nov 22, 2011

             Title: Semiconductor chip package and printed circuit board          

 Inventors: Yul-Kyo Chung, Sung Yi, Soon-Gyu Yim, Seog-Moon Choi, Jin-Gu Kim, Young-Do Kweon   

[5]     Patent Number: 7727877, Filing Date: Apr 24, 2008, Issue Date: Jun 1, 2010

Title: Method of Manufacturing a Wafer Level Package that Uses the Same Seed Layer

Inventors: Joon-Seok Kang, Sung Yi, Jong-Hwan Baek, Young-Do Kweon

[4]     Patent Number: 7886414, Filing Date: Apr 22, 2008, Issue Date: Feb 15, 2011

Title: Method of Manufacturing Capacitor-embedded PCB,

Inventors: Woon-Chun Kim, Sung Yi, Hwa-Sun Park, Hong-Won Kim, Dae-Jun Kim, Jin-Seon Park

[3]     Patent Number: 7730612, Filing Date: Apr 22, 2008, Issue Date: Jun 8, 2010

Title: Method of Manufacturing Component-embedded Printed Circuit Board

Inventors: Hwa-Sun Park, Sung Yi, Sang-Chul Lee, Jong-Woon Kim, Yul-Kyo Chung

[2]     Patent Number: 7632709, Filing Date: Apr 25, 2008, Issue date: Dec 15, 2009

Title: Method of manufacturing wafer level package

Inventors: Hyung-Jin Jeon, Sung Yi, Young-Do Kweon, Jong-Yun Lee, Joon-Seok Kang, Seung-Wook Park

[1]     Patent Number: 7663250, Filing Date: Sep 4, 2008, Issue Date: Feb 16, 2010

Title: Wafer Level Package and Manufacturing Method Thereof

Inventors: Hyung Jin Jeon, Sung Yi, Jong Yun Lee, Young Do Kweon, Jong Hwan Baek

 

In addition, 10 Patent Applications have been filed.