NT 3-MICRON CMOS (MPC9303C3)
OVERVIEW
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Number of universities involved: 10
Number of designers: 30
Number of designs: 59 (37 analog, 4 digital, 7 mixed-signal)
(7 unknown)
Analog/Digital Area Allocation: 62% analog/32% digital of 471.4 mm^2
Design Tools: KIC, Cadence Edge, SILOS, HSPICE, Dracula, Electric, SPICE,
Cadence, pdverify, leo45
Test Tools: ASIX-2, HP 8180/82, scope, custom constructed microscope, other
custom test equipment
Range of purposes: Micromachined substrate elements for gas and chemical
sensors
Integrated pH and Hydrogen sensors using post-processing
Circuit to generate histograms of a 6-bit digital signal
Control circuitry for thermal pixels
Multi-channel cochlear implant (biomedical application)
Multi-valued logic basic circuits
Motion sensing imagers
Intelligent optical sensor
DESIGN DETAILS
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University of Alberta
IC3AABRG
P. Haswell
Electrical Engineering
Micro-bridge devices
Used to test the electromigration characteristics for polysilicon.
IC3AACCI
A.M. Robinson
Electrical Engineering
Contact-cut tester
Used to test the electromigration characteristics of contact-cuts.
University of British Columbia
IC3BCTBC
Dimitrios P. Bouras
Electrical Engineering
PI/4-shift DQPSK baseband encoder
A baseband waveform generator implementing a pi/4-shift differentially
encoded quadrature phase shift keying (DQPSK) transmitter encoder. Uses
truncated Nyquist pulse data, to synthesize Nyquist filtered inphase and
quadrature baseband signals, from sample tables stored in EPROMs, according
to the input data stream.
Concordia University
IC3CAG01, IC3CAG02, IC3CAG03, IC3CAG04, IC3CAG05, IC3CAG06
M. Paranjape and M. Parameswaran
Electrical and Computing Engineering and Electrical Engineering
Micromachined Substrate Elements for Gas and Chemical Sensors
These designs are to be eventually used in the development of integrated
CMOS gas and chemical sensors. The structures are to post-processed using
micro-machining.
IC3CAM01, IC3CAM02, IC3CAM03, IC3CAM04, IC3CAM05, IC3CAM06
IC3CAM07, IC3CAM08, IC3CAM09, IC3CAM10, IC3CAM11, IC3CAM12
M. Paranjape
Electrical and Computing Engineering
Vertical Hall Magnetic Field Sensors (micromachineable)
The designs are of a magnetic field sensor using a vertically embedded
Hall plate structure. The structure is micromachineable with varying
design strategies.
IC3CAP01, IC3CAP02, IC3CAP03, IC3CAP04, IC3CAP05, IC3CAP06
IC3CAP07, IC3CAP08, IC3CAP09, IC3CAP10, IC3CAP11, IC3CAP12
M. Paranjape
Electrical and Computing Engineering
Integrated CMOS pH and Hydrogen Sensors using post-processing
The designs are of pH and hydrogen sensors using a MOSFET-like structure.
The devices will be processed after fabrication using wet-etching and
thin-film deposition.
Universite Laval
IC3LVHIS
Stephane Dallaire
Genie Electrique
Histogram Generator
The function of this circuit is to generate histograms of a 6-bit digital
signal. It contains basically an array of custom ram cells in order to store
the results and a transmission gate adder. This adder is used to increment
the value stored in the ram cell addressed by the input digital signal. The
address decoder of the ram array is implemented with dynamic domino logic in
order to minimize the evaluation time.
IC3LVLG2
Alain Rivard, Martin d'Anjou, Marc Tremblay
Genie electrique
16 parallel analog spatial filters for smart image sensor
This chip implements a set of 16 Laplacian of Gaussian filter for computer
vision to be used with the MAR sensor. This is a revised version of the
original LG2 chip. It include analog programmable thresholds and a digital
interface.
University of Manitoba
IC3MB132
R.A. Said and G. Bridges
Electrical and Computer Engineering
Analog signal Busses
Similar equally spaced interconnect lines that change in width over three
stages are used for scanning purposes. One group of the interconnects are
over a ground plane made of metal1.
Simon Fraser University
IC3SFAJA, IC3SFAJB
M. Parameswaran and Jianming Chen
Engineering Science
These are IC sensor designs and some postprocessing will be done in our LAB.
IC3SFGK3
Kewei Fang
Engineering Science
The chip contains a full switch node which includes a control block and also
contains test structures.
IC3SFLC4
L.Carr
Engineering Science
The circuit contains control circuitry for micromachined miniature black-body
emitters (thermal pixels) and a series of current controlled oscillators.
The thermal pixel test circuitry and structures will be used to develop large-
scale restructurable systems for experimenting with thermal scene imaging.
The oscillators are to evaluate the method of converting the current output
of photodetectors to a frequency output. The circuit will be post-processed
in SFU Micromachining and Sensors Laboratory.
IC3SFMH2
Hong Ma
Engineering Science
*** circuit description not available from designer ***
IC3SFMSC
Marek Syrzycki, Vivian Ward, Larrie Carr
Engineering Science
The circuit contains several CMOS temperature sensors and voltage-to-frequency
converters built as analog standard cells. Circuit blocks will be used in
integrated transducers to measure temperature and to convert signals, produced
by other sensors, into frequency. Due to small size and very low power
consumption they will find application in multitransducer arrays and
transducer systems. The circuits will be post-processed in SFU Micromachining
and Sensors Laboratory.
IC3SFRL1
L.Carr
Engineering Science
This circuit contains several building blocks for visual-to-thermal converter,
such as CMOS photodetectors with A/D converters in the current domain, silicon
black-body emitters (thermal pixels), and digital control blocks. The circuit
will be post-processed in SFU Micromachining and Sensors Laboratory.
IC3SFRL7
L.Carr
Engineering Science
The circuit uses several building blocks such as A/D converters operating in
the current domain, micromachined miniature black-body emitters (thermal
pixels) and digital control blocks to form a visual-to-thermal converter.
These converters are combined in a array using laser-diffuse links. The array
will be use to test large-scale restructurable systems for applications in
thermal scene imaging. The circuit will be post-processed in SFU Micro-
machining and Sensors Laboratory.
IC3SFRL8
L.Carr
Engineering Science
The circuit contains control circuitry for micromachined miniature black-body
emitters (thermal pixels). Circuit blocks are built of digital and analog
standard cells. They will be used in large-scale restructurable systems for
experimenting with thermal scene imaging . Several test structures for
characterizing MOS transistor subthreshold region and current mirrors are
included. The circuit will be post-processed in SFU Micromachining and
Sensors Laboratory.
Universite de Sherbrooke
IC3SHJPA
Jaouhar Mouine
Electrical Engineering
A New Multichannel Cochlear Implant
This neural stimulator translates the serially transmitted Manchester coded
data via an inductive link through the skin into analog signals to provide
stimulations. It uses an array of 16 totally independent 8-bit D/A converters
and permits monopolar and bipolar type of stimulation. The system's operation
is regulated by mean of an elaborately testable PLA.
IC3SHJPI
Jaouhar Mouine
Electrical Engineering
Current generator
This chip contains a current generator which provides different waveforms.
This current generator is controlled by external commands.
IC3SHPRH
Jaouhar Mouine, Jacques Lajoie
Electrical Engineering
A custom PLA
This chip contains a custom PLA which has 8 inputs and 15 outputs.
IC3SHPSP
Jaouhar Mouine, Soheyl Pourmehdi
Electrical Engineering
Controller for a custom PLA
This chip is a PLA controller. This controller generates the commands which
are necessary for the running of a custom PLA (IC3SHPRH).
University of Saskatchewan
IC3SKMVC
C.C. Cheung, R.J. Bolton
Electrical Engineering
MVL Converters
This circuits consists two types of converters, one is to convert voltages
to currents, another one is to convert currents to voltages. There are two
different Voltage to Current Converters, one can handle voltages from 0 to 5V
and the other one can handle voltages from 0 to 3.3V. The output currents of
the converters are 0, 20u, 40u and 60uA which depend upon the input voltages.
There are two different Current to Voltage converters, one can generate output
voltages from 0 to 5V, and the other one can generate voltages from 0 to 3.3V.
IC3SKMVL
C.C. Cheung, A.K. Jain, R.J. Bolton
Electrical Engineering
MVL Basic Circuits
This circuit consists four types of Multiple-Valued Logic (MVL) basic circuits.
The MVL basic circuits are P-type and N-type Constant Circuits, Threshold
Devices, Current Mirrors and Switches. This test circuit is used to test the
functionality of the MVL basic circuits.
IC3SKMVM
C.C. Cheung, A.K. Jain, R.J. Bolton
Electrical Engineering
MVL Basic Mirrors
This circuit consists one Bi-directional Current Mirror, three Current Mirrors
and two Reference Voltage Circuits. The Bi-directional Current Mirror could
allow current sinking or sourcing at the input of the device and the output
would be some amplification of the input current. The ordinary current mirrors
are used with the Bi-directional current mirror. The two Reference Voltage
Circuits could generate voltages at 1.740V and 2.265V.
IC3SKMVN
C.C. Cheung, A.K. Jain, R.J. Bolton
Electrical Engineering
MVL Neurode
This circuit consists of one neurode circuit. It has three inputs which can be
used as excitatory or inhibitory, another two inputs control the biasing of the
neurode and one output which can generate currents at 20u or -20uA. The other
circuits in SKMVN are two Reference Voltage Circuits and three Current Mirrors
which are used to test the neurode.
IC3SKVF0
J. Fortugno, R.J. Bolton
Electrical Engineering
MVL Coders
This circuit is designed to test the encoding and decoding of a four level
current mode MVL (multiple valued logic) signal for the integration of such
circuits into digital logic designs. The circuit is comprised of essentially
four basic modules (binary to MVL encoder, n_mirror, current level restorer,
MVL to binary decoder).
IC3SKVF1
J. Fortugno, R.J. Bolton
Electrical Engineering
MVL Standard Cells
This circuit is designed to test each of the MVL standard cell designs. The
layout provides a connection to every input and output of each of the unique
cells currently existing in the MVL library.
University of Toronto
IC3TRAC1
C.P. Chong
Electrical and Computer Engineering
Motion sensing imager II
This is a second generation motion sensing imager incorporating analog VLSI
parallel-processing technique.
IC3TRAC2
C.P. Chong
Electrical and Computer Engineering
Image motion sensor
This chip is the product of our continuous research effort in the area of
image processing using analog VLSI.
IC3TRAC3
C.P. Chong
Electrical and Computer Engineering
Motion sensing imager II(b)
The second of two designs, this chip is a second generation motion sensing
imager incorporating analog VLSI parallel-processing technique.
University of Windsor
IC3WRONN
Dino Bortolin, June Wang, Shakil Siddiq, Radha Venkatesan
Department of Electrical Engineering
Design and VLSI Implementation of An Intelligent Optical Sensor
This chip is designed to recognize a set of twelve patterns projected onto its
ten by ten element optical array. A hybrid analog/digital neural network with
one hidden layer is employed to classify the input pattern. Recall times on
the order of 300 ns are achieved.