NT 3-MICRON CMOS (MPC9303C3) OVERVIEW -------- Number of universities involved: 10 Number of designers: 30 Number of designs: 59 (37 analog, 4 digital, 7 mixed-signal) (7 unknown) Analog/Digital Area Allocation: 62% analog/32% digital of 471.4 mm^2 Design Tools: KIC, Cadence Edge, SILOS, HSPICE, Dracula, Electric, SPICE, Cadence, pdverify, leo45 Test Tools: ASIX-2, HP 8180/82, scope, custom constructed microscope, other custom test equipment Range of purposes: Micromachined substrate elements for gas and chemical sensors Integrated pH and Hydrogen sensors using post-processing Circuit to generate histograms of a 6-bit digital signal Control circuitry for thermal pixels Multi-channel cochlear implant (biomedical application) Multi-valued logic basic circuits Motion sensing imagers Intelligent optical sensor DESIGN DETAILS -------------- University of Alberta IC3AABRG P. Haswell Electrical Engineering Micro-bridge devices Used to test the electromigration characteristics for polysilicon. IC3AACCI A.M. Robinson Electrical Engineering Contact-cut tester Used to test the electromigration characteristics of contact-cuts. University of British Columbia IC3BCTBC Dimitrios P. Bouras Electrical Engineering PI/4-shift DQPSK baseband encoder A baseband waveform generator implementing a pi/4-shift differentially encoded quadrature phase shift keying (DQPSK) transmitter encoder. Uses truncated Nyquist pulse data, to synthesize Nyquist filtered inphase and quadrature baseband signals, from sample tables stored in EPROMs, according to the input data stream. Concordia University IC3CAG01, IC3CAG02, IC3CAG03, IC3CAG04, IC3CAG05, IC3CAG06 M. Paranjape and M. Parameswaran Electrical and Computing Engineering and Electrical Engineering Micromachined Substrate Elements for Gas and Chemical Sensors These designs are to be eventually used in the development of integrated CMOS gas and chemical sensors. The structures are to post-processed using micro-machining. IC3CAM01, IC3CAM02, IC3CAM03, IC3CAM04, IC3CAM05, IC3CAM06 IC3CAM07, IC3CAM08, IC3CAM09, IC3CAM10, IC3CAM11, IC3CAM12 M. Paranjape Electrical and Computing Engineering Vertical Hall Magnetic Field Sensors (micromachineable) The designs are of a magnetic field sensor using a vertically embedded Hall plate structure. The structure is micromachineable with varying design strategies. IC3CAP01, IC3CAP02, IC3CAP03, IC3CAP04, IC3CAP05, IC3CAP06 IC3CAP07, IC3CAP08, IC3CAP09, IC3CAP10, IC3CAP11, IC3CAP12 M. Paranjape Electrical and Computing Engineering Integrated CMOS pH and Hydrogen Sensors using post-processing The designs are of pH and hydrogen sensors using a MOSFET-like structure. The devices will be processed after fabrication using wet-etching and thin-film deposition. Universite Laval IC3LVHIS Stephane Dallaire Genie Electrique Histogram Generator The function of this circuit is to generate histograms of a 6-bit digital signal. It contains basically an array of custom ram cells in order to store the results and a transmission gate adder. This adder is used to increment the value stored in the ram cell addressed by the input digital signal. The address decoder of the ram array is implemented with dynamic domino logic in order to minimize the evaluation time. IC3LVLG2 Alain Rivard, Martin d'Anjou, Marc Tremblay Genie electrique 16 parallel analog spatial filters for smart image sensor This chip implements a set of 16 Laplacian of Gaussian filter for computer vision to be used with the MAR sensor. This is a revised version of the original LG2 chip. It include analog programmable thresholds and a digital interface. University of Manitoba IC3MB132 R.A. Said and G. Bridges Electrical and Computer Engineering Analog signal Busses Similar equally spaced interconnect lines that change in width over three stages are used for scanning purposes. One group of the interconnects are over a ground plane made of metal1. Simon Fraser University IC3SFAJA, IC3SFAJB M. Parameswaran and Jianming Chen Engineering Science These are IC sensor designs and some postprocessing will be done in our LAB. IC3SFGK3 Kewei Fang Engineering Science The chip contains a full switch node which includes a control block and also contains test structures. IC3SFLC4 L.Carr Engineering Science The circuit contains control circuitry for micromachined miniature black-body emitters (thermal pixels) and a series of current controlled oscillators. The thermal pixel test circuitry and structures will be used to develop large- scale restructurable systems for experimenting with thermal scene imaging. The oscillators are to evaluate the method of converting the current output of photodetectors to a frequency output. The circuit will be post-processed in SFU Micromachining and Sensors Laboratory. IC3SFMH2 Hong Ma Engineering Science *** circuit description not available from designer *** IC3SFMSC Marek Syrzycki, Vivian Ward, Larrie Carr Engineering Science The circuit contains several CMOS temperature sensors and voltage-to-frequency converters built as analog standard cells. Circuit blocks will be used in integrated transducers to measure temperature and to convert signals, produced by other sensors, into frequency. Due to small size and very low power consumption they will find application in multitransducer arrays and transducer systems. The circuits will be post-processed in SFU Micromachining and Sensors Laboratory. IC3SFRL1 L.Carr Engineering Science This circuit contains several building blocks for visual-to-thermal converter, such as CMOS photodetectors with A/D converters in the current domain, silicon black-body emitters (thermal pixels), and digital control blocks. The circuit will be post-processed in SFU Micromachining and Sensors Laboratory. IC3SFRL7 L.Carr Engineering Science The circuit uses several building blocks such as A/D converters operating in the current domain, micromachined miniature black-body emitters (thermal pixels) and digital control blocks to form a visual-to-thermal converter. These converters are combined in a array using laser-diffuse links. The array will be use to test large-scale restructurable systems for applications in thermal scene imaging. The circuit will be post-processed in SFU Micro- machining and Sensors Laboratory. IC3SFRL8 L.Carr Engineering Science The circuit contains control circuitry for micromachined miniature black-body emitters (thermal pixels). Circuit blocks are built of digital and analog standard cells. They will be used in large-scale restructurable systems for experimenting with thermal scene imaging . Several test structures for characterizing MOS transistor subthreshold region and current mirrors are included. The circuit will be post-processed in SFU Micromachining and Sensors Laboratory. Universite de Sherbrooke IC3SHJPA Jaouhar Mouine Electrical Engineering A New Multichannel Cochlear Implant This neural stimulator translates the serially transmitted Manchester coded data via an inductive link through the skin into analog signals to provide stimulations. It uses an array of 16 totally independent 8-bit D/A converters and permits monopolar and bipolar type of stimulation. The system's operation is regulated by mean of an elaborately testable PLA. IC3SHJPI Jaouhar Mouine Electrical Engineering Current generator This chip contains a current generator which provides different waveforms. This current generator is controlled by external commands. IC3SHPRH Jaouhar Mouine, Jacques Lajoie Electrical Engineering A custom PLA This chip contains a custom PLA which has 8 inputs and 15 outputs. IC3SHPSP Jaouhar Mouine, Soheyl Pourmehdi Electrical Engineering Controller for a custom PLA This chip is a PLA controller. This controller generates the commands which are necessary for the running of a custom PLA (IC3SHPRH). University of Saskatchewan IC3SKMVC C.C. Cheung, R.J. Bolton Electrical Engineering MVL Converters This circuits consists two types of converters, one is to convert voltages to currents, another one is to convert currents to voltages. There are two different Voltage to Current Converters, one can handle voltages from 0 to 5V and the other one can handle voltages from 0 to 3.3V. The output currents of the converters are 0, 20u, 40u and 60uA which depend upon the input voltages. There are two different Current to Voltage converters, one can generate output voltages from 0 to 5V, and the other one can generate voltages from 0 to 3.3V. IC3SKMVL C.C. Cheung, A.K. Jain, R.J. Bolton Electrical Engineering MVL Basic Circuits This circuit consists four types of Multiple-Valued Logic (MVL) basic circuits. The MVL basic circuits are P-type and N-type Constant Circuits, Threshold Devices, Current Mirrors and Switches. This test circuit is used to test the functionality of the MVL basic circuits. IC3SKMVM C.C. Cheung, A.K. Jain, R.J. Bolton Electrical Engineering MVL Basic Mirrors This circuit consists one Bi-directional Current Mirror, three Current Mirrors and two Reference Voltage Circuits. The Bi-directional Current Mirror could allow current sinking or sourcing at the input of the device and the output would be some amplification of the input current. The ordinary current mirrors are used with the Bi-directional current mirror. The two Reference Voltage Circuits could generate voltages at 1.740V and 2.265V. IC3SKMVN C.C. Cheung, A.K. Jain, R.J. Bolton Electrical Engineering MVL Neurode This circuit consists of one neurode circuit. It has three inputs which can be used as excitatory or inhibitory, another two inputs control the biasing of the neurode and one output which can generate currents at 20u or -20uA. The other circuits in SKMVN are two Reference Voltage Circuits and three Current Mirrors which are used to test the neurode. IC3SKVF0 J. Fortugno, R.J. Bolton Electrical Engineering MVL Coders This circuit is designed to test the encoding and decoding of a four level current mode MVL (multiple valued logic) signal for the integration of such circuits into digital logic designs. The circuit is comprised of essentially four basic modules (binary to MVL encoder, n_mirror, current level restorer, MVL to binary decoder). IC3SKVF1 J. Fortugno, R.J. Bolton Electrical Engineering MVL Standard Cells This circuit is designed to test each of the MVL standard cell designs. The layout provides a connection to every input and output of each of the unique cells currently existing in the MVL library. University of Toronto IC3TRAC1 C.P. Chong Electrical and Computer Engineering Motion sensing imager II This is a second generation motion sensing imager incorporating analog VLSI parallel-processing technique. IC3TRAC2 C.P. Chong Electrical and Computer Engineering Image motion sensor This chip is the product of our continuous research effort in the area of image processing using analog VLSI. IC3TRAC3 C.P. Chong Electrical and Computer Engineering Motion sensing imager II(b) The second of two designs, this chip is a second generation motion sensing imager incorporating analog VLSI parallel-processing technique. University of Windsor IC3WRONN Dino Bortolin, June Wang, Shakil Siddiq, Radha Venkatesan Department of Electrical Engineering Design and VLSI Implementation of An Intelligent Optical Sensor This chip is designed to recognize a set of twelve patterns projected onto its ten by ten element optical array. A hybrid analog/digital neural network with one hidden layer is employed to classify the input pattern. Recall times on the order of 300 ns are achieved.