| Bimetal Combination | Intermetallic Compounds Formed | Dominant Intermetallic Compounds |
| Gold-Aluminum (Au-Al) | Au5Al2, Au2Al, AuAl2, AuAl, Au4Al [Philosky, 1970; Philosky, 1971] | Au5Al2, Au2Al |
| Copper-Aluminum (Cu-Al) | CuAl2, CuAl, CuAl2, Cu9Al4 [Olsen and James, 1984; Pitt and Needes, 1981; Gershinskii, 1977; Campisano, 1978; Funamizu, and Watanabe, 1971] | CuAl2 |
| Gold-Silver (Au-Ag) | Large silver diffusion into the wire bulk along the wire length. Rapid silver surface diffusion resulted in depletion at bond periphery. [James, 1977] | |
| Copper-Gold (Cu-Au) | Cu3Au, CuAu, CuAu3 [Hall, 1975; Tu and Berry, 1972] | Cu3Au |