====Call for Papers - EMAP2005====

The 7th International Conference on Electronics Materials and Packaging will be held at Tokyo Institute of Technology, Japan. The former six conferences were held in Singapore (1999), Hong Kong  (2000), Korea (2001), Taiwan (2002), Singapore (2003) and Malaysia (2004) all of which were successful and have gained a reputation as a premier electronics materials and packaging conference in Asia Pacific where the bulk of the packaging activities are taking place.

The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. This will also provide an excellent opportunity for researchers and engineers to gather to discuss generic and practical applications and new directions.The organizing committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. Contributions are very welcome from industry participants and researchers from academic institutions. The topics of interests are specific to micro systems/MEMS, their packaging, electronics materials and reliability issues. Papers are being sought from, but not limited to, the following subjects:

• Automotive Electronics
• Chip-Scale Packaging/Flip Chip

• Electrical Modeling & Signal Integrity

• Green Materials

• High Density Displays

• High Density Packaging

• Interconnection Technologies

• Low Cost Packaging Methods

• Manufacturing Technologies

• Mechanical Modeling and Structural Integrity

• MEMS Packaging and Applications

• Microelectronic Materials & Processes

• No Flow Underfilling Process

• Optoelectronics/Photonics

• Polymer Materials & Microelectronic Applications

• Printed Wiring and Flex Boards

• Quality & Reliability

• Thermal Design, Analysis, and Characterization

• Electronic Inspection

• Thick & Thin Film Materials

• Wafer Scale Packaging

• Wireless Sensor Packaging & Applications

• Vibration on Electronic Devices

Submission of Abstract: June 30, 2005

Notification of Acceptance: July 31, 2005

Submission of Manuscript: September 30, 2005

Extended abstracts are invited to describe original and unpublished work. The extended abstract should be about 500 words starting clearly the purpose, methodology, results and conclusions of the work. Key references to prior publications and how the work enhances the existing knowledge should be included in the extended abstract. Authors are requested to designate appropriate areas for the purpose of abstract review. All submissions must be in English and should be made via the conference web site. The required file format is either MS Word or Adobe Acrobat PDF with only one single file for each submission.

[SELECTION OF PAPERS]

The Technical Committee of the 7th EMAP will select papers with

quality and originality for presentation at the Conference and for

publication in the Conference Proceedings. Only papers of those

authors who have paid the registration fee and intend to attend the

Conference will be published in the Conference Proceedings (Author

Registration).

[CONFERENCE SCHEDULE]

Sunday, December 11 Registration and welcome drink (evening)

Monday, December 12 Keynote Lectures Technical Sessions

Reception

Tuesday, December 13 Keynote Lectures Technical Sessions

Banquet/Student Reception

Wednesday, December 14 Technical Visit (full day)

[REGISTRATION FEE]

The registration fee covers the admission to all technical sessions, one copy of the proceedings and refreshments. Registration will start on August 1st and author registration must be made by September 30.

Regular On or before September 30: 35,000

After September 30: 40,000

Student On or before September 30: 20,000

After September 30: 25,000

(Currency: Yen)

[ACCOMMODATIONS]

A wide range of hotels near the conference site will be introduced to

the participants.

[KEYNOTE LECTURES]

Several leading experts in this field will be invited to give keynote

lectures on their current research topics.

[COMMITTEE]

General Chair

Prof. Kikuo KISHIMOTO Tokyo Institute of Technology, Japan

Co-Chairs

Prof. Mikio HORIE Tokyo Institute of Technology, Japan

Dr. Takashi KAWAKAMI Toshiba Corporation, Japan

Prof. Noriyuki MIYAZAKI Kyoto University, Japan

[SECRETARIAT]

All inquires concerning the conference should be addressed to:

Prof. Satoru AIHARA, Secretary General of EMAP2005

EMAP2005 Secretariat (I1-36)

Tokyo Institute of Technology

2-12-1 Ookayama, Meguro-ku, Tokyo 152-8552, JAPAN

Phone & Fax: +81-3-5734-2532

E-mail: info@emap2005.sms.titech.ac.jp

http://www.sms.titech.ac.jp/emap2005 (available from April, 2005)