The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. This will also provide an excellent opportunity for researchers and engineers to gather to discuss generic and practical applications and new directions. The organizing committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. Contributions are very welcome from industry participants and researchers from academic institutions. The topics of interests are specific to micro systems/MEMS, their packaging, electronics materials and reliability issues. Papers are being sought from, but not limited to, the following subjects:

 

·        Automotive Electronics

·        Chip-Scale Packaging/Flip Chip

·        Green Materials

·        High Density Displays

·        High Density Packaging

·        Interconnection Technologies

·        Low Cost Packaging Methods

·        MEMS Packaging and Applications

·        Microelectronic Materials & Processes

·        Modeling & Simulation

·        No Flow Underfilling Process

·        Optoelectronics/Photonics

·        Packaging Design, Modelling & Simulation

·        Polymer Materials & Microelectronic Applications

·        Power Packaging/Thermal Management

·        Printed Wiring and Flex Boards

·        Quality & Reliability

·        Thick & Thin Film Materials

·        Wafer Scale Packaging

·        Wireless Sensor Packaging & Applications