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17th International Conference on Electronics Materials and Packaging




Date

Tuesday, September 1, 2015
Friday, September 4, 2015

Venue

Portland, Oregon, USA

Engineering Building
Portland State University
1930 SW 4th Avenue
Portland, OR 97201-5304
USA
(View in Google Maps)

Call for Participation

Papers are being sought from, but not limited to the following subjects:
- Automotive Electronics
- Bio-MEMS
- 3D Packaging
- Green Materials
- High Density Packaging
- Interconnection Technologies
- LED Packaging
- Low Cost Packaging Methods
- MEMS Devices, MEMS Packaging and Applications
- Nano/Micro-electronic Materials & Processes
- Modeling & Simulation
- Optoelectronics/Photonics
- Packaging Design
- Pb-Free Solders and Emerging Interconnect Technologies
- Polymer Materials & Microelectronic Applications
- Power Device Packaging/Thermal Management
- Printed Wiring and Flex Boards
- Quality & Reliability
- Semiconductor Manufacutring Process & Development
- Testing
- Wafer Level Packaging
- Wearble Electronics


Abstract Submission

You are invited to submit your abstract for oral and poster presentations. Please fill out the abstract submission form by March 31, 2015.


Important Dates

May 31, 2015: Abstract Submission
June 15, 2015: Notice of Acceptance
July 31, 2015: Full Manuscript Due (Oral Presentation Only)
July 31, 2015: Registration/Hotel Accommodation


Student Paper & Poster Competitions

Entrants will be judged by Technical Committee members and the winner will receive a certificate and award. To be eligible for this award, the student must be the primary author of the paper and the work must have been performed while the author was a student. Students will present their papers during a regular technical session in an appropriate topic area. The scoring for the award will be equally based on written paper content or poster content and presentation.


Journal Publication

Selected manuscripts will be subsequently published in special issues of the international journals including Soldering and Surface Mount Technology.


Dinner Cruise at EMAP2015